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Technical content

Features

 0.4Ω Typical On Resistance (RON) for +3.0V Supply  0.25Ω Maximum RON Flatness for +3.0V Supply  -3db Bandwidth: > 50MHz  Low ICCT Current Over an Expanded Control Input Range  Packaged in Pb-free 10-Lead µMLP (1.4 x 1.8mm)  Power-Off Protection on Common Ports  Broad VCC Operating Range: 1.65 to 4.3V  HBM JEDEC: JESD22-A114 - I/O to GND: 13.5kV - Power to GND: 16.0kV  Noise Immunity Termination Resistors in FSA2268T

Applications

 Cell Phone, PDA, Digital Camera, and Notebook  LCD Monitor, TV, and Set-Top Box

Description

The FSA2268 is a high-performance, dual Single Pole Double Throw (SPDT) analog switch that features ultra-low R ON of 0.4 (typical) at 3.0V V CC. The FSA2268 operates over a wide V CC range of 1.65V to 4.3V and is designed for break-before-make operation. The select input is TTL-level compatible. The FSA2268 features very low quiescent current even when the control voltage is lower than the V CC supply. This feature suits mobile handset applications by allowing direct interface with baseband processor general-purpose I/Os with minimal battery consumption. The FSA2268T includes termination resistors that improve noise immunity during overshoot excursions, off-isolation coupling, or “pop-minimization.”

Ordering Information

Part Number Top Mark Package Description FSA2268UMX GF 10-Lead, Quad Ultrathin Molded Leadless Package (UMLP), 1.4 x 1.8mm, 0.4mm Pitch FSA2268TUMX GH 10-Lead, Quad Ultrathin Molded Leadless Package (UMLP), 1.4 x 1.8mm, 0.4mm Pitch FSA2268L10X GH 10-Lead, MicroPak™, 1.6mm Wide Analog Symbols Figure 1. FSA2268 Figure 2. FSA2268T (with Noise Termination Resistors)

FSA2268 / FSA2268T — Low-Voltage Dual-SPDT (0.4) Analog Switch with 16kV ESD Absolute Maximum Ratings Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol Parameter Min. Max. Units VCC Supply Voltage -0.5 5.5 V VSW Switch I/O Voltage(1) 1B0, 1B1, 2B0, 2B1, 1A, 2A Pins -0.5 VCC + 0.3 V T Version nBn Pin Off 0 1.4 VIN Control Input Voltage(1) S1, S2 -0.5 5.5 V IIK Input Clamp Diode Current -50 mA ISW Switch I/O Current (Continuous) 350 mA ISWPEAK Peak Switch Current (Pulsed at 1ms Duration, <10% Duty Cycle) 500 mA TSTG Storage Temperature Range -65 +150 °C TJ Maximum Junction Temperature +150 °C TL Lead Temperature (Soldering, 10 seconds) +260 °C MSL Moisture Sensitivity Level (JEDEC J-STD-020A) 1 Level ESD Human Body Model, JEDEC: JESD22-A114 I/O to GND 13.5 kV Power to GND 16.0 All Other Pins 9.0 Charged Device Model, JEDEC: JESD22-C101 2.0 kV Note: 1. Input and output negative ratings may be exceeded if input and output diode current ratings are observed. Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. ON Semiconductor does not recommend exceeding them or designing to Absolute Maximum Ratings. Symbol Parameter Min. Max. Units VCC Supply Voltage 1.65 4.30 V VIN Control Input Voltage 0 VCC V VSW Switch I/O Voltage 0 VCC V TA Operating Temperature -40 +85 °C www.onsemi.com

FSA2268 / FSA2268T — Low-Voltage Dual-SPDT (0.4) Analog Switch with 16kV ESD All typical values are at 25ºC unless otherwise specified. Symbol Parameter Conditions VCC (V) TA=+25ºC TA=-40 to +85ºC Unit RFLAT(ON) On Resistance Flatness(4)(5) IOUT=100mA, nB0 or nB1=0V to VCC 4.30 0.25 Ω 3.00 0.25 2.30 0.5 1.65 0.6 RTERM Internal Termination Resistors(6) 200 Ω ICC Quiescent Supply Current VIN=0 or VCC, IOUT=0 4.30 -100 100 -500 500 nA ICCT Increase in ICC per Input Input at 2.6V 4.30 3 7 µA Input at 1.8V 7 15 Notes: 2. On resistance is determined by the voltage drop between A and B pins at the indicated current through the switch. 3. ∆RON=RON max – RON min measured at identical VCC, temperature, and voltage. 4. Flatness is defined as the difference between the maximum and minimum value of on resistance (RON) over the specified range of conditions. 5. Guaranteed by characterization, not production tested, for VCC=1.65-3.00V. 6. Guaranteed by characterization, not production tested. www.onsemi.com

Figure 18. 10-Lead Quad Ultrathin Molded Leadless Package (UMLP) and conditions, specifically the warranty therein, which covers ON Semiconductor products. B. DIMENSIONS ARE IN MILLIMETERS. E. DRAWING FILENAME: MKT-UMLP10Arev3.

0.10 C A B

Figure 19. 10-Lead, MicroPak™, 1.6mm Wide and conditions, specifically the warranty therein, which covers ON Semiconductor products. REGISTRATION MO-255, VARIATION UABD . B. DIMENSIONS ARE IN MILLIMETERS. E. DRAWING FILENAME: MKT-MAC10Arev5.

0.55 MAX

1.62 KEEPOUT ZONE, NO TRACES

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