FSA3031 ONSEMI | Alldatasheet
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© 2011 Fairchild Semiconductor Corporation www.fairchildsemi.com FSA3031 Rev. 1.0.4 FSA3031 — Dual High-Speed USB2.0 Switch with Mobile High-Definition Link (MHL™) Switch FSA3031 — Dual High-Speed USB2.0 with Mobile High-Definition Link (MHL™)
Features
Low On Capacitance: 4.6 pF/6.75 pF MHL/USB (Typical) Low Power Consumption: 30 μA Maximum Supports MHL Rev. 2.0 Passes 1080 p/60 fps (3 Gbps) MHL Data Eye Diagram Mask Compliance MHL Data Rate: ≥4.7Gbps with Ideal Input Source Packaged in 12-Lead UMLP (1.8 x 1.8 mm) Over-Voltage Tolerance (OVT) on all USB Ports Up to 5.25 V without External Components
Applications
Cell Phones and Digital Cameras IMPORTANT NOTE: For additional performance information, please contact interface@fairchildsemi.com.
Description
The FSA3031 is a bi-directional, low-power, high-speed, 3:1, dual USB2.0 and MHL switch. Configured as a double-pole, triple-throw (DP3T) switch; it is optimized for switching between dual high- or full-speed USB and Mobile High-Definition Link sources (MHL™ Rev. 2.0 specification). The FSA3031 contains special circuitry on the switch I/O pins, for applications where the V CC supply is powered off (VCC=0), that allows the device to withstand an over-voltage condition. This switch is designed to minimize current consumption even when the control voltage applied to the cont rol pins is lower than the supply voltage (V CC). This feature is especially valuable to mobile applications, such as cell phones; allowing direct interface with the general-purpose I/Os of the baseband processor. Other applications include switching and connector sharing in portable cell phones, digital cameras, and notebook computers.
Ordering Information
Part Number Top Mark Operating Temperature Range Package FSA3031UMX LX -40 to +85°C 12-Lead, Ultrathin Molded Leadless Package (UMLP), 1.8 mm x 1.8 mm Figure 1. Typical Application All trademarks are the property of their respective owners.
Figure 2. Analog Symbol Table 1. Data Switch Select Truth Table
- Control inputs should never be left floating or unc onnected. To guarantee default sw itch closure to the USB
Figure 3. Pin Assignments Figure 4. Top Through View
1 SEL0 Data Switch Select
2 SEL1 Data Switch Select
3 USB1+ USB Differential Data (Positive) – Source 1
4 USB1- USB Differential Data (Negative) – Source 1
5 USB2+ USB Differential Data (Positive) – Source 2
6 USB2- USB Differential Data (Negative) – Source 2
7 MHL+ MHL Differential Data (Positive)
8 MHL- MHL Differential Data (Negative)
9 GND Ground
10 D- Data Switch Output (Positive)
11 D+ Data Switch Output (Negative)
12 VCC Device Power from System
© 2011 Fairchild Semiconductor Corporation www.fairchildsemi.com FSA3031 Rev. 1.0.4 4 FSA3031 — Dual High-Speed USB2.0 Switch with Mobile High-Definition Link (MHL™) Switch Absolute Maximum Ratings Stresses exceeding the absolute maximum ratings may dam age the device. The device may not function or be operable above the recommended operating conditions and st ressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol Parameter Min. Max. Unit VCC Supply Voltage -0.5 6.0 V VCNTRL DC Input Voltage (SEL[1:0]) (2) -0.5 VCC V VSW (3) DC Switch I/O Voltage (2) USB -0.50 VCC V MHL -0.50 VCC IIK DC Input Diode Current -50 mA IOUT Switch DC Output Current (Continuous) USB 60 mA MHL 60 mA IOUTPEAK Switch DC Output Peak Current (Pulsed at 1m Duration, <10% Duty Cycle) USB 150 mA MHL 150 mA TSTG Storage Temperature -65 +150 °C MSL Moisture Sensitivity Level (JEDEC J-STD-020A) 1 ESD Human Body Model, JEDEC: JESD22-A114 All Pins 4 kV IEC 61000-4-2, Level 4, for D+/D- and VCC Pins(4) Contact 8 IEC 61000-4-2, Level 4, for D+/D- and VCC Pins(4) Air 15 Charged Device Model, JESD22-C101 2 Notes: 2. The input and output negative ratings may be exceeded if the input and output diode current ratings are observed. 3. V SW refers to analog data switch paths (USB1, MHL, and USB2). 4. Testing performed in a system environment using TVS diodes. Recommended Operating Conditions The Recommended Operatin g Conditions table de fines the conditions for act ual device operatio n. Recommended operating conditions are specified to en sure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to Absolute Maximum Ratings. Symbol Parameter Min. Max. Unit VCC Supply Voltage 2.5 4.5 V tRAMP(VCC) Power Supply Slew Rate 100 1000 µs/V Θ JA Thermal Resistance 230 C°/W VCNTRL Control Input Voltage (SEL[1:0])(5) 0 4.5 V VSW(USB) Switch I/O Voltage (USB1/USB2 Switch Paths) -0.5 3.6 V VSW(MHL) Switch I/O Voltage (MHL Switch Path) 1.65 3.45 V TA Operating Temperature -40 +85 °C Note: 5. The control inputs must be held HIGH or LOW; they must not float.
© 2011 Fairchild Semiconductor Corporation www.fairchildsemi.com FSA3031 Rev. 1.0.4 5 FSA3031 — Dual High-Speed USB2.0 Switch with Mobile High-Definition Link (MHL™) Switch All typical values are at TA=25°C unless otherwise specified. Symbol Parameter Condition V CC (V) TA=- 40°C to +85°C Unit Min. Typ. Max. VIK Clamp Diode Voltage I IN=-18 mA 2.5 -1.2 V VIH Control Input Voltage, High SEL[1:0] 2.5 to 4.5 1.0 V VIL Control Input Voltage, Low SEL[1:0] 2.5 to 4.5 0.5 V IIN Control Input Leakage, SEL[1:0] VSW=0 to 3.6 V, VCNTRL=0 to VCC 4.5 -0.5 0.5 µA IOZ(MHL) Off-State Leakage for Open MHL Data Paths VSW=1.65≤ MHL IOZ(USB) Off-State Leakage for Open USB Data Paths VSW=0 ≤ USB≤ 3.6 V, SEL[1:0]=VCC 4.5 -0.5 0.5 µA ICL(MHL) On-State Leakage for Closed MHL Data Paths(6) VSW=1.65≤ MHL ≤ 3.45 V, SEL0=GND, SEL1=VCC, Other Side of Switch Float 4.5 -0.5 0.5 µA ICL(USB) On-State Leakage for Closed USB Data Paths(6) VSW=0 ≤ USB ≤ 3.6 V SEL[1:0]=GND or SEL1=GND, SEL0=VCC, Other Side of Switch Float 4.5 -0.5 0.5 µA IOFF Power-Off Leakage Current (All I/O Ports) VSW=0 V or 3.6 V, Figure 5 0 -0.5 0.5 µA RON(USB) HS Switch On Resistance (USB to D Path) VSW=0.4 V, ION=-8 mA SEL[1:0]=GND or SEL1=GND, SEL0=VCC, Figure 6 2.5 3.9 6.5 Ω RON(MHL) HS Switch On Resistance (MHL to D Path) VSW=VCC-1050 mV, SEL0=GND, SEL1=VCC, ION=-8 mA, Figure 6 2.5 5 Ω ∆RON(MHL) Difference in RON Between MHL Positive-Negative VSW=VCC-1050 mV, SEL0=GND, SEL1=VCC, ION=-8 mA, Figure 6, 2.5 0.03 Ω ∆RON(USB) Difference in RON Between USB Positive-Negative VSW=0.4 V, ION=-8 mA, SEL[1:0]=GND or SEL1=GND, SEL0=VCC Figure 6 2.5 0.22 Ω RONF(MHL) Flatness for R ON MHL Path VSW=1.65 to 3.45 V, SEL0=GND, SEL1=VCC, ION=-8 mA, Figure 6 2.5 1 Ω ICC Quiescent Current V CNTRL=0 or 4.5 V, IOUT=0 4.5 30 µA ICCT Delta Increase in Quiescent Current per Control Pin VCNTRL= 1.65 V, IOUT=0 4.5 18 µA VCNTRL= 2.5 V, IOUT=0 4.5 10 Note: 6. For this test, the data switch is closed with the respective switch pin floating.
© 2011 Fairchild Semiconductor Corporation www.fairchildsemi.com FSA3031 Rev. 1.0.4 7 FSA3031 — Dual High-Speed USB2.0 Switch with Mobile High-Definition Link (MHL™) Switch USB High-Speed AC Electrical Characteristics Typical values are at TA= -40ºC to +85ºC. Symbol Parameter Condition V CC(V) Typ. Unit tSK(P) Skew of Opposite Transitions of the Same Output(8) CL=5 pF, RL=50 Ω, Figure 9 3.0 to 3.6 7 ps tJ Total Jitter(8) RL=50 Ω, CL=5 pF, tR=tF=500 ps (10-90%) at 480 Mbps, PN7 3.0 to 3.6 18 ps Note: 8. Guaranteed by characterization. Typical values are at TA= -40ºC to +85ºC. Symbol Parameter Condition V CC(V) Typ. Unit tSK(P) Skew of Opposite Transitions of the Same Output(9) RPU=50 Ω to VCC, CL=0 pF 3.0 to 3.6 3 ps tJ Total Jitter(9) f=2.25 Gbps, PN7, RPU=50 Ω to VCC, CL=0 pF 3.0 to 3.6 23 ps Note: 9. Guaranteed by characterization. Capacitance Typical values are at TA= -40ºC to +85ºC. Symbol Parameter Condition Typ. Max. Unit CIN Control Pin Input Capacitance(10) V CC=0 V, f=1 MHz 2.5 pF CON(USB) USB Path On Capacitance(10) V CC=3.3 V, f=240 MHz, Figure 15 6.75 pF COFF(USB) USB Path Off Capacitance(10) V CC=3.3 V, f=240 MHz, Figure 13 2.5 pF CON(MHL) MHL Path On Capacitance(10) V CC=3.3 V, f=240 MHz, Figure 15 4.6 pF COFF(MHL) MHL Path Off Capacitance(10) V CC=3.3 V, f=240 MHz, Figure 13 2.5 pF Note: 10. Guaranteed by characterization.
Figure 20. 12-Lead, Ultrathin Molded Leadless Package (UMLP) specifically the warranty therein, which covers Fairchild products. http://www.fairchildsemi.com/packaging/. B. DIMENSIONS ARE IN MILLIMETERS. E. DRAWING FILENAME: MKT-UMLP12Arev4.
0.10 CAB
© 2011 Fairchild Semiconductor Corporation www.fairchildsemi.com FSA3031 Rev. 1.0.4 13 FSA3031 — Dual High-Speed USB2.0 Switch with Mobile High-Definition Link (MHL™) Switch
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