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Technical content
Features
Low On Capacitance: 2.7 pF / 3.1 pF MHL / USB (Typical) Low Pow er Consumption: 30μA Max imum Supports MHL Rev. 2.0 MHL Data Rate: 4.68 Gbps VBUS Pow ers Device w ith No VCC Packaged in 16-Lead UMLP ( 1.8 x 2.6 mm) Over-Voltage Tolerance (OVT) on all USB Ports Up to 5.25 V w ithout External Components
Applications
Cell Phones and Digital Cameras
Description
The FSA3200 is a bi-directional, low-pow er, tw o-port, high-speed, USB2.0 and video data sw itch. Configured as a double- pole, double-throw (DP DT) sw itch for data and a single-pole, double-throw (SPDT) sw itch for ID ; it is optimized for sw itching betw een high- or full -speed USB and Mobile Digital Video sources ( MDV ), including supporting the MHL™ Rev . 2.0 specification. The FSA3200 contains special circuitry on the sw itch I/O pins , for applications w here the V CC supply is pow ered off ( VCC=0), that allow s the device to w ithstand an over -voltage condition. This sw itch is designed to minimize current consumption even w hen the control voltage applied to the control pins is low er than the supply voltage ( VCC). This f eature is especially valuable to mobile applications, such as cell phones, allow ing direct interface w ith the general -purpose I/Os of the baseband processor. Other applications include sw itching and connector sharing in portable cell phones, digital cameras, and notebook computers.
Ordering Information
Part Number Top Mark Operating Temperature Range Package FSA3200UMX GB -40 to +85°C 16-Lead, Ultrathin Molded Leadless Package (UMLP), 1.8 x 2.6 mm Figure 1. Analog Symbol All tradem arks are the property of their respective owners.
Characterization tables below. Figure 2. Simplified Logic of Sw itch Pow er Selection Circuit Table 1. Sw itch Power Selection Truth Table
- Control inputs should never be left floating or unconnected. If the PSO function is used, a w eak pull -up resistor
(3 MΩ) should be used to minimize static current draw . If the PSO function is not used, tie directly to GND.
- PSO control is overridden w ith no VBUS and the pow er selection is sw itched to VCC.
Table 2. Data Switch Select Truth Table
- Control inputs should never be left floating or unconnected. To guarantee default sw itch closure to the USB
position, the SEL pins should be tied to GND w ith a w eak pull- dow n resistor (3 MΩ) to minimize static current draw .
Figure 3. Pin Assignments (Top -Through View)
1 GND Ground
2 D+ Data Sw itch Output (Positive)
3 D- Data Sw itch Output (Negative)
4 PSO Pow er Select Override
5 SEL1 Data Sw itch Select
6 USB- USB Differential Data (Negative)
7 USB+ USB Differential Data (Positive)
8 GND Ground
9 SEL2 ID Sw itch Select
10 MDV- MDV Differential Data (Negative)
11 MDV + MDV Differential Data (Positive)
12 IDUSB ID Sw itch MUX Output for USB
13 IDMDV ID Sw itch MUX Output for MDV
14 IDCOM ID Sw itch Common
15 VBUS Device Pow er w hen VCC Not Available
16 VCC Device Pow er from System(4)
- Device automatically sw itches f r om VBUS w hen valid VCC minimum voltage is present.
www.onsemi.com FSA3200 — Two-Port, High-Speed USB2.0 Switch with Mobile High-Definition Link (MHL™) Absolute Maximum Ratings Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol Parameter Min. Max. Unit VCC, VBUS Supply Voltage -0.5 5.5 V VCNTRL DC Input Voltage ( SELn, PSO)(5) -0.5 VCC V VSW (6) DC Sw itch I/O Voltage(5) -0.50 5.25 V IIK DC Input Diode Current -50 mA IOUT DC Output Current 100 mA TSTG Storage Temperature -65 +150 °C MSL Moisture Sensitivity Level (JEDEC J -STD-020A) 1 ESD Human Body Model, JEDEC: JESD22-A114 All Pins 3.5 kV IEC 61000-4-2, Level 4, for D+/D- and VCC Pins(7) Contact 8.0 IEC 61000-4-2, Level 4, for D+/D- and VCC Pins(7) Air 15.0 Charged Device Model, JESD22-C10 1 2.0 Notes: 5. The input and output negative ratings may be exceeded if the input and output diode current ratings are observed. 6. VSW refers to analog data sw itch paths (USB, MDV, and ID). 7. Testing performed in a system environment using TVS diodes. Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. ON Semiconductor does not recommend exceeding them or designing to Absolute Maximum Ratings. Symbol Parameter Min. Max. Unit VBUS Supply Voltage Running f r om VBUS Voltage 4.20 5.25 V VCC Supply Voltage Running from V CC 2.7 4.5 V tRAMP(VBUS) Pow er Supply Slew Rate from VBUS 100 1000 µs/V tRAMP(VCC) Pow er Supply Slew Rate from VCC 100 1000 µs/V ΘJA Thermal Resistance 336 C°/W VCNTRL Control Input Voltage (SELn, PSO)(8) 0 4.5 V VSW(USB) Sw itch I/O Voltage (USB and ID Sw itch Paths) -0.5 3.6 V VSW(MDV) Sw itch I/O Voltage (MDV Sw itch Path) 1.65 3.45 V TA Operating Temperature -40 +85 °C Note: 8. The control inputs must be held HIGH or LOW; they must not float.
www.onsemi.com FSA3200 — Two-Port, High-Speed USB2.0 Switch with Mobile High-Definition Link (MHL™) USB High-Speed AC Electrical Characteristics Typical values are at TA= -40ºC to +85ºC. Symbol Parameter Condition VCC (V) Typ. Unit tSK(P) Skew of Opposite Transitions of the Same Output(11) CL=5 pF, RL=50 Ω, Figure 9 3.0 to 3.6 3 ps tJ Total Jitter(11) RL=50 Ω, CL=5 pf, tR=tF=500 ps (10-90%) at
480 Mbps, PN7
3.0 to 3.6 15 ps Note : 11. Guaranteed by characterization. Typical values are at TA= -40ºC to +85ºC. Symbol Parameter Condition VCC (V) Typ. Unit tSK(P) Skew of Opposite Transitions of the Same Output(12) RPU=50 Ω to VCC, CL=0 pF 3.0 to 3.6 3 ps tJ Total Jitter(12) f=2.25 Gbps, PN7, RPU=50 Ω to VCC, CL=0 pF 3.0 to 3.6 15 ps Note : 12. Guaranteed by characterization. Capacitance Typical values are at TA= -40ºC to +85ºC. Symbol Parameter Condition Typ. Unit CIN Control Pin Input Capacitance(13) VCC=0 V, f= 1 MHz 1.5 pF CON(USB) USB Path On Capacitance(13) VCC=3.3 V, f=240 MHz , Figure 15 3.1 COFF(USB) USB Path Off Capacitance(13) VCC=3.3 V, f=240 MHz , Figure 14 1.6 CON(MDV) MDV Path On Capacitance(13) VCC=3.3 V, f=240 MHz , Figure 15 2.7 COFF(MDV) MDV Path Off Capacitance(13) VCC=3.3 V, f=240 MHz , Figure 14 1.1 Note : 13. Guaranteed by characterization.
Figure 20. 16-Lead, Ultrathin Molded Leadless Package (UMLP) and conditions, specificall y the warranty therein, which covers ON Sem iconductor products. B. DIMENSIONS ARE IN MILLIMETERS. E. DRAWING FILENAME: MKT-UMLP16Arev4.
0.10 C A B
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