FSRV05-4 FUTUREWAFER | Alldatasheet

Document overview

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Technical content

Maximum Ratings@25 unless otherwise specified Parameter Symbol Value Units Peak pulse power (tp=8/20us) see fig 1. PPP 350 Watts Operating Temperature TJ -55~150 °C Storage Temperature TSTG -55~150 °C Peak Pulse Current(tp=8/20us) IPP 12 A Electrostatic Discharge VESD >8(Contact) >15(Air) KV FSRV05-4 Ultra Low Capacitance ESD array

Applications

  • Personnal Digital Assistance
  • Wireless System
  • DVI
  • High Speed Data Line
  • Ethernet
  • USB 2.0 Power and Data line Protection Feature
  • With TVS Diode
  • ESD Protection:Level 4
  • Low clamping voltage
  • 350 Watts peak pulse power per line(tp=8/20uS)
  • Ultra low capacitance:3pf max.(any I/O to GND.)
  • Protection 4 lines I/O port IEC Compatibility
  • EN61000-4
  • 61000-4-2(ESD):LeveL 4,Contact:±8kv,Air::±15kv
  • 61000-4-5(Surge):12A,8/20us Mechanical Characteristics
  • Molded JEDEC SOT23-6L package
  • Packing: Tape and Reel
  • Flammability rating UL 94V-0
  • Halogen Free Device Characteristics Pin Identification 1,3,4,6 Input lines

5 VCC IN

2 Ground

Futurewafer Technology Co., Ltd E1606F6A-STD-FW-002

Parameter Symbol Condition Min. Typ. Max. Units Reverse Stand-off Voltage VRWM Pin 5 to 2 5 V Reverse Breakdown Voltage VBR IZ=1mA Pin5 to 2 6.1 8.5 V Reverse Leakage Current IR Pin 5 to Pin 2. 5 uA Forward Voltage VF IF=15mA 1.15 V Clamping Voltage IPP=1A tp=8/20us 12 V VC IPP=12A tp=8/20us 30 V Junction Capacitance C I/O Pin capacitance to GND.Vdc=0V,f=1MHZ 3 5 pf Junction Capacitance C I/O-I/O Vdc=0V,f=1MHZ 1.5 pf FSRV05-4 Ultra Low Capacitance ESD array

Electrical Characteristics

Rating and characteristic curve Futurewafer Technology Co., Ltd E1606F6A-STD-FW-002

Ordering information

Ultra Low Capacitance ESD array Part Number Component Package Quantity Packaging Option FSRV05-4 SOT23-6L 3,000 Tape&reel-8mm tape / 7”reel

Package information

A - - 1.30 A1 0.04 0.07 0.10 A2 1.05 1.10 1.15 A3 0.63 0.65 0.68 b 0.36 - 0.50 b1 0.36 0.38 0.45 c 0.14 - 0.20 c1 0.14 0.15 0.16 D 2.82 2.87 2.90 E 2.65 2.80 2.95 E1 1.56 1.62 1.64 e 0.93 0.95 0.98 e1 1.85 1.90 1.95 L 0.40 0.45 0.50 L1 0.59 REF L2 0.25 BSC Unit : mm Futurewafer Technology Co., Ltd E1606F6A-STD-FW-002

Futurewafer Technology Co., Ltd 台灣未來芯航電股份有限公司 Tel ：+886-3-3573583/Tel ：+886-3-3574065 Futurewafer.com.tw 桃園市桃園區中正路 987 巷50 弄 2 號 FSRV05-4 Ultra Low Capacitance ESD array Pad Layout Futurewafer Technology Co., Ltd E1606F6A-STD-FW-002