FSCM0765R FAIRCHILD | Alldatasheet

Document overview

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Technical content

Features

  • Internal Avalanche Rugged SenseFET
  • Low Start-up Current (max 40uA)
  • Low Power Consumption under 1 W at 240V AC and 0.4W Load
  • Precise Fixed Operating Frequency (66kHz)
  • Frequency Modulation for low EMI
  • Pulse by Pulse Current Limiting (Adjustable)
  • Over V oltage Protection (OVP)
  • Over Load Protection (OLP)
  • Thermal Shutdown Function (TSD)
  • Auto-Restart Mode
  • Under V oltage Lock Out (UVLO) with Hysteresis
  • Built-in Soft Start (15ms) Application
  • SMPS for VCR, SVR, STB, DVD and DVCD
  • Adaptor
  • SMPS for LCD Monitor Related Application Notes
  • AN-4137: Design Guidelines for Off-line Flyback Converters Using Fairchild Power Switch (FPS)
  • AN-4140: Transformer Design C onsideration for off-line Flyback Converters using Fairchild Power Switch
  • AN-4141: Troubleshooting and Design Tips for Fairchild Power Switch Flyback Applications
  • AN-4148: Audible Noise Reduction Techniques for FPS

Applications

Description

The FSCM0765R is an integrated Pulse Width Modulator (PWM) and SenseFET specifically designed for high performance offline Switch Mode Power Supplies (SMPS) with minimal external components. This device is an integrated high voltage power switching regulator which combines an avalanche rugged SenseFET with a current mode PWM control block. The PWM controller includes integrated fixed frequency oscillator, under voltage lockout, leading edge blanking (LEB), optimized gate driver, internal soft start, temperature compensated precise current sources for a loop compensation, and self protection circuitry. Compared with a discrete MOSFET and PWM controller solution, it can reduce total cost, component count, size , and weight while simultaneously increasing efficiency, productivity, and system reliability. This device is a basic platform well suited for cost effective designs of flyback converters. Table 1. Maximum Output Power

  1. Typical continuous power in a non-ventilated enclosed

adapter measured at 50°C ambient.

  1. Maximum practical continuous power in an open-frame
  2. 230 VAC or 100/115 VAC with doubler.

Figure 1. Typical Flyback Application

Figure 2. Functional Block Diagram of FSCM0765R

Figure 3. Pin Configuration (Top View)Absolute Maximum Ratings 2 GND This pin is the control ground and the SenseFET source. power is supplied from the auxiliary transformer winding.

4 Feedback (FB)

This pin is internally connected to the inverting input of the PWM comparator. . This pin is not connected. left floating, the typical current limit will be 3.0A.

(Ta=25°C, unless otherwise specified.) Notes: 1. Tj = 25°C to 150°C 2. Repetitive rating: Pulse width limited by maximum junction temperature. Thermal Impedance Note: 1. Free standing with no heat-sink under natural convection 2. Infinite cooling condition - Refer to the SEMI G30-88. Parameter Symbol Value Unit Drain-Source (GND) Voltage (1) VDSS 650 V Drain-Gate Voltage (RGS=1MΩ)V DGR 650 V Gate-Source (GND) Voltage V GS ±30 V Drain Current Pulsed (2) IDM 21 A DC Continuous Drain Current (D2-PAK, I2-PAK) @ Tc = 25°C I D 5.3 A DC @ Tc =100°CI D 3.4 A DC Continuous Drain Current (TO-220) @ Tc = 25°C I D 7A DC @ Tc =100°CI D 4.4 A DC Supply Voltage V CC 20 V Analog Input Voltage Range V FB -0.3 to VCC V Total Power Dissipation (D2-PAK,I2-PAK) P D 83 W Total Power Dissipation (TO-220) P D 145 W Operating Junction Temperature T J Internally limited °C Operating Ambient Temperature T A -25 to +85 °C Storage Temperature Range T STG -55 to +150 °C ESD Capability, HBM Model (All pins except Vfb) - 2.0 (GND-Vfb = 1.5kV) (Vcc-Vfb = 1.0kV) kV ESD Capability, Machine Model (All pins except Vfb) - 300 (GND-Vfb = 250V) (Vcc-Vfb = 100V) V Parameter Symbol Value Unit Junction-to-Ambient Thermal θJA(1) - °C/W Junction-to-Case Thermal (D2-PAK, I2-PAK) θJC(2) 1.5 °C/W Junction-to-Case Thermal (TO-220) θJC(2) 0.9 °C/W

Electrical Characteristics

(Ta = 25°C unless otherwise specified.) Notes: 1. Pulse Test: Pulse width ≤ 300μS, duty ≤ 2% 2. These parameters, although guaranteed at the design, are not tested in mass production. Parameter Symbol Condition Min. Typ. Max. Unit SenseFET SECTION Drain Source Breakdown Voltage BV DSS VGS = 0V, ID = 250μA 650 - - V Zero-Gate-Voltage Current IDSS VDS = Max, Rating VGS = 0V - - 500 μA Static Drain Source on Resistance (1) RDS(ON) VGS = 10V, ID = 2.3A - 1.4 1.6 Ω Output Capacitance C OSS VGS = 0V, VDS = 25V, f = 1MHz - 100 - pF Turn on Delay Time T D(ON) VDD= 325V, ID= 5A (MOSFET switching time is essentially independent of operating temperature) -2 5 - ns Rise Time T R -6 0 - Turn off Delay Time T D(OFF) -1 1 5 - Fall Time T F -6 5 - CONTROL SECTION Initial Frequency F OSC VCC = 14V, VFB = 5V 60 66 72 kHz Modulated Frequency Range ΔFmod -- ± 3 - k H z Frequency Modulation Cycle T mod -- 4 - m s Voltage Stability F STABLE 10V ≤ VCC ≤ 17V 0 1 3 % Temperature Stability (2) ΔFOSC −25°C ≤ Ta ≤ +85°C - ±5 ±10 % Maximum Duty Cycle D MAX -7 5 8 0 8 5 % Minimum Duty Cycle D MIN -- - 0 % Start Threshold Voltage V START VFB = GND 11 12 13 V Stop Threshold Voltage V STOP VFB = GND 7 8 9 V Feedback Source Current I FB VFB = GND 0.7 0.9 1.1 mA Soft-start Time T SS -1 0 1 5 2 0 m s Initial Frequency T LEB - - 300 - ns BURST MODE SECTION Burst Mode Voltages (2) VBH Vcc = 14V 0.4 0.5 0.6 V VBL Vcc = 14V 0.24 0.3 0.36 V

Notes: 1. These parameters, although guaranteed at the design, are not tested in mass production. 2. These parameters indicate the inductor current. 3. This parameter is the current flowing into the control IC. PROTECTION SECTION Peak Current Limit(2) I LIM VCC = 14V, VFB = 5V 2.64 3 3.36 A Over Voltage Protection V OVP -1 8 1 9 2 0 V Thermal Shutdown Temperature(1) T SD 130 145 160 °C ShutdownDelay Current I DELAY VFB = 4V 3.5 5.3 7 μA Shutdown Feedback Voltage V SD VFB > 5.5V 5.5 6 6.5 V TOTAL DEVICE SECTION Startup Current I start -2 0 4 0 μA Operating Supply Current(3) IOP(MIN) VCC = 10V, VFB = 0V -2 . 55m A IOP(MAX) VCC = 20V, VFB = 0V

Comparison Between FSDM07652R and FSCM0765R Function FSDM07652R FSCM0765R Frequency Modulation N/A Available

  • Modulated frequency range (DF mod) = ±3kHz
  • Frequency modulation cycle (T mod) = 4ms Pulse-by-pulse Current Limit • Internally fixed (2.5 A) • Programmable using external resistor (3A max) Internal Startup Circuit • Availabl e • N/A (Requires a startup resistor)
  • Startup current: 40uA (max)
  1. Startup: Figure 16 shows the typical startup circuit and

Figure 16. Startup Circuit Figure 17. Relation Between Operating Supply Current charged to the start voltage and FPS will fail to start up.

2.1 Pulse-by-pulse Current Limit : Because current mode

current have maximum values of 2.5V and 3A, respectively. Figure 18. Pulse Width Modulation (PWM) Circuit

4 OSC

2.2 Leading Edge Blanking (LEB) : At the instant the

capacitance and secondary-side rectifier reverse recovery.

  1. Protection Circuit : The FSCM0765R has several self

voltage protection (OVP) and thermal shutdown (TSD). a) that is connected to the Vcc pin. Figure 19. Auto Restart Operation

3.1 Over Load Protection (OLP): Overload is defined as

protection circuit can be activated during the load transition. B from 2.5V to 6.0V with 5.3uA (Idelay). Figure 20. Over Load Protection

3.2 Over Voltage Protection (OVP) : If the secondary side

normal operation, Vcc should be designed to be below 19V .

3.3 Thermal Shutdown (TSD): The SenseFET and the

  1. Frequency Modulation : EMI reduction can be

than the band width measured by the EMI test equipment. frequency changes from 63KHz to 69KHz in 4ms. Figure 21. Frequency Modulation

  1. Soft Start : The FSCM0765R has an internal soft start

smoothly establishing the required output voltage. secondary diode during start up is also helpful.

  1. Burst Operation: To minimize power dissipation in

switching loss in standby mode. Figure 22. Waveforms of Burst Operation

Typical application circuit

  • High efficiency (>81% at 85Vac input)
  • Low standby mode power consumption (<1W at 240Vac input and 0.4W load)
  • Low component count
  • Enhanced system reliability through various protection functions
  • Low EMI through frequency modulation
  • Internal soft-start (15ms) Key Design Notes
  • Resistors R102 and R105 are employed to prevent start-up at low input voltage
  • The delay time for over load protection is designed to be a bout 50ms with C106 of 47nF. If a faster triggering of OLP is required, C106 can be reduced to 22nF. 1. Schematic

Figure 23. Demo Circuit

Figure 24. Transformer Schematic Diagram

  1. Demo Circuit Part List Part Value Note Part Value Note Fuse C301 4.7nF Polyester Film Cap. F101 2A/250V NTC Inductor RT101 5D-9 L201 5uH Wire 1.2mm Resistor L202 5uH Wire 1.2mm R101 560K 1W R102 500K 1/4W R103 56K 2W R104 5 1/4W Diode R105 500K 1/4W D101 UF4007 R106 5K 1/4W D102 TVR10G R201 1K 1/4W D201 MBRF1045 R202 10K 1/4W D202 MBRF10100 R203 1.2K 1/4W R204 5.6K 1/4W R205 5.6K 1/4W Bridge Diode BD101 2KBP06M 3N257 Bridge Diode Capacitor C101 220nF/275VAC Box Capacitor Line Filter C102 220nF/275VAC Box Capacitor LF101 23mH Wire 0.4mm C103 100uF/400V Electrolytic Capacitor IC C104 10nF/1kV Ceramic Capacitor IC101 FSCM0765R FPS TM C105 22uF/50V Electrolytic Capacitor IC201 KA431(TL431) Voltage Reference C106 47nF/50V Ceramic Capacitor IC301 H11A817A Opto-coupler C201 1000uF/25V Electrolytic Capacitor C202 1000uF/25V Electrolytic Capacitor C203 1000uF/10V Electrolytic Capacitor C204 1000uF/10V Electrolytic Capacitor C205 47nF/50V Ceramic Capacitor

NOTES: UNLESS OTHERWISE SPECIFIED A) THIS PACKAGE DOES NOT COMPLY TO ANY CURRENT PACKAGING STANDARD. B) ALL DIMENSIONS ARE IN MILLIMETERS. C) DIMENSIONS ARE EXCLUSIVE OF BURRS, MOLD FLASH, AND TIE BAR EXTRUSIONS. D) DIMENSIONS AND TOLERANCES PER ASME Y14.5M-1994 5.10 4.70 9.40 9.00 (0.75) 2.19 1.27 3.81 1.75 1.40 1.00 10.10 9.70 1.40 1.25 4.70 4.30 0.70 0.50 MIN 9.50 MIN 9.00 10.00 MIN 4.00 MIN 0.85 2.19 1.27 1.75 B SEE DETAIL A A (4.40) (8.58) (1.75) (0.90) (7.20) 15.60 15.00 R0.45 10.20 9.80 MAX1.10 MAX0.80

Package Dimensions (Continued) I2-PAK-6L (Forming)

Package Dimensions (Continued) Dimensions in Millimeters TO-220-6L (Forming) 0.60 0.45 (0.65) (7.15) (13.55) 2.19 1.27 3.81 1.75 1.40 1.25 (0.75) 15.90 15.50 MAX1.10 MAX0.80 10.20 9.80 R0.55 R0.55 0.70 0.50 8.30 7.30 9.40 9.00 3.48 2.88 2.60 2.20 23.80 23.20 20.00 19.00 4.70 4.30 2.90 2.70 10.10 9.70

Ordering Information

Product Number Package Marki ng Code BVdss Rds(on) Max. FSCM0765RJ D2-PAK-6L CM0765R 650V 1.6 ΩFSCM0765RIWDTU I2-PAK-6L FSCM0765RGWDTU TO-220-6L

12/15/05 0.0m 001 © 2004 Fairchild Semiconductor Corporation LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. www.fairchildsemi.com DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.