FSA2269 ONSEMI | Alldatasheet

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© 2007 Fairchild Semiconductor Corporation www.f airchildsemi.com FSA2269 / FSA2269TS • Rev. 1.1.5 FSA2269 / FSA2269TS — Low-Voltage Dual-SPDT (0.4) Analog Switch with Negative Swing Audio Capability FSA2269 / FSA2269TS — Low-Voltage Dual-SPDT (0.4 Analog Switch with Negative Swing Audio Capability

Features

 0.4 Ω Typical On Resistance (RON) for +3.0 V Supply  0.25 Ω Maximum RON Flatness for +3.0 V Supply  -3 db Bandwidth: > 50 MHz  Low-ICCT Current Over an Expanded Control Input Range  Packaged in 10-Lead MicroPak™, UMLP, and WLCSP  Power-Off Protection on Common Ports  Broad VCC Operating Range: 1.65 to 4.5 V  Noise Immunity Termination Resistors in FSA2269TS

Applications

 Cell Phone, PDA, Digital Camera, and Notebook  LCD Monitor, TV, and Set-Top Box

Description

The FSA2269 is a high-performance, dual Single-Pole Double-Throw (SPDT) analog switch with negative swing audio capability. The FSA2269 features ultra-low R ON of 0.4  (typical) at 3.0 V VCC. The FSA2269 operates over a wide V CC range of 1.65 V to 4.5 V, is fabricated with sub-micron CMOS technology to achieve fast switching speeds, and is designed for break-before-make operation. The select input is TTL-level compatible. The FSA2269 features very low quiescent current even when the control voltage is lower than the V CC supply. This feature suits mobile handset applications by allowing direct interface with baseband processor general-purpose I/Os with minimal battery consumption. The FSA2269TS includes termination resistors that improve noise immunity during overshoot excursions, off-isolation coupling, or “pop-minimization.”

Ordering Information

Part Number Top Mark Package Description FSA2269L10X HL 10-Lead, MicroPak, JEDEC MO-255, 1.6 x 2.1 mm FSA2269UMX HP 10-Lead, Quad Ultrathin Molded Leadless Package (UMLP), 1.4 x 1.8 mm, 0.4 mm Pitch FSA2269TSL10X HU 10-Lead, MicroPak, JEDEC MO-255, 1.6 x 2.1 mm FSA2269TSUMX HT 10-Lead, Quad Ultrathin Molded Leadless Package(UMLP), 1.4 x 1.8 mm, 0.4 mm Pitch FSA2269UCX N9 12-Ball, Wafer-Level Chip Scale Package (WLCSP),1.2 x 1.6 mm, 0.4 mm Pitch Analog Symbols Figure 1. FSA2269 Figure 2. FSA2269TS (with Slow Turn On)

© 2007 Fairchild Semiconductor Corporation www.f airchildsemi.com FSA2269 / FSA2269TS • Rev. 1.1.5 3 FSA2269 / FSA2269TS — Low-Voltage Dual-SPDT (0.4) Analog Switch with Negative Swing Audio Capability Absolute Maximum Ratings Stresses exceeding the absolute maximum ratings may damag e the device. Functional operation above the recommended operating conditions is not implied. In addi tion, extended exposure to stresses above the recommended operating conditions may affect device reliability. Absolute maximum ratings are stress ratings only. Symbol Parameter Min. Max. Unit VCC Supply Voltage -0.5 5.5 V VSW Switch I/O Voltage(1) 1B0, 1B1, 2B0, 2B1, 1A, 2A Pins VCC -4.6 5.5 V VCNTRL Control Input Voltage(1) S1, S2 -0.5 VCC +0.3 V ISW Switch I/O Current (Continuous) 350 mA ISWPEAK Peak Switch Current Pulsed at 1ms Duration, <10% Duty Cycle 500 mA TSTG Storage Temperature Range -65 +150 C TJ Maximum Junction Temperature +150 C TL Lead Temperature Soldering, 10 Seconds +260 °C MSL Moisture Sensitivity Level, JEDEC J-STD-020A 1 ESD Human Body Model, JEDEC: JESD22-A114 I/O to GND 12 kV I/O to GND FSA2269UCX Power to GND 8 All Other Pins 7 Charged Device Model, JEDEC: JESD22-C101 2 Note: 1. Input and output negative ratings may be exceeded if input and output diode current ratings are observed. Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal perfo rmance to the datasheet specifications. Fairchild does n ot recommend exceeding them or designing to absolute maximum ratings. Symbol Parameter Min. Max. Unit VCC Supply Voltage(2) 1.65 4.50 V VS1, S2 Control Input Voltage 0V VCC V VSW Switch I/O Voltage VCC -4.3 VCC V TA Operating Temperature -40 +85 ºC Note: 2. For 4.5 V operation, SEL frequency (pins S1 & S2) should not e xceed 100 Hz and 50 ns edge rate.

© 2007 Fairchild Semiconductor Corporation www.f airchildsemi.com FSA2269 / FSA2269TS • Rev. 1.1.5 4 FSA2269 / FSA2269TS — Low-Voltage Dual-SPDT (0.4) Analog Switch with Negative Swing Audio Capability All typical values are TA=25°C unless otherwise specified. Symbol Parameter Conditions VCC (V) TA=+25°C TA=-40 to +85°C Unit VIH Input Voltage High 3.60 to 4.50 1.70 3.00 to 3.60 1.50 V 2.70 to 3.00 1.35 2.30 to 2.70 1.30 1.65 to 1.95 0.90 VIL Input Voltage Low 3.60 to 4.50 0.7 V 2.70 to 3.60 0.5 V 2.30 to 2.70 0.4 1.65 to 1.95 0.4 IIN Control Input Leakage (S1, S2) VIN=0 to VCC 1.65 to 4.50 -0.5 0.5 µA INO(0FF), INC(OFF) Off Leakage Current of Port nB0 and nB1 (FSA2269 only) nA=0.5 V, VCC–0.5 V nB0 or nB1=VCC- 0.5 V, 0.5 V, or Floating Figure 8 1.95 to 4.50 -50 50 -250 250 nA IA(ON) On Leakage Current of Port nA nA=0.5 V, VCC–0.5 V nB0 or nB1=VCC- 0.5 V, 0.5 V, or Floating Figure 9 1.95 to 4.50 -20 20 -150 150 nA IOFF Power-Off Leakage Current (Common Port Only 1A, 2A) (FSA2269) Common Port (1A, 2A), VIN=0 V to 4.5 V, VCC=0V nB0, nB1=Floating 0 ±1 µA Power-Off Leakage Current (Common Port Only 1A, 2A) (FSA2269TS) Common Port (1A, 2A), VIN=0V to 4.5 V, VCC=0 V nB0, nB1=0 V or Floating 0 ±45 µA RON Switch On Resistance(3,6) ION=100 mA, nB0 or nB1=0.7 V, 3.6 V,

4.5 V, Figure 7

4.50 0.30 Ω ION=100 mA, nB0 or nB1=0.7 V, 3.6 V, Figure 7 3.00 0.40 0.80 ION=100mA, nB0 or

2.3 V, Figure 7

2.30 0.52 ION=100 mA, nB0 or nB1=0V, 0.7 V,

1.65 V, Figure 7

1.65 1.00 ∆RON On Resistance Matching Between Channels(4) ION=100 mA, nB0 or nB1=0.7 V 4.50 0.04 0.13 Ω 3.00 0.06 0.13 2.30 0.12 1.65 1.00 Continued on the following page…

© 2007 Fairchild Semiconductor Corporation www.f airchildsemi.com FSA2269 / FSA2269TS • Rev. 1.1.5 5 FSA2269 / FSA2269TS — Low-Voltage Dual-SPDT (0.4) Analog Switch with Negative Swing Audio Capability All typical values are TA=25°C unless otherwise specified. Symbol Parameter Conditions VCC (V) TA=+25ºC TA=-40 to +85ºC Unit RFLAT(ON) On Resistance Flatness(5) IOUT=100 mA, nB0 or nB1=0V to VCC 4.50 0.25 Ω 3.00 0.25 2.30 0.5 1.65 0.6 RTERM Internal Termination Resistors(6) (FSA2269TS only) 10 kΩ ICC Quiescent Supply Current VIN=0 or VCC, IOUT=0 4.50 -100 100 -500 500 nA ICCT Increase in ICC per Input Input at 2.6 V 4.50 3.0 10.0 µA Input at 1.8 V 7.0 15.0 Notes: 3. On resistance is determined by the voltage drop betwee n A and B pins at the indicated current through the switch. 4. ∆ RON=RON max – RON min measured at identical VCC, temperature, and voltage. 5. Flatness is defined as the difference between the ma ximum and minimum value of on resistance (RON) over the specified range of conditions. 6. Guaranteed by characterization, not production tested.

© 2007 Fairchild Semiconductor Corporation www.f airchildsemi.com FSA2269 / FSA2269TS • Rev. 1.1.5 7 FSA2269 / FSA2269TS — Low-Voltage Dual-SPDT (0.4) Analog Switch with Negative Swing Audio Capability All typical value are TA=25°C unless otherwise specified. Symbol Parameter Conditions VCC (V) TA=+25ºC TA=-40 to +85°C Unit Figure Q Charge Injection CL=1.0 nF, VS=0 V, RS=0 Ω 1.65 to 4.50 25 pC Figure 16 OIRR Off Isolation f=100 kHz, RL=50 Ω, CL=0 pF 1.65 to 4.50 -70 dB Figure 14 Xtalk Crosstalk f=100 kHz, RL=50 Ω, CL=0 pF 1.65 to 4.50 -70 dB Figure 15 BW -3db Bandwidth RL=50 Ω, CL=0 pF 1.65 to 4.50 >50 MHz Figure 13 THD Total Harmonic Distortion f=20 Hz to 20 kHz, RL=32 , VIN=2 VPP VBIAS=0 V 1.65 to 4.50 .06 % Figure 19 Notes: 7. Guaranteed by characterization, not production tested. Capacitance Symbol Parameter Conditions VCC (V) TA=+25°C Unit Figure Min. Typ. Max. CIN Control Pin Input Capacitance f=1 MHz 0 2.5 pF Figure 17 COFF B Port Off Capacitance f=1 MHz 3.3 30 pF Figure 17 CON A Port On Capacitance f=1 MHz 3.3 120 pF Figure 18

Figure 20. 10-Lead MicroPak™ specifically the warranty therein, which covers Fairchild products. http://www.fairchildsemi.com/packaging/. REGISTRATION MO-255, VARIATION UABD . B. DIMENSIONS ARE IN MILLIMETERS. E. DRAWING FILENAME: MKT-MAC10Arev5.

0.10 C A B

0.55 MAX

1.62 KEEPOUT ZONE, NO TRACES

Figure 21. 10-Lead, Quad Ultrathin Molded Leadless Package (UMLP) specifically the warranty therein, which covers Fairchild products. http://www.fairchildsemi.com/packaging/. B. DIMENSIONS ARE IN MILLIMETERS. E. DRAWING FILENAME: MKT-UMLP10Arev5.

Figure 22. 12-Ball, Wafer Level Chip-Scale Package (WLCSP) specifically the warranty therein, which covers Fairchild products. http://www.fairchildsemi.com/packaging/. A. NO JEDEC REGISTRATION APPLIES. B. DIMENSIONS ARE IN MILLIMETERS. ±39 MICRONS (547-625 MICRONS). G. DRAWING FILENAME: MKT-UC012ACrev1.

0.005 C A B

© 2007 Fairchild Semiconductor Corporation www.f airchildsemi.com FSA2269 / FSA2269TS • Rev. 1.1.5 14 FSA2269 / FSA2269TS — Low-Voltage Dual-SPDT (0.4) Analog Switch with Negative Swing Audio Capability

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