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Technical content

Features

 Detection: - Accessory Plug-In - Send / End Key Press - Prevents False Detection due to Moisture  VDD: 2.5 V to 4.5 V  VIO: 1.6 V to VDD  THD (MIC): 0.01% Typical  15 kV Air Gap ESD  MIC Switch Removes Audio Jack “Pop” and “Click” Caused by MIC Bias

Applications

 Any Device with 3.5 mm and 2.5 mm Audio Jack  Cellular Phones, Smart Phones, and Tablets  MP3, GPS, and PMP

Description

The FSA8039A is a detection switch for an audio jack that employs a normally open detect pin. The FSA8039A works with 3 -pole and 4-pole accessories. The FSA8039A features moisture sensing that prevents false detection of accessories in the audio jack. The integrated MIC switch allows a processor to configure attached accessories. The architecture is designed to allow common third-party headphones to be used for listening to music from mobile handsets, personal media players, and portable peripheral devices. Related Resources FSA8039A Evaluation Board Insert Detection and Moisture Sensing Interface Logic Key Press Detection MIC Detect L R G Processor Audio CODEC Figur e 1. Block Diagram

Ordering Information

Temperature Range Top Mark Package Packing Method FSA8039AUMSX -40°C to 85°C NF 10-Lead, UMLP, 1.4 mm x 1.8 mm, 0.4 mm Pitch Tape & Reel

www.onsemi.com FSA8039A — Audio Jack Interface Solution with Moisture Sensing Typical Application Diagram Insert Detection and Moisture Sensing Interface Logic Key Press Detection MIC Detect L Processor Audio CODEC FSA8039A EN DET S/E 1µF 2.2kΩ MIC BIAS R G J-DET2 GND J-MIC LR 1µF 2.2µF 1kΩ1 BatteryVIO MIC VIO VDD 16-32 Ω RL G Headset Plug-in M RKEY 10kΩ3 Figur e 2. Typical Application Notes: 1. A 1 kΩ resistor with a 2.2 µF capacitor is recommended for direct battery connection. This filter helps stabilize power rail events not associated with the FSA8039A. If power is supplied from a stable source, such as from a PMIC or LDO, a single 1 µF capacitor is recommended. 2. The J-DET is shorted to the left (L) audio channel when the headset or accessory plug is inserted into most audio jacks. Any external circuitry attached to the J-DET pin could affect audio performance in the 20-20 kHz range on the left channel. 3. The optional 10 kΩ resistor on the left channel is used to assist in detection of high-impedance accessories. This resistor has negligible impact on audio fidelity.

FSA8039A — Audio Jack Interface Solution with Moisture Sensing Pin Configuration Figur e 3. Pin Assignment (Through View) Pin Defi nitions Name Pin # Type Description VIO 1 Power Baseband or processor I/O supply voltage DET 2 Output Indicates if audio accessory is plugged in (debounced output) DET=VOL, Accessory plugged in DET=VOH, Accessory unplugged EN 3 Input Microphone switch control No Plug Plug inserted EN=VIL MIC switch open Music Mode EN=VIH MIC switch open MIC switch closed NC 4 NC No connect; connect to GND for improved solder stability VDD 5 Power Supply voltage S/E 6 Output Indicates when an accessory key has been pressed (debounced output) S/E=VOL, No Key Press S/E=VOH, Key Press MIC 7 I/O Connection to the microphone pre-amplifier EN=VIL, Switch Open EN=VIH, Switch Closed J_MIC 8 I/O Connection from the audio jack mechanical plug microphone pin GND 9 Ground Ground for both the audio jack and PCB J_DET 10 Input Input from the audio jack mechanical plug insert/removal detection pin 6 7 VIODET J_DET NC VDD EN S/E MIC J_MIC GND www.onsemi.com

FSA8039A — Audio Jack Interface Solution with Moisture Sensing

Application Information

Moisture in the audio jack can cause the phone to incorrectly route audio signal s to the audio jack rather than the phone speaker or microphone. Users perceive this as a dropped call or muted phone. The FSA8039A protects against this type of false plug-insert notification. Figu re 4. Moisture Impedance Detection Music Mode When a 4-pole headset is inserted into the audio jack and a music/listening application is used, the MIC bias is normally enabled for headset button press detection (i.e. mute, volume change, etc.). This consume s power due to a constant path from the MIC bias resistor and microphone in the headset to GND . Fairchild has developed a Music Mode to enable the MIC switch periodically to monitor for a pressed button. This results in a power savings for battery-sensitive devices, such as cell phones or MP3 players. The FSA8039A enters Music Mode when EN=LOW and a 4-pole headset is inserted. Music Mode reduces MIC bias current by approximately 90%. Audio CODEC 1µF 2.2kΩ MIC BIAS LR MIC MIC Bias Current Flow MIC Figu re 5. MIC Bias Leakage Path Headset Key-Press Operation The headset key -press comparator threshold is a function of the MIC bias voltage, MIC bias resistor, and the MIC impedance. All of these variables must be considered when calculating the key-press resistor value. Figure 6 is an example of how to calculate the key-press resistor value. RBIAS VBIAS RKEYRMIC Key Press VTH_SE Key Press Resistor VTH_SE=0.6 V VBIAS=2.6 V RBIAS=2.2 kΩ RMIC=2 kΩ VBIAS-VTH_SE RBIAS VTH_SE / 1 1 RMIC RKEY ≤ RKEY ≤ 980 Ω Figu re 6. Example Key-Press Resistor Calculations and Values www.onsemi.com

FSA8039A — Audio Jack Interface Solution with Moisture Sensing Design / Layout Best Practices System-level Electrostatic Discharge (ESD) events often occur in the audio path of a mobile device, typically when inserting or removing an accessory from the audio jack. The audio path from the audio jack to the audio codec or microphone pre-amplifier is typically designed for relatively low frequencies (<100 kHz). An ESD event is a high-frequency event with fast edge rates (<100 ns/V). For this reason, the audio paths represent a high-frequency transmission line to the ESD signal. Use the following PCB design and layout best practices when designing a system audio path. Audio Path Layout Guidelines for ESD For the MIC and ground signals between the audio jack and FSA8039A, decrease the spacing between these traces to increase the inductive coupling of the signals. In effect, this creates a low -frequency band pass fil ter that shunts ESD energy to ground before it reaches internal components. Where feasible, lay the MIC trace as a shielded stripline, as shown in Figure 7. Figur e 7. MIC PCB Trace as Shielded Stripline Ground Layout Guidelines Ground layout for audio path devices should consider high-frequency effects. During an ESD event, parasitic inductance and resistance in the ground path reduces its ability to shunt the fast transient energy. Use the following techniques to improve grounding effectiveness:  Use “star” ground connections (not daisy-chain).  Use ground vias to minimize ground path impedance and ground loops.  Stitch ground traces to the ground plane at the device, where possible (see Figure 8).  Flood ground, where possible (see Figure 8).  Avoid ground “islands” or “peninsulas” if possible.  If using a modular audio jack assembly that is not soldered to the main PCB, use a ground pad on the jack with an ohmic connection to battery ground. Figur e 8. PCB Layout/Grounding In addition to ESD robustness, these techniques can improve audio signal performance by reducing audio crosstalk and echo due to resistive voltage drops in the audio ground path. GND GND GND GNDMIC ~3-4 mils ~3-4 mils ~3-4 mils DET VIO J_DET GND J_MIC S/E MIC EN NC VDD www.onsemi.com

FSA8039A — Audio Jack Interface Solution with Moisture Sensing Absolute Maximum Ratings Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not rec ommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol Parameter Min. Max. Unit VDD, VIO Supply Voltage from Battery -0.5 6.0 V VSW Switch I/O Voltage (MIC, J_MIC) -0.5 VDD+0.5 V VJD Input Voltage for J_DET Input -1.5 VDD+0.5 V IIK Input Clamp Diode Current -50 mA ISW Switch I/O Current 50 mA TSTG Storage Temperature Range -65 +150 °C TJ Maximum Junction Temperature +150 °C TL Lead Temperature (Soldering, 10 Seconds) +260 °C ESD IEC 61000-4-2 System ESD Air Gap 15 kV Contact 8 Human Body Model, ANSI/ESDA/JEDEC JS-001-2012 J_DET, J_MIC, VDD, VIO, GND 8 All Other Pins 2 Charged Device Model, JEDEC JESD22-C101 All Pins 2 Recomme nded Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to Absolute Maximum Ratings. Symbol Parameter Min. Max. Unit VDD Battery Supply Voltage 2.5 4.5 V VIO Parallel I/O Supply Voltage 1.6 VDD V TA Operating Temperature -40 +85 ºC J_DETAudiof Audio Frequency on J_DET Pin; VDD=2.4 to 4.5 V; DET= VOL 20 20000 Hz VSW MIC Switch Input Voltage Range 0 VDD V J_DETAudioV Audio Voltage on J_DET Pin -1 1 V J_DETRL Maximum Resistance on Accessory Left Channel for Valid Attach / Audio Accessory Plug Inserted 10 kΩ www.onsemi.com

FSA8039A — Audio Jack Interface Solution with Moisture Sensing All typical values are at TA=25°C, CIN_VDD=1.0 µF, and CIN_VIO=0.1 µF unless otherwise specified. Symbol Parameter VDD (V) Conditions TA = -40 to +85°C Unit Min. Typ. Max. MIC Switch RON MIC Switch On Resistance 3.8 IOUT=30 mA, VIN=2.2 V 0.4 2.0 Ω RFLAT(ON) On Resistance Flatness 3.8 IOUT=30 mA, VIN=1.6 V to 2.8 V 0.30 1.50 IOFF Power-Off Leakage Current on MIC Pin 0 MIC=4.3 V 1 µA Key Press VTH_SE Key Detection Threshold 2.5 to 4.5 Detection Threshold 0.60 V Parallel I/O (KP, INTB) VOH Output High Voltage IOH=-100 µA 0.8 × VIO V VOL Output Low Voltage IOL=+100 µA 0.2 × VIO IIN EN Input Leakage Current 1 µA VIL Low-Level Input Voltage 0.3 × VIO V VIH High-Level Input Voltage 0.7 × VIO V Current IDD-SLNA Battery Supply Sleep Mode Current with No Accessory Attached and LDO Disabled 2.5 to 4.5 Static Current during Sleep Mode 1.5 3.0 µA IDD-SLWA Battery Supply Sleep Mode Current with Accessory Attached 2.5 to 4.5 Active Current 20 30 µA Note: 4. Refer to Figure 6 and RKEY calculation. www.onsemi.com

FSA8039A — Audio Jack Interface Solution with Moisture Sensing All typical values are for TA=25°C, CIN_VDD=1.0 µF, and CIN_VIO=0.1 µF unless otherwise specified. Symbol Parameter VDD (V) Conditions Typical Unit MIC Switch THD+N Total Harmonic Distortion + Noise (Char) 3.8 RT=600 Ω, f=20 Hz to 20 kHz, VMIC=2.0 VDC +0.5 Vpp Sine 0.01 % OIRR Off Isolation 3.8 f=20 Hz to 20 kHz, RS=RT=32 Ω, CL=0 pF -85 dB Timing Characteristics tPOLL ON Time of MIC Switch for Sensing SEND / END Key Press Oscillator Stable Time 2.5 to 4.5 DET=VOL, EN=VIL 1 ms tWAIT Period of MIC Switching for Sensing SEND / END Key Press 2.5 to 4.5 DET=VOL, EN=VIL 10 ms tDET_IN Debounce Time after J_DET Changes State from HIGH to LOW 2.5 to 4.5 70 ms tKBK Debounce Time for Sensing SEND / END Key Press / Release 2.5 to 4.5 30 ms tDET_REM Debounce Time from Changing J_DET State from LOW to HIGH to Detect Jack Removal 2.5 to 4.5 30 μs Power PSRR Power Supply Rejection Ratio 3.8 Power Supply Noise 300 mVPP, f=217 Hz -90 dB 10-Lead, Quad Ultrathin MLP (UMLP) Nominal Values JEDEC Symbol Description Nominal Values (mm) A Overall Height 0.5 A3 Lead Thickness 0.152 b Lead Width 0.2 L Lead Length 0.4 e Lead Pitch 0.4 D Body Length (Y) 1.8 E Body Width (X) 1.4 Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. www.onsemi.com

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