FSL136HR ONSEMI | Alldatasheet
Document overview
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- PDF pages: 15
Technical content
Features
- Internal Avalanche−Rugged SENSEFET (650 V)
- Under 50 mW Standby Power Consumption at 265 Vac, No−load Condition with Burst Mode
- Precision Fixed Operating Frequency with Frequency Modulation for Attenuating EMI
- Internal Startup Circuit
- Built−in Soft−Start: 20 ms
- Pulse−by−Pulse Current Limit
- Various Protection: Over V oltage Protection (OVP), Overload Protection (OLP), Output−Short Protection (OSP), Abnormal Over−Current Protection (AOCP), Internal Thermal Shutdown Function with Hysteresis (TSD)
- Auto−Restart Mode
- Under−V oltage Lockout (UVLO)
- Low Operating Current: 1.8 mA
- Adjustable Peak Current Limit
Table 1. MAXIMUM OUTPUT POWER (Note 1)
230 Vac /C0043 15% (Note 2) 85−265 Vac
19 W 26 W 14 W 20 W
- The junction temperature can limit the maximum output power.
- 230 Vac or 100/115 Vac with doubler.
- Typical continuous power in a non −ventilated enclosed adapter
ORDERING INFORMATION
Applications
- SMPS for VCR, STB, DVD & DVCD Players
- SMPS for Home Appliance
- Adapter Related Resources
- https://www.onsemi.com/pub/Collateral/ AN−4137.pdf.pdf
- https://www.onsemi.com/pub/Collateral/ AN−4141.pdf.pdf
- https://www.onsemi.com/PowerSolutions/ home.do PDIP8 GW CASE 709AJ FSL136HR
Figure 3. Pin Configuration 1 GND Ground. SENSEFET source terminal on the primary side and internal control ground. the internal startup switch opens and device power is supplied via the auxiliary transformer winding. sient conditions, but still allows the protection mechanism to operate under true overload conditions. 650 V. Minimizing the length of the trace connecting these pins to the transformer decreases leakage inductance.
www.onsemi.com ABSOLUTE MAXIMUM RATINGS (continued)(TJ = 25°C unless otherwise specified) (continued) Symbol UnitMaxMinParameter /C0081JA Junction−to−Ambient Thermal Resistance (Note 7, 8) − 80 °C/W /C0081JC Junction−to−Case Thermal Resistance (Note 7, 9) − 19 /C0081JT Junction−to−Top Thermal Resistance (Note 7, 10) − 33.7 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 4. Repetitive rating: pulse width limited by maximum junction temperature. 5. L = 51 mH, starting T J = 25°C. 6. Meets JEDEC standards JESD 22 −A114 and JESD 22−C101. 7. All items are tested with the standards JESD 51 −2 and JESD 51−10. 8. /C0081JA free−standing, with no heat−sink, under natural convection. 9. /C0081JC junction−to−lead thermal characteristics under /C0081JA test condition. TC is measured on the source #7 pin closed to plastic interface for /C0081JA thermo−couple mounted on soldering. 10./C0081JT junction−to−top of thermal characteristic under /C0081JA test condition. Tt is measured on top of package. Thermo−couple is mounted in epoxy glue. ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise specified) Symbol Parameter Test Condition Min Typ Max Unit SENSEFET SECTION BVDSS Drain−Source Breakdown Voltage VCC = 0 V, ID = 250 /C0109A 650 − − V IDSS Zero Gate Voltage Drain Current VDS = 650 V, VGS = 0 V − − 250 /C0109A RDS(ON) Drain−Source On−State Resistance VGS = 10 V, VGS = 0 V, TC = 25°C − 3.5 4.0 /C0087 CISS Input Capacitance VGS = 0 V, VDS = 25 V, f = 1MHz − 290 − pF COSS Output Capacitance VGS = 0 V, VDS = 25 V, f = 1MHz − 45 − pF CRSS Reverse Transfer Capacitance VGS = 0 V, VDS = 25 V, f = 1MHz − 5.5 − pF td(on) Turn−on Delay VDD = 350 V, ID = 3.5 A − 12 − ns tr Rise Time VDD = 350 V, ID = 3.5 A − 22 − ns td(off) Turn−off Delay VDD = 350 V, ID = 3.5 A − 20 − ns tf Fall Time VDD = 350 V, ID = 3.5 A − 19 − ns CONTROL SECTION fOSC Switching Frequency VDS = 650 V, VGS = 0 V 90 100 110 kHz /C0068fOSC Switching Frequency Variation VGS = 10 V, VGS = 0 V, TC = 125°C − ±5 ±10 % fFM Frequency Modulation − ±3 − kHz DMAX Maximum Duty Cycle VFB = 4 V 71 77 83 % DMIN Minimum Duty Ratio VFB = 0 V 0 0 0 % VSTART UVLO Threshold Voltage 11 12 13 V VSTOP After Turn−on 7.0 8.0 9.0 V IFB Feedback Source Current VFB = 0 320 400 480 /C0109A tS/S Internal Soft−Start Time VFB = 4 V 15 20 25 ms BURST−MODE SECTION VBURH Burst−Mode Voltage TJ = 25°C 0.4 0.5 0.6 V VBURL 0.25 0.35 0.45 V VBURH(HYS) − 150 − mV PROTECTION SECTION ILIM Peak Current Limit TJ = 25°C, di/dt = 300 mA//C0109s 1.89 2.15 2.41 A tCLD Current Limit Delay Time (Note 11) 200 − − ns VSD Shutdown Feedback Voltage VCC = 15 V 5.5 6.0 6.5 V
www.onsemi.com ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise specified) (continued) Symbol UnitMaxTypMinTest ConditionParameter PROTECTION SECTION IDELAY Shutdown Delay Current VFB = 5 V 3.5 5.0 6.5 /C0109A VOVP Over−Voltage Protection Threshold VFB = 2 V 22.5 24.0 25.5 V tOSP Output Short Protection (Note 11) Threshold Time TJ = 25°C OSP Triggered when tON < tOSP & VFB > VOSP, which lasts longer than tOSP_FB − 1.00 1.35 /C0109s VOSP Threshold Feedback Voltage 1.44 1.60 − V tOSP_FB Feedback Blanking Time 2.0 2.5 − /C0109s VAOCP AOCP Voltage (Note 11) TJ = 25°C 0.85 1.00 1.15 V TSD Thermal Shutdown (Note 11) Shutdown Temperature 125 137 150 °C HYSTSD Hysteresis − 60 − °C tLEB Leading−Edge Blanking Time (Note 11) 300 − − ns TOTAL DEVICE SECTION IOP1 Operating Supply Current (Note 11) (While Switching) VCC = 14 V, VFB > VBURH − 2.5 3.5 mA IOP2 Operating Switching Current, (Control Part Only) VCC = 14 V, VFB < VBURL − 1.8 2.5 mA ICH Startup Charging Current VCC = 0 V 0.9 1.1 1.5 mA VSTR Minimum VSTR Supply Voltage VCC = VFB = 0 V, VSTR Increase 35 − − V Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 11. Though guaranteed by design, it is not 100% tested in production. Part Number Operating Temperature Range Top Mark Package Packing Method† FSL136HR −40 to 105 °C FSL136HR 8−Lead, Dual Inline Package (DIP) Rail FSL136HRL 8−Lead, Surface Mount Package (LSOP) Rail FSL136HRLX Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
Figure 17. Pulse−Width−Modulation Circuit protection circuit should be activated to protect the SMPS. situation or a true overload situation. Figure 18. The shutdown delay is the time required to charge CFB from 2.4 V to 6 V with 5 /C0109A current source. Figure 18. Overload Protection (OLP) Figure 19. When the gate turn −on signal is applied to the Figure 19. Abnormal Over−Current Protection
24 V , OVP circuit is activated, resulting in termination of
Figure 23. Peak Current Limit Adjustment
PDIP8 9.42x6.38, 2.54P CASE 646CM ISSUE O DATE 31 JUL 2016
5.08 MAX
0.33 MIN
(0.56) 3.683 3.200 3.60 3.00 2.54 1.65 1.27 7.62 0.560 0.355 9.83 9.00 6.670 6.096 9.957 7.870 0.356 0.200 8.255 7.610 7.62 SIDE VIEW NOTES: A. CONFORMS TO JEDEC MS−001, VARIATION BA B. ALL DIMENSIONS ARE IN MILLIMETERS C. DIMENSIONS ARE EXCLUSIVE OF BURRS, MOLD FLASH, AND TIE BAR EXTRUSIONS D. DIMENSIONS AND TOLERANCES PER ASME Y14.5M−2009 FRONT VIEW TOP VIEW MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. 98AON13468GDOCUMENT NUMBER: DESCRIPTION: Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1PDIP8 9.42X6.38, 2.54P © Semiconductor Components Industries, LLC, 2019 www.onsemi.com
http://onsemi.com © Semiconductor Components Industries, LLC, 2002 October, 2002 − Rev. 0 Case Outline Number: XXX DOCUMENT NUMBER: STATUS: NEW STANDARD: DESCRIPTION: 98AON13756G ON SEMICONDUCTOR STANDARD PDIP8 GW Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 2
DOCUMENT NUMBER: 98AON13756G PAGE 2 OF 2 ISSUE REVISION DATE O RELEASED FOR PRODUCTION FROM FAIRCHILD MKT−MLSOP08A TO ON SEMICONDUCTOR. REQ. BY D. TRUHITTE.
31 JAN 2017
© Semiconductor Components Industries, LLC, 2017 January, 2017 − Rev. O Case Outline Number: 709AJ ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
www.onsemi.com ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries i n the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property . A listing of ON Semiconductor’s product/patent ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, reg ulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the right s of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION TECHNICAL SUPPORT North American Technical Support: Voice Mail: 1 800−282−9855 Toll Free USA/Canada Phone: 011 421 33 790 2910 LITERATURE FULFILLMENT: Email Requests to: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com Europe, Middle East and Africa Technical Support: Phone: 00421 33 790 2910 For additional information, please contact your local Sales Representative