FSUSB11 ONSEMI | Alldatasheet
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©2005 Fairchild Semiconductor Corporation www.fairchildsemi.com FSUSB11 Rev. 1.0.4 FSUSB11 — Low-Power, Full-Speed (12Mbps) Switch FSUSB11 — Low-Power, Full-Speed (12Mbps) Switch
Features
Space Saving MicroPak™ (1.6 x 2.1mm) USB 1.1 Signal Switching Compliant 3db Bandwidth: >350MHz Maximum 1.15Ω RON at 4.5V VCC and 4Ω for 2.7V Supply 0.3Ω Maximum RON Flatness for +5V Supply Broad VCC Operating Range: 1.65V to 5.5V Fast Turn-On and Turn-Off Time Break-Before-Make Enable Circuitry Over-Voltage Tolerant, TTL-Compatible Control Input
Applications
Cell Phones, PDAs, Digital Cameras, Notebook Computers
Description
The FSUSB11 is a high-performance, dual Single-Pole Double-Throw (SPDT) switch designed for switching USB 1.1 signals. The device features ultra-low on resistance (R ON) of 1.15 Ω maximum at 4.5V V CC and 4.3Ω at 2.7V supply. High bandwidth and ultra low (R ON) make this switch able to pass both USB low- and full- speed signal with minimum signal distortion. The device is fabricated with sub-micron CMOS technology to achieve fast switching speeds and designed for break- before-make operation. The select input is TTL-level compatible.
Ordering Information
FSUSB11L10X -40 to +85°C RoHS 10-Lead, Micr oPak™, JEDEC MO255,1.6 X 2.1mm Tape and Reel FSUSB11MTCX -40 to +85°C RoHS 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Tape and Reel For Fairchild’s definition of Eco Status, please visit: http://www.fairchildsemi.com/company/green/rohs_green.html. Figure 1. Block Diagram MicroPak™ is a trademark of Fairchild Semiconductor Corporation.
© 2005 Fairchild Semiconductor Corporation www.fairchildsemi.com FSUSB11 Rev. 1.0.4 3 FSUSB11 — Low-Power, Full-Speed (12Mbps) Switch Absolute Maximum Ratings Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol Parameter Min. Max. Unit VCC Supply Voltage -0.5 6.0 V VS Switch Voltage -0.5 V CC + 0.5 V VIN Input Voltage(1) -0.5 6.0 V IIK Input Diode Current -50 mA ISW Switch Current 200 mA ISWPEAK Peak Switch Current (Pulsed at 1ms Duration, <10% Duty Cycle) 400 mA TSTG Storage Temperature Range -65 +150 °C TJ Maximum Junction Temperature +150 °C TL Lead Temperature (Soldering, 10 Seconds) +260 °C ESD Human Body Model, JESD22-A114 8 kV Note: 1. The input and output negative voltage ratings may be ex ceeded if the input and output diode current ratings are observed. Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ens ure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to Absolute Maximum Ratings. Symbol Parameter Min. Max. Unit VCC Power Supply 1.65 5.50 V VIN Control Input Voltage (2) 0 VCC V CC VSW Switch Input Voltage 0 V CC V CC TA Operating Temperature -40 +85 °C Note: 2. Unused inputs must be held HIGH or LOW. They may not float.
© 2005 Fairchild Semiconductor Corporation www.fairchildsemi.com FSUSB11 Rev. 1.0.4 4 FSUSB11 — Low-Power, Full-Speed (12Mbps) Switch Unless otherwise specified, typical values are at +25°C. Symbol Parameter Conditions VCC (V) TA=+25°C TA=-40 to +85°C Units VIH Input Voltage High 2.7 to 3.6 2.0 V 4.5 to 5.5 4.0 VIL Input Voltage Low 2.7 to 3.6 V 4.5 to 5.5 IIN Control Input Leakage V IN=0V to VCC 2.7 to 3.6 µA 4.5 to 5.5 INO(OFF), INO(OFF) Off-Leakage Current of Port D1 and D2 A=1V, 4.5V, B0 or B1=1V, 4.5V 5.5 -50 50 -100 100 nA IA(ON) On-Leakage Current of Port D A=1V, 4.5V, B0 or B1=1V, 4.5V or Floating 5.5 50 50 -100 100 nA RON Switch On Resistance(3) Micropak IOUT= 100mA, Ω IOUT= 100mA, TSSOP IOUT= 100mA, D1 or D2=1.5V 2.7 2.80 4.50 IOUT= 100mA, D1 or D2=3.5V 4.5 1.50 3.00 ΔRON On Resistance Matching Between Channel(4) Micropak IOUT= 100mA, D1 or D2=3.5V 4.5 0.06 0.12 0.15 Ω TSSOP 0.07 0.30 RFLAT(ON) On Resistance Flatness (5) IOUT=100mA, D1 or Ω IOUT=100mA, B0 or B1=0V, 1V, 2V 4.5 0.2 0.3 0.4 ICC Quiescent Supply Current VIN=0V or VCC, IOUT=0 3.6 0.1 0.5 1.0 µA 5.5 0.1 0.5 1.0 Notes: 3. On resistance is determined by the voltage drop betw een D and Dn pins at the indicated current through the switch. 4. ΔRON = RONmax - RONmin measured at identical VCC, temperature, and voltage. 5. Flatness is defined as the difference between the maximum and minimum value of on resistance over the specified range of conditions.
© 2005 Fairchild Semiconductor Corporation www.fairchildsemi.com FSUSB11 Rev. 1.0.4 5 FSUSB11 — Low-Power, Full-Speed (12Mbps) Switch Unless otherwise specified, typical values are at +25°C. Symbol Parameter Conditions V CC (V) TA =+25°C TA =-40 to +85°C Units Figure tON Turn-on Time S-to-Bus B D1 or D2=1.5V, RL=50Ω, CL=35pF 2.7 to 3.6 50 60 ns Figure 5 D1 or D2=3.0V, RL=50Ω, CL=35pF 4.5 to 5.5 35 30 tOFF Turn-off Time S-to-Bus B D1 or D2=1.5V, RL=50Ω, CL=35pF 2.7 to 3.6 20 20 ns Figure 5 D1 or D2=3.0V, RL=50Ω, CL=35pF 4.5 to 5.5 15 tBBM Break-Before-Make Time D1 or D2=1.5V, RL=50Ω, CL=35pF 2.7 to 3.6 1 ns Figure 6 D1 or D2=3.0V, RL=50Ω, CL=35pF 4.5 to 5.5 20 1 Q Charge Injection CL=1.0nF, VGEN=0V, RGEN=0Ω 2.7 to 3.6 20 pC Figure 8 4.5 to 5.5 10 OIRR Off Isolation f=1MHz, RL=50Ω 2.7 to 3.6 -70 dB Figure 7 4.5 to 5.5 -70 XTALK Non-Adjacent Channel Crosstalk f=1MHz, RL=50Ω 2.7 to 3.6 -75 dB Figure 7 4.5 to 5.5 -75 BW -3dB Bandwidth RL=50Ω 2.7 to 3.6 350 MHz Figure 10 4.5 to 5.5 350 USB Related AC Electrical Characteristics Unless otherwise specified, typical values are at 25°C. Symbol Parameter Conditions V CC (V) TA =+25°C Units Figure Min. Typ. Max. tSK(O) Skew RS=39, CL=50pF, tR=tF=12ns at 12Mbps 2.7 to 3.6 0.15 ns Figure 11 4.5 to 5.5 0.15 tSK(P) Rising/Fall Time Mismatch (Duty Cycle=50%) 2.7 to 3.6 30 ps Figure 12 4.5 to 5.5 20 TJ Total Jitter RS=39, CL=50pF, tR=tF=12ns at 12Mbps (PRBS=215 1) 2.7 to 3.6 1.7 ps Figure 12 4.5 to 5.5 1.6 Capacitance Symbol Parameter Conditions V CC (V) TA =+25°C Units Figure Min. Typ. Max. CIN Control Pin Input Capacitance f=1MHz 0.0 3.5 pF Figure 9 COFF D n Port Off Capacitance f=1MHz 4.5 12.0 pF Figure 9 CON D Port On Capacitance f=1MHz 4.5 40.0 pF Figure 9
REGISTRATION MO-255, VARIATION UABD . B. DIMENSIONS ARE IN MILLIMETERS. E. DRAWING FILENAME: MKT-MAC10Arev5.
0.10 CAB
0.55 MAX
1.62 KEEPOUT ZONE, NO TRACES
Figure 13. 10-Lead, MicroPak™, JEDEC MO255,1.6 X 2.1mm the warranty therein, which covers Fairchild products. http://www.fairchildsemi.com/packaging/. http://www.fairchildsemi.com/products/logic/pdf/micropak_tr.pdf.
0.43 TYP
Figure 14. 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide the warranty therein, which covers Fairchild products.
© 2005 Fairchild Semiconductor Corporation www.fairchildsemi.com FSUSB11 Rev. 1.0.4 10 FSUSB11 — Low-Power, Full-Speed (12Mbps) Switch
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