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Technical content

Features

 0.8Ω Typical On Resistance (RON) for +3.0V Supply  0.40Ω Max imum RON Flatness for +3.0V Supply  -3db Bandw idth: > 50MHz  Low ICCT Current Over an Expanded Control Input Range  Pac kaged in 10- Lead UMLP (1.4 x 1.8mm)  Pow er-Off Protection on Common Ports  Broad VCC Operating Range: 1.65 to 4. 4V  ESD HBM JEDEC: JESD22-A114 - I/O to GND: 8.5kV - Pow er to GND: 16.0kV

Applications

 Cell Phone, PDA, Digital Camera, and Notebook  LCD Monitor, TV, and Set -Top Box

www.onsemi.com FSA2259 — Low-Voltage, Dual-SPDT (0.8Ω) Analog Switch with 16kV ESD

Description

The FSA2259 is a high- performance, dual, Single Pole Double Throw (SPDT) analog sw itch that features low RON of before-make operation. The select input is TTL-level compatible. The FSA2259 features very low quiescent current even w hen the control voltage is low er than the V CC supply. This feature suits mobile handset applications by allow ing direct interface w ith baseband processor general -purpose I/Os w ith minimal battery consumption. rdering Information Part Number Top Mark Operating Temperature Range Package FSA2259UMX JT -40 to +85°C 10-Lead, Quad, Ultrathin Molded Leadless Package (UMLP), 1.4 x 1.8mm Analog Symbol 1B0 1B1 1A 2B0 2B1 2A Figure 1. FSA2259

Figure 2. 10-Pin UMLP (Top Through View)

1 VCC Supply Voltage

4 S1 Sw itch Select Pins

6 GND Ground

8 S2 Sw itch Select Pins

www.onsemi.com FSA2259 — Low-Voltage, Dual-SPDT (0.8Ω) Analog Switch with 16kV ESD Absolute Maximum Ratings Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and st ressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol Parameter Min. Max. Units VCC Supply Voltage -0.5 5.5 V VSW Sw itch I/O Voltage(1) 1B0, 1B1, 2B0, 2B1, 1A, 2A Pins -0.5 VCC + 0.3 V VIN Control Input Voltage (1) S1, S2 -0.5 5.5 V IIK Input Clamp Diode Current -50 mA ISW Sw itch I/O Current (Continuous) 350 mA ISWPEAK Peak Sw itch Current (Pulsed at 1ms Duration, <10% Duty Cycle) 500 mA TSTG Storage Temperature Range -65 +150 °C TJ Maximum Junction Temperature +150 °C TL Lead Temperature (Soldering, 10 seconds ) +260 °C ESD Human Body Model, JEDEC: JESD22-A114 I/O to GND 8.5 kV Pow er to GND 16.0 All Other Pins 8.0 Charged Device Model, JEDEC: JESD22-C10 1 2.0 kV Note : 1. Input and output negative ratings may be exceeded if input and output diode current ratings are observed. Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. ON Semiconductor does not recommend exceeding them or designing to Absolute Maximum Ratings . Symbol Parameter Min. Max. Units VCC Supply Voltage 1.65 4.40 V VIN Control Input Voltage 0 VCC V VSW Sw itch I/O Voltage 0 VCC V TA Operating Temperature -40 +85 °C

A. DIMENSIONS ARE IN MILLIMETERS.

0.10 C A B

Figure 16. 10-Lead Quad Ultr athin Molded Leadless Package (U MLP)

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