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Series: FSI 1,00 mm One Piece Interface Revision: D Date: October 30, 2015 © Samtec, Inc. Page 1 FSI Series – 3 mm Body Height, Double Row Other configurations available for: Taller body heights. Single row. Threaded inserts, alignment pins, pick & place pads and packaging options. See www.samtec.com for more information.
Series: FSI 1,00 mm One Piece Interface Revision: D Date: October 30, 2015 © Samtec, Inc. Page 2
1.0 SCOPE
1.1 This specification covers performance, testing and quality requirements for Samtec FSI Series 1,00 mm pitch One Piece Interface. This one piece interface is available in single and double row configurations for 3 mm, 6 mm, and 10 mm board stacking applications. All information contained in this specification is for a 3 mm body height, double row configuration unless otherwise noted.
2.0 DETAILED INFORMATION
2.1 Product prints, footprints, catalog pages, test reports and other specific, detailed information can be found at www.samtec.com?FSI.
3.0 TESTING
3.1 Current Rating: 2.0A
3.2 Voltage Rating: 220 VAC
3.3 Operating Temperature Range: -55°C to +125°C
3.4 Electrical:
ITEM TEST CONDITION REQUIREMENT STATUS Withstanding Voltage EIA-364-20 (No Flashover, Sparkover, or Breakdown) 650 VAC Pass Insulation Resistance EIA-364-21 (1000 MΩ minimum) 6,000 MΩ Pass Contact Resistance (LLCR) EIA-364-23 Δ 15 mΩ maximum (Samtec defined)/ No damage Pass
3.5 Mechanical:
ITEM TEST CONDITION REQUIREMENT STATUS Durability EIA-364-09C 100 cycles (w/Env.) 10,000 cycles (w/o Env) Pass Random Vibration EIA-364-28 Condition V, Letter B
7.56 G 'RMS', 50 to 2000 Hz, 2
hours per axis, 3 axis total , PSD 0.04 Visual Inspection: No Damage LLCR: Δ 15 mΩ maximum Event Detection: No interruption > 50 nanoseconds Pass Mechanical Shock EIA-364-27 100 G, 6 milliseconds, sawtooth wave, 11.3 fps, 3 shocks/direction, 3 axis (18 total shocks) Visual Inspection: No Damage LLCR: Δ 15 mΩ maximum Event Detection: No interruption > 50 nanoseconds Pass Normal Force EIA-364-04 30 grams minimum for gold interface Pass
Series: FSI 1,00 mm One Piece Interface Revision: D Date: October 30, 2015 © Samtec, Inc. Page 3
3.6 Environmental:
ITEM TEST CONDITION REQUIREMENT STATUS Thermal Shock EIA-364-32 Thermal Cycles: 100 (30 minute dwell) Hot Temp: +85°C Cold Temp: -55°C Hot/Cold Transition: Immediate Visual Inspection: No Damage LLCR: Δ 15 mΩ DWV: 650 VAC IR: >6,000 MΩ Pass Thermal Aging (Temp Life) EIA-364-17 Test Condition 4 @ 105°C Condition B for 250 hours Visual Inspection: No Damage LLCR: Δ 15 mΩ DWV: 650 VAC IR: >6,000 MΩ Pass Cyclic Humidity EIA-364-31 Test Temp: +25°C to +65°C Relative Humidity: 90 to 95% Test Duration: 240 hours Visual Inspection: No Damage LLCR: Δ 15 mΩ DWV: 650 VAC IR: >6,000 MΩ Pass Gas Tight EIA-364-36 Gas Exposure: Nitric Acid Vapor Duration: 60 min. Drying Temp.: 50°C +/- 3°C Measurements: Within 1 hour of Exposure LLCR: Δ 15 mΩ Pass
Series: FSI 1,00 mm One Piece Interface Revision: D Date: October 30, 2015 © Samtec, Inc. Page 4 4.0 NORMAL FORCE vs. BODY HEIGHT FSI Height Max B2B for 30 Grams Normal Force (inches) Deflection Range (inches) mm inch 3 0.118 0.129 0.011 6 0.236 0.247 0.011 10 0.394 0.405 0.011
5.0 HIGH SPEED PERFORMANCE
5.1 Based on a 3 dB insertion loss
5.2 System Impedance: 50 ohm for single-ended and 100 ohm for differential pair
Stack Height Single-Ended Signaling Differential Pair Signaling 3mm 8 GHz / 16 Gbps 12 GHz / 24 Gbps 6mm 7.50 GHz / 15 Gbps 7.50 GHz / 15 Gbps 10mm 5 GHz / 10 Gbps 6 GHz / 12 Gbps
6.0 PROCESSING RECOMMENDATIONS
6.1 Mating Requirements: The mating card should be mated vertically to the connector. 6.1.1
Series: FSI 1,00 mm One Piece Interface Revision: D Date: October 30, 2015 © Samtec, Inc. Page 5 6.2 Due to variances in equipment, solder pastes and applications (board design, component density, etc.), Samtec does not specify a recommended reflow profile for our connectors. The processing parameters provided by the solder paste manufacturer should be employed and can usually be found on their website. All of Samtec’s surface mount components are lead free reflow compatible and compliant with the profile parameters detailed in IPC/JEDEC J-STD-020E which requires that components be capable of withstanding a peak temperature of 260°C as well as 30 seconds above 255°C. Samtec Recommended Temperature Profile Ranges (SMT) Sn-Pb Eutectic Assembly Preheat/Soak (100°C-150°C) Max Ramp Up Rate Reflow Time (above 183°C) Peak Temp Time within 5°C of 235°C Max Ramp Down Rate Time 25°C to Peak Temp Pb-Free Assembly Preheat/Soak (150°C-200°C) Max Ramp Up Rate Reflow Time (above 217°C) Peak Temp Time within 5°C of 260°C Max Ramp Down Rate Time 25°C to Peak Temp 6.2.1 These guidelines should not be considered design requirements for all applications. Samtec recommends testing interconnects on your boards in your process to guarantee optimum results. 6.3 Maximum Reflow Passes: The parts can withstand three reflow passes at a maximum component temperature of 260°C.
Series: FSI 1,00 mm One Piece Interface Revision: D Date: October 30, 2015 © Samtec, Inc. Page 6 6.4 Stencil Thickness: The recommended stencil thickness is .006” (0,15 mm). 6.5 Placement: Machine placement of the parts is recommended. 6.6 Reflow Environment: Samtec recommends the use of a low level oxygen environment (typically achieved through Nitrogen gas infusion) in the reflow process to improve solderability. 6.7 Plating: Plating for the mating card to be .000030 inches gold with hardness of 120-200 knoop per ASTM B 488 Type 2, Grade C. 6.8 Hardware: Board-to-board standoffs are recommended to provide a robust mechanical connection. Samtec’s wide variety of standoff options can be found here: SO - Board Stacking Standoff. 6.9 Stiffeners: It is recommended that a stiffener be used to maintain flatness of the mating card. 6.10 Note: Applications requiring 40 – 50 positions without threaded inserts, please contact Samtec Interconnect Processing Group at ipg@samtec.com. 6.11 Cleaning: Samtec has verified that our connectors may be cleaned in accordance with the solvents and conditions designated in the EIA-364-11A standard.
7.0 ADDITIONAL RESOURCES
7.1 For additional mechanical testing or product information, contact our Customer Engineering Support Group at CES@samtec.com
7.2 For additional information on high speed performance testing, contact our Signal Integrity Group at
SIG@samtec.com 7.3 For additional processing information, contact our Interconnect Processing Group at IPG@samtec.com.
7.4 For RoHS, REACH or other environmental compliance information, contact our Product Environmental
Compliance Group at PEC@samtec.com USE OF PRODUCT SPECIFICATION SHEET This Product Specification Sheet (“PSS”) is a brief summary of information related to the Product identified. As a summary, it should only be used for the limited purpose of considering the purchase/use of Product. For specific, detailed information, including but not limited to testing and Product footprint, refer to Section 2.0 of this document and the links there provided to test reports and prints. This PSS is the property of Samtec, Inc. (“Samtec”) and contains proprietary information of Samtec, our various licensors, or both . Samtec does not grant express or implied rights or license under any patent, copyright, trademark or other p roprietary rights and the use of the PSS for building, reverse engineering or replication is strictly prohibited. By using the PSS, the user agrees to not infring e, directly or indirectly, upon any intellectual property rights of Samtec and acknowledges th at Samtec, our various licensors, or both own all intellectual property therein. The PSS is presented “AS IS”. While Samtec makes every effort to present excellent information, the PSS is only provided as a guideline and does not, therefore, warrant it is without error or defect or that the PSS contains all necessary and/or relevant information about the Product. The user agrees that all access and use of the PSS is at its own risk. NO WARRANTIES EXPRESSED OR IMPLIED, INCLUDING ANY WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR OF ANY KIND WHATSOEVER ARE PROVIDED.