FSA8049 ONSEMI | Alldatasheet

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© 2011 Fairchild Semiconductor Corporation www.fairchildsemi.com FSA8049 • Rev. 1.0.2 FSA8049 — Audio Jack Detection and Configuration, MIC/GND Cross point Switch FSA8049 Audio Jack Detection and Configuration, MIC / GND Cross Point Switch

Features

Detection Audio Plug GND & MIC Polarity VDD 2.5 to 4.4 V THD (MIC) 0.002% Typical ESD (IEC 61000-4-2) (Air Gap) 15 kV Operating Temperature -40°C to 85°C Package 9-Ball WLCSP 3x3 Array, 0.4 mm Terminal Pitch, 250 µm Ball Top Mark M3

Applications

 Cellular Phones, Smart Phones  MP3 and Portable Multimedia Player

Description

The FSA8049 is an audio jack detection switch for 3- or 4-pole accessories. The FSA8049 detects the locations of ground (GND) and microphone (MIC) poles on the audio plug and automatically routes them to the appropriate connections. This allows the end user to plug accessories, such as headsets with different audio pole configurations, into the mobile device and have them operate correctly.  Detects 3- or 4-pole audio accessories  Detects polarity of GND and MIC on 4-pole plugs  Automatically routes GND and MIC to audio jack terminals Related Resources  For evaluation boards and questions, please contact: Analog.Switch@fairchildsemi.com. Typical Application Figure 1. Mobile Phone Example

  • = Pin 1 Indicator

Figure 2. Pin Assignments Figure 3. Top Mark

0 Disabled

1 Enabled

  1. GND and GNDA can be shorted together if the system does not utilize an FM antenna on the handset ground. If the

capacitor on GNDA only, and connect GND to a low-impedance path to battery ground. State of pins GND/MIC1, GND/MIC2, and MIC after detection time (tDET) is complete.

© 2011 Fairchild Semiconductor Corporation www.fairchildsemi.com FSA8049 • Rev. 1.0.2 3 FSA8049 — Audio Jack Detection and Configuration, MIC/GND Cross point Switch Absolute Maximum Ratings Stresses exceeding the absolute maximum ratings may damage t he device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operati ng conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol Parameter Min. Max. Unit v Supply Voltage from Battery -0.5 6.0 V VSW Switch I/O Voltage -0.5 V CC+0.5 V IIK Input Clamp Diode Current -50 mA ISW Switch I/O Current (Continuous) (2) 50 mA TSTG Storage Temperature Range -65 +150 °C TJ Maximum Junction Temperature +150 °C TL Lead Temperature (Soldering, 10 Seconds) +260 °C ESD IEC 61000-4-2 System ESD Air Gap 15 kV Contact 8 Human Body Model, JEDEC JESD22-A114 GND/MICn vs. GND 11 VDD vs. GND 16 All Pins 7 Charged Device Model, JEDEC JESD22-C101 All Pins 1.5 Note: 2. The input and output negative ratings may be exceeded if the input and output diode current ratings are observed. Recommended Operating Conditions The Recommended Operating Conditions table defines the conditi ons for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specif ications. Fairchild does not recommend exceeding them or designing to Absolute Maximum Ratings. Symbol Parameter Min. Max. Unit VDD Supply Voltage 2.5 4.4 V VEN Enable Input Voltage 0 V DD V TA Operating Temperature -40 +85 ºC

© 2011 Fairchild Semiconductor Corporation www.fairchildsemi.com FSA8049 • Rev. 1.0.2 4 FSA8049 — Audio Jack Detection and Configuration, MIC/GND Cross point Switch All typical values are at TA=25°C unless otherwise specified. Symbol Parameter V DD (V) Condition TA=-40 to +85°C Unit Min. Typ. Max. MIC Switch (MIC to (GND/MIC1 or GND/MIC2)) VIN(MIC) Switch Input Voltage Range 2.7 to 4.4 0 V DD V CON(MIC) MIC Switch On Capacitance (3) 3.8 f=1 MHz 90 pF COFF(MIC) MIC Switch Off Capacitance(3) 3.8 f=1 MHz 21 pF GND Switch (GND to (GND/MIC1 or GND/MIC2)) RON(GNDA) GND Switch On Resistance 2.8 IOUT=24 mA 90 170 mΩ 3.8 80 100 VIN(GNDA) Switch Input Voltage Range 2.7 to 4.4 0 1 V XC(GNDA) GND Switch On Reactance(4) 3.8 f=88 MHz to 108 MHz, VIN=50 mV 100 m Ω Parallel I/O VIH Input High Voltage 2.7 to 4.4 1.1 V DD V VIL Input Low Voltage 2.7 to 4.4 0 0.55 V ICCT Increase in Quiescent Supply Current 4.4 EN=1.3 V 3 µA Current IOZ Switch Leakage Current 4.4 GND/MICn=1 V, 4.3 V; MIC=4.3V, 1V; EN=LOW -75 75 nA IIN Input Leakage Current 0 to 4.4 EN Input 0 to 4.3 V 0.1 µA ICC-DIS Disabled Current 2.7 to 4.4 EN=0 100 nA ICC-EN Enabled Current After Detection 2.7 to 4.4 EN=1 100 nA ICC-DET Current During Detection Mode 2.7 to 4.4 EN=0→ 1, 3-Pole Mode, GND/MIC1=GND/MIC2 0.5 2.0 mA Notes: 3. Guaranteed by characterization. 4. Guaranteed by design.

© 2011 Fairchild Semiconductor Corporation www.fairchildsemi.com FSA8049 • Rev. 1.0.2 5 FSA8049 — Audio Jack Detection and Configuration, MIC/GND Cross point Switch All typical values are at TA=25°C unless otherwise specified. Symbol Parameter V DD (V) Condition TA = -40 to +85°C Unit Min. Typ. Max. MIC Switch THD Total Harmonic Distortion (5) 3.8 RT=600 Ω, VSW=0.5 VPP, f=20 Hz to 20 kHz, VIN=1.8 V and 2.2 V (Figure 4) 0.002 % OIRR Off Isolation(5) 3.8 f=20 kHz, RS=32 Ω, CL=0 pF, RT=32 Ω (Figure 5) -108 dB f=20 KHz, RS=600 Ω, CL=0 pF, RT=600 Ω (Figure 5) -85 Parallel I/O tON-GNDA Switch Turn-On Time (MIC & GND Switch), Measure 10/90 3.8 CEXT=Float RL=10 kΩ, CL=10 pF 200 µs CEXT=0.1 µF RL=10 kΩ, CL=10 pF 140 ms tOFF-GNDA Switch Turn-Off Time (MIC & GND Switch), Measure 10/90 3.8 CEXT=Float RL=10 kΩ, CL=10 pF 20 µs CEXT=0.1 µF RL=10 kΩ, CL=1 0pF 6 ms tOFF-MIC Switch Turn-Off Time (MIC Switch), Measure 10/90 3.8 R L=10 kΩ, CL=10 pF 100 ns tON-DET Detection Circuit NMOS On ti me 2.7 to 4.4 20 µs tOFF-DET Detection Circuit NMOS OFF time 2.7 to 4.4 20 µs tDET Detection Time of Audio Jack GND and MIC Terminals(6) 2.7 to 4.4 EN=1 50 ms tEN Enable / Disable Time 2.7 to 4.4 EN=0 1, EN=10 15 µs Power PSRR Power Supply Rejection Ratio (5) 3.8 Power Supply Noise 300mVPP, Measured 10/90%, f=217 Hz Square Wave -89 dB Notes: 5. Guaranteed by characterization. 6. Detection time may be longer if there is noi se in the system or a poor audio jack connection.

© 2011 Fairchild Semiconductor Corporation www.fairchildsemi.com FSA8049 • Rev. 1.0.2 7 FSA8049 — Audio Jack Detection and Configuration, MIC/GND Cross point Switch Physical Dimensions Figure 6. 9-Ball, Wafer-Level Ch ip-Scale Package (WLCSP), 3x3 Array, 0.4 mm Pitch, 250 µm Ball http://www.fairchildsemi.com/packaging/.

Ordering Information

FSA8049UCX -40 to +85°C M3 9-Ball, Wafer-Level Chip-Scale Package (WLCSP), 3x3 Array, 0.4 mm Pitch, 250 µm Ball 1.16 mm 1.16 mm 0.018 mm 0.018 mm 0.03 C B A 0.03 C 0.208±0.021 0.378±0.018 D C 0.06 C 0.05 C PIN A1 INDEX AREA NOTES: A. NO JEDEC REGISTRATION APPLIES. B. DIMENSIONS ARE IN MILLIMETERS. C. DIMENSIONS AND TOLERANCE PER ASMEY14.5M, 1994. D. DATUM C IS DEFINED BY THE SPHERICAL CROWNS OF THE BALLS. E. PACKAGE NOMINAL HEIGHT IS 586 MICRONS ±39 MICRONS (547-625 MICRONS). F. FOR DIMENSIONS D, E, X, AND Y SEE PRODUCT DATASHEET. G. DRAWING FILNAME: MKT-UC009ABrev2 F F E E D A1 Ø0.20 Cu Pad Ø0.30 Solder Mask 0.40 0.40 SIDE VIEWS Ø0.260±0.020 0.40 0.40 (X)±0.018 (Y)±0.018 A B C 123 BOTTOM VIEW TOP VIEW 0.625 0.547 SEATING PLANE LAND PATTERN RECOMMENDATION (NSMD PAD TYPE)

© 2011 Fairchild Semiconductor Corporation www.fairchildsemi.com FSA8049 • Rev. 1.0.2 8 FSA8049 — Audio Jack Detection and Configuration, MIC/GND Cross point Switch

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