FSD0325D FUTUREWAFER | Alldatasheet

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Technical content

Extra Small Package ESD Protection Device Document Number:F11910S 03-Mar-2021 V 2.0 www.futurewafer.com.tw DFN-0603 5. Device Characteristics 1. Applications

  • Lan equipment
  • Video
  • DVI
  • High Speed Data Line
  • Ethernet
  • USB 2.0 Power and Data line Protection
  • Smart Phone 2. Feature List
  • Max Operating Voltage VRWM:3.3V
  • ESD Protection:Level 4
  • Low Clamping Voltage
  • 48 Watts Peak Pulse Power Per Line (tp=8/20uS)
  • Ultra Low Capacitance:5pf typ.
  • Protection one Line I/O port Maximum Ratings@25°C Unless Otherwise Specified Parameter Symbol Value Units Peak Pulse Power (tp=8/20us) P PP 48 Watts Operating Temperature T J °C -55 ~150 Storage Temperature T STG 3. IEC Compatibility
  • EN61000-4
  • 61000-4-2(ESD):Level 4,Contact:±8KV,Air:±15KV
  • 61000-4-5(Surge):4A-8/20us 4. Mechanical Characteristics
  • Molded JEDEC DFN-0603 Package
  • Packing: Tape and Reel
  • Flammability Rating UL 94V-0
  • Halogen Free
  • JEDEC MSL Classification :Level 1 Parameter Symbol Test Condition Min Typ Max Units Reverse Stand-off Voltage V RWM Pin 2 to 1/Pin 1 to 2 - - 3.3 V Holding Voltage V H ISB = 50mA,Pin to Pin 2.8 - - Trigger Voltage V TH IPT = 2uA,Pin to Pin 3.5 - - V C IPP = 1A tp = 8/20us - - 9.0 Clamping Voltage IPP = 4A tp = 8/20us - - 12.0 Reverse Leakage Current I R @ VRWM - - 0.5 uA Peak Pulse Current I PP Tp = 8/20us - - 4 A Junction Capacitance C I/O Pin capacitance to GND. Vdc = 0V,f = 1MHZ - 5 7 pf 6. Electrical Characteristics

Extra Small Package ESD Protection Device Document Number:F11910S 03-Mar-2021 V 2.0 www.futurewafer.com.tw 7. Electrical Characteristics TA=(25°C) VSB ISB IPP VC I PP Peak Pulse Current I SB Snap Back Test Current V c Clamping Voltage V SB Snap Back Voltage

Extra Small Package ESD Protection Device Document Number:F11910S 03-Mar-2021 V 2.0 www.futurewafer.com.tw 8. Rating and Characteristic Curve Fig. 1 Non-Repetitive Peak Pulse Power V.S Pulse Time Peak Pulse Power (kw) td-Pulse Width(us) 48W,8/20µS Fig. 3 Power Derating Curve % of Rated Power Ambient Temp,TA(°C) Fig. 2 V C & I PP Drawing Peak pulse current，IPP (A) Clamping Voltage ,V C (V) Waveform parameter tr=8us td=20us Time (us) Percent of IPP Fig. 4 Pulse Waveform Fig. 5 Capacitance VS Reverse Voltage Capacitance,Cj,Pf Reverse Working Voltage VR,V f=1MHZ,TA=25°C

Extra Small Package ESD Protection Device Document Number:F11910S 03-Mar-2021 V 2.0 www.futurewafer.com.tw 9. Soldering Parameters

Extra Small Package ESD Protection Device Document Number:F11910S 03-Mar-2021 V 2.0 www.futurewafer.com.tw 10. Package Information 11. Suggest Pad Layout Unit:mm Unit:mm 0.300 .24

Extra Small Package ESD Protection Device Document Number:F11910S 03-Mar-2021 V 2.0 www.futurewafer.com.tw 12. Tape & Reel Information

Extra Small Package ESD Protection Device Document Number:F11910S 03-Mar-2021 V 2.0 www.futurewafer.com.tw 14. History Version Date File No. Recording Basis A 03-Jan-2019 New Create Market F11910S 2.0 03-Mar-2021 Update Version System Futurewafer Technology Co.,Ltd 台灣未來芯科技股份有限公司 Tel ：+886-3-3350161/FAX ：+886-3-3350172 cherry@futurewafer.com.tw No. 286-14, Sec. 3, Sanmin Rd., Taoyuan Dist., Taoyuan City 330, Taiwan 13. Ordering Information Part No. Marking Quantity FSD0325D X1 10,000pcs/7” Reel