FSA8039A FAIRCHILD | Alldatasheet
Document overview
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- PDF pages: 12
Technical content
Features
Detection: Accessory Plug-In Send / End Key Press Prevents False Detection due to Moisture VDD: 2.5 V to 4.5 V VIO: 1.6 V to VDD THD (MIC): 0.01% Typical 15 kV Air Gap ESD MIC Switch Removes Audio Jack “Pop” and “Click” Caused by MIC Bias
Applications
Any Device with 3.5 mm and 2.5 mm Audio Jack Cellular Phones, Smart Phones, and Tablets MP3, GPS, and PMP
Description
The FSA8039A is a detection switch for an audio jack that employs a n ormally open detect pin. The FSA8039A works with 3 -pole and 4 -pole accessories. The FSA8039A features moisture sensing that prevents false det ection of accessories in the audio jack. The integrated MIC switch allows a processor to configure attached accessories. The architecture is designed to allow common third -party headphones to be used for listening to music from mobile handsets, personal media players, and portable peripheral devices. Related Resources FSA8039A Evaluation Board For samples and questions, please contact: Analog.Switch@fairchildsemi.com Insert Detection and Moisture Sensing Interface Logic Key Press Detection MIC Detect L R G Processor Audio CODEC Figure 1. Block Diagram
Ordering Information
Temperature Range Top Mark Package Packing Method FSA8039AUMSX -40°C to 85°C NF 10-Lead, UMLP, 1.4 mm x 1.8 mm, 0.4 mm Pitch Tape & Reel
Figure 2. Typical Application
- A 1 kΩ resistor with a 2.2 µF capacitor is recommended for direct battery connection. This filter helps stabilize
PMIC or LDO, a single 1 µF capacitor is recommended.
- The J-DET is shorted to the left (L) audio channel when the headset or accessory plug is inserted into most
- The optional 10 kΩ resistor on the left channel is used to assist in detection of high-impedance accessories.
This resistor has negligible impact on audio fidelity.
Figure 3. Pin Assignment (Through View)
© 2014 Fairchild Semiconductor Corporation www.fairchildsemi.com FSA8039A • Rev. 1.0.0 6 FSA8039A — Audio Jack Detection IC Featuring Moisture Sensing Absolute Maximum Ratings Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not rec ommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol Parameter Min. Max. Unit VDD, VIO Supply Voltage from Battery -0.5 6.0 V VSW Switch I/O Voltage (MIC, J_MIC) -0.5 VDD+0.5 V VJD Input Voltage for J_DET Input -1.5 VDD+0.5 V IIK Input Clamp Diode Current -50 mA ISW Switch I/O Current 50 mA TSTG Storage Temperature Range -65 +150 C TJ Maximum Junction Temperature +150 C TL Lead Temperature (Soldering, 10 Seconds) +260 C ESD IEC 61000-4-2 System ESD Air Gap 15 kV Contact 8 Human Body Model, ANSI/ESDA/JEDEC JS-001-2012 J_DET, J_MIC, VDD, VIO, GND 8 All Other Pins 2 Charged Device Model, JEDEC JESD22-C101 All Pins 2 Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to Absolute Maximum Ratings. Symbol Parameter Min. Max. Unit VDD Battery Supply Voltage 2.5 4.5 V VIO Parallel I/O Supply Voltage 1.6 VDD V TA Operating Temperature -40 +85 ºC J_DETAudiof Audio Frequency on J_DET Pin; VDD=2.4 to 4.5 V; DET= VOL 20 20000 Hz VSW MIC Switch Input Voltage Range 0 VDD V J_DETAudioV Audio Voltage on J_DET Pin -1 1 V J_DETRL Maximum Resistance on Accessory Left Channel for Valid Attach / Audio Accessory Plug Inserted 10 kΩ
© 2014 Fairchild Semiconductor Corporation www.fairchildsemi.com FSA8039A • Rev. 1.0.0 7 FSA8039A — Audio Jack Detection IC Featuring Moisture Sensing All typical values are at TA=25°C, CIN_VDD=1.0 µF, and CIN_VIO=0.1 µF unless otherwise specified. Symbol Parameter VDD (V) Conditions TA = -40 to +85°C Unit Min. Typ. Max. MIC Switch RON MIC Switch On Resistance 3.8 IOUT=30 mA, VIN=2.2 V 0.4 2.0 Ω RFLAT(ON) On Resistance Flatness 3.8 IOUT=30 mA, VIN=1.6 V to 2.8 V 0.30 1.50 IOFF Power-Off Leakage Current on MIC Pin 0 MIC=4.3 V 1 µA Key Press VTH_SE Key Detection Threshold 2.5 to 4.5 Detection Threshold 0.60 V Parallel I/O (KP, INTB) VOH Output High Voltage IOH=-100 µA 0.8 × VIO V VOL Output Low Voltage IOL=+100 µA 0.2 × VIO IIN EN Input Leakage Current 1 µA VIL Low-Level Input Voltage 0.3 × VIO V VIH High-Level Input Voltage 0.7 × VIO V Current IDD-SLNA Battery Supply Sleep Mode Current with No Accessory Attached and LDO Disabled 2.5 to 4.5 Static Current during Sleep Mode 1.5 3.0 µA IDD-SLWA Battery Supply Sleep Mode Current with Accessory Attached 2.5 to 4.5 Active Current 20 30 µA Note: 4. Refer to Figure 6 and RKEY calculation.
© 2014 Fairchild Semiconductor Corporation www.fairchildsemi.com FSA8039A • Rev. 1.0.0 8 FSA8039A — Audio Jack Detection IC Featuring Moisture Sensing All typical values are for TA=25°C, CIN_VDD=1.0 µF, and CIN_VIO=0.1 µF unless otherwise specified. Symbol Parameter VDD (V) Conditions Typical Unit MIC Switch THD+N Total Harmonic Distortion + Noise (Char) 3.8 RT=600 Ω, f=20 Hz to 20 kHz, VMIC=2.0 VDC +0.5 Vpp Sine 0.01 % OIRR Off Isolation 3.8 f=20 Hz to 20 kHz, RS=RT=32 Ω, CL=0 pF -85 dB Timing Characteristics tPOLL ON Time of MIC Switch for Sensing SEND / END Key Press Oscillator Stable Time 2.5 to 4.5 DET= VOL, EN= VIL 1 ms tWAIT Period of MIC Switching for Sensing SEND / END Key Press 2.5 to 4.5 DET= VOL, EN= VIL 10 ms tDET_IN Debounce Time after J_DET Changes State from HIGH to LOW 2.5 to 4.5 70 ms tKBK Debounce Time for Sensing SEND / END Key Press / Release 2.5 to 4.5 30 ms tDET_REM Debounce Time from Changing J_DET State from LOW to HIGH to Detect Jack Removal 2.5 to 4.5 30 μs Power PSRR Power Supply Rejection Ratio 3.8 Power Supply Noise 300 mVPP, f=217 Hz -90 dB
© 2014 Fairchild Semiconductor Corporation www.fairchildsemi.com FSA8039A • Rev. 1.0.0 9 FSA8039A — Audio Jack Detection IC Featuring Moisture Sensing Physical Dimensions 10-Lead, Quad Ultrathin MLP (UMLP), 1.4 × 1.8 mm Body Nominal Values JEDEC Symbol Description Nominal Values (mm) A Overall Height 0.5 A3 Lead Thickness 0.152 b Lead Width 0.2 L Lead Length 0.4 e Lead Pitch 0.4 D Body Length (Y) 1.8 E Body Width (X) 1.4 Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/dwg/UM/UMLP10SG.pdf. A B CSEATING PLANE DETAIL A PIN#1 IDENT RECOMMENDED LAND PATTERN TOP VIEW BOTTOM VIEW 0.08 C FRONT VIEW 0.10 C 0.05 0.00
0.10 C A B
0.05 C 0.55 MAX. 1.40 1.80 0.40 0.15 0.25(10X) 0.35 0.45(10X) 1.70 2.10 0.40 0.563 0.563 (10X) 0.225(10X) (0.15) 0.45 0.35 DETAIL A SCALE : 2X 1.85 1.45 0.45 0.40 0.250(10X) (10X) 0.45 PIN#1 IDENT OPTIONAL MINIMIAL TOE LAND PATTERN LEAD OPTION 1 SCALE : 2X LEAD OPTION 2 PACKAGE EDGE 0.25 0.15 0.10 C 0.10 C 45° SIDE VIEW NOTES: A. SAMSUNG ONLY CUSTOMER DRAWING. B. DIMENSIONS ARE IN MILLIMETERS. C. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 2009. D. LAND PATTERN RECOMMENDATION IS BASED ON FSC DESIGN. E. DRAWING FILENAME: MKT-UMLP10SGrev1 F. FAIRCHILD SEMICONDUCTOR.
© 2014 Fairchild Semiconductor Corporation www.fairchildsemi.com FSA8039A • Rev. 1.0.0 10 FSA8039A — Audio Jack Detection IC Featuring Moisture Sensing Packing Specifications 10-Lead, Quad Ultrathin MLP (UMLP), Packing Specification, Page 1 Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. For current packing container specifications, visit Fairchild Semiconductor’s online packaging area: http://www.fairchildsemi.com/packing_dwg/PKG-UMLP10SG.pdf Barcode Label UMLP10L 1.4x1.8, Packing Drawing Components Leader Tape 500mm minimumTrailer Tape 300mm minimum Tape Leader and Trailer Configuration Cover Tape Carrier Tape Packing Description: UMLP10L 1.4x1.8 products are classified under Moisture Sensitive Level 1. The carrier tape is made from dissipative polystyrene or polycarbonate resin. The cover tape is a multilayer film primarily composed of polyester film, adhesive layer, heat activated sealant, and anti-static sprayed agent. These reeled parts in standard option are shipped with 5000 units per 178 mm diameter reel. Up to three reels are packed in each intermediate box. The reels is made of polystyrene plastic (anti-staticcoated or intrinsic). These full reels are individually barcode labeled and placed inside a pizza box madeof recyclablecorrugated brownpaper with a Fairchild logo printing. Up to 3 reels could be packed in the pizza box. And these pizza boxes are placed inside a barcodelabeled shipping box which comes in different sizes depending on the number of parts shipped. F63TNR Label sample Pizza Box printed with FSC Logo and caution statements. Dimension: 193mm x 183mm x 80mm Sealed with antistatic adhesive tape. ESD Logo Label Wrap the reels in bubble pack F63TNR Label Pin 1
- • • JT
- • • JT
- • • JT Electrostatic Sensitive Devices Require Proper Handling Procedures Reel No.: ESD Logo Label sample 8910 4 5 LOT: PMH010088888 FSID: FSA2259UMX D/C1: P1215NA QTY1: SPEC REV: 2nd Level Interconnect D/C2: QTY2: QTY: 5000 SPEC: RoHS COMPLIANT (F63TNR)6.0FAIRCHILD SEMICONDUCTOR Green Component 1. Category G3 2. Maximum safe temperature 260 deg C 3. MSL 1
© 2014 Fairchild Semiconductor Corporation www.fairchildsemi.com FSA8039A • Rev. 1.0.0 11 FSA8039A — Audio Jack Detection IC Featuring Moisture Sensing Packing Specifications 10-Lead, Quad Ultrathin MLP (UMLP), Packing Specification, Page 2 Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. For current packing container specifications, visit Fairchild Semiconductor’s online packaging area: http://www.fairchildsemi.com/packing_dwg/PKG-UMLP10SG.pdf Tape Width Dia A Dim B Dia C Dia D Dim N Dim W1 Dim W2 Dim W3 max min +.5/-.2 min min +2/-0 max (LSL - USL) 20 deg maximum component rotation 0.5 mm maximum 0.5 mm maximum Sketch C (Top View) Component lateral movement Typical component cavity center line 200 maximum Typical component center line Bo Ao Sketch B (Top View) Component Rotation Sketch A (Side or Front Sectional View) Component Rotation Embossed Tape Dimension P1Ao D1 Po F W E D Bo Tc WcKo T User Direction of Feed +++ Dimensions are in millimeters Dia A max W1 Measured at Hub Dia N Dia D min Dia C B Min DETAIL AA Shipping Reel Dimension W2 max Measured at Hub Notes: Ao, Bo, and Ko dimensions are determined with respect to the EIA /Jedec RS-481 rotational and lateral movement requirements (see sketches A, B, and C). Package Ao Bo D D1 E F Ko P1 Po P2 T Tc W Wc Dimensions are in millimeters See detail AA UMLP10L 1.4x1.8 Packing Configuration 1:1 PKG – UMLP10SG
© 2014 Fairchild Semiconductor Corporation www.fairchildsemi.com FSA8039A • Rev. 1.0.0 12 FSA8039A — Audio Jack Detection IC Featuring Moisture Sensing