DATASHEET SEARCH SITE | WWW.ALLDATASHEET.COM
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 3
Technical content
Features
Switch Type 3-Pole/4-Pole MIC - GND VCC 2.3 to 4.5 V THD (MIC) 0.001% Typical ESD IEC 61000-4-2 (Air Gap) IEC 61000-4-2 (Contact) HBM (All Pins) GNDnA/GNDnB to GND Power to GND CDM 15 kV 8 kV 3 kV 8 kV 10 kV 2 kV Operating Temperature -40°C to 85°C RON Maximum (GND1n) 0.08 Ω RON Maximum (SENSE) 1 Ω
Applications
3.5 mm and 2.5 mm Audio Jacks Cellular Phones, Smart Phones MP3 and PMP (Portable Media Player)
Description
The FSA850 is a 3-pole or 4-pole audio jack microphone GND switch for accessories with General-Purpose Input / Output (GPIO) control signals. The FSA850 also has the ability to perform 4-pole cross-point switching to support Open Mobile Terminal Platform (OMTP) 4-pole headset plugs. The architecture is designed to replace discrete MOSFET solutions and allow common third-party headphones to be used for listening to music or playing video from mobile handsets, personal media players, and portable peripheral devices. Supports 4-Pole OMTP Cross Point Switching for GND Connection Integrates a MIC switch for 3- or 4-Pole Configuration Headset Plugs Reduces “Pop and Click” Caused by Microphone Bias Related Resources For samples and questions, please contact: Analog.Switch@fairchildsemi.com Typical Application Figure 1. Typical Mobile Application
© 2011 Fairchild Semiconductor Corporation www.fairchildsemi.com FSA850 • Rev. 1.0.0 6 FSA850 — Audio 3-Pole / 4-Pole MIC-GND Switch Physical Dimensions Figure 4. 12-Bump, Wafer-Level Chip Scale Package (WLCSP), 1.2mmx1.6mm, 0.4mm Pitch
Ordering Information
FSA850UCX -40 to +85°C M5 12-Ball, Wafer-Level Chip-Scale Package (WLCSP), 3x4 Array, 0.4mm Pitch, 250 µm Ball 1.16 mm 1.56 mm 0.18 mm 0.18 mm BOTTOM VIEW SIDE VIEWS TOP VIEW RECOMMENDED LAND PATTERN (NSMD PAD TYPE) NOTES: A. NO JEDEC REGISTRATION APPLIES. B. DIMENSIONS ARE IN MILLIMETERS. C. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. D. DATUM C IS DEFINED BY THE SPHERICAL CROWNS OF THE BALLS. E. PACKAGE NOMINAL HEIGHT IS 586 MICRONS ±39 MICRONS (547-625 MICRONS). F. FOR DIMENSIONS D, E, X, AND Y SEE PRODUCT DATASHEET. G. DRAWING FILENAME: MKT-UC012ACrev1. 0.40 0.40 0.80 1.20 Ø0.260±0.02 12X (X)±0.018 (Y)±0.018 A B C D 12 3 PIN 1 AREA 0.03 C E D A B 0.03 C 0.05 C 0.625 0.547 C 0.378±0.018 0.208±0.021 SEATING PLANE D F F (Ø0.200) Cu Pad (Ø0.300) Solder Mask 0.40 0.80 1.20 0.40
0.005 CAB
© 2011 Fairchild Semiconductor Corporation www.fairchildsemi.com FSA850 • Rev. 1.0.0 7 FSA850 — Audio 3-Pole / 4-Pole MIC-GND Switch