FSA2257_07 FAIRCHILD | Alldatasheet

Document overview

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Technical content

Features

■ Maximum 1.15Ω On Resistance (RON) for 4.5V Supply ■ 0.3Ω Maximum RON Flatness for +5V Supply ■ Space-Saving Pb-Free MicroPak™ Packaging ■ Broad VCC Operating Range: 1.65V to 5.5V ■ Fast Turn-on / Turn-off Time ■ Break-Before-Make Enable Circuitry ■ Over-Voltage Tolerant TTL-Compatible Control Input

Applications

■ Cell Phone ■ PDA ■ Ultra-Portable

Description

The FSA2257 is a high-performance bi-directional dual Single-Pole/Double-Throw (SPDT) analog switch. This switch can be configured as either a multiplexer or a de- multiplexer by select pins. The device features ultra-low RON of 1.3 Ω maximum at 4.5V V CC and operates over the wide VCC range of 1.65V to 5.5V. The device is fabri- cated with submicron CMOS technology to achieve fast switching speeds and is designed for break-before-make operation. The select input is TTL-level compatible.

Ordering Information

Note: 1. Lead-free package per JEDEC J-STD-020B. Device available in tape and reel only. Figure 1. Block Diagram

5000 Units on

2500 Units on

4000 Units on

MicroPak™ is a trademark of Fairchild Semiconductor Corporation.

FSA2257 Low RON Low-Voltage Dual SPDT Bi-Directional Analog Switch © 2006 Fairchild Semiconductor Corporation www.fairchildsemi.com FSA2257 Rev. 1.0.3 3 Absolute Maximum Ratings Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be opera- ble above the recommended operating conditions and stressing the parts to these levels is not recommended. In addi- tion, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Note: 2. The input and output negative voltage ratings may be exceeded if the input and output diode current ratings are observed. Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to absolute maximum ratings. Note: 3. Unused control inputs must be held HIGH or LOW. They may not float. Symbol Parameter Min. Max. Unit VCC Supply Voltage –0.5 +6.0 V VSW DC Switch Voltage(2) –0.5 V CC +0.5 V VIN DC Input Voltage(2) –0.5 +6.0 V IIK Input Diode Current –50 mASwitch Current 200 Peak Switch Current (pulsed at 1ms duration, <10% duty cycle) 400 TSTG Storage Temperature Range –65 +150 °C TJ Maximum Junction Temperature +150 °C TL Lead Temperature (soldering, 10 seconds) +260 °C ESD Human Body Model 8000 V Symbol Parameter Min. Max. Unit VCC Supply Voltage 1.65 5.5 V VIN Control Input Voltage(3) 0 V CC V VSW Switch Input Voltage 0 V CC V TA Operating Temperature −40 +85 °C

FSA2257 Low RON Low-Voltage Dual SPDT Bi-Directional Analog Switch © 2006 Fairchild Semiconductor Corporation www.fairchildsemi.com FSA2257 Rev. 1.0.3 4 All typical values are at 25°C unless otherwise specified. Notes: 4. On resistance is determined by the voltage drop between A and B pins at the indicated current through the switch. 5. ΔRON = RONmax – RONmin measured at identical VCC, temperature, and voltage. 6. Flatness is defined as the difference between the maximum and minimum value of on resistance over the specified range of conditions. Symbol Parameter Conditions VCC (V) TA=+25°C TA= −40°C to +85°C VIH Input Voltage High 2.7 to 3.6 2.0 V 4.5 to 5.5 2.4 VIL Input Voltage Low 2.7 to 3.6 0.6 V 4.5 to 5.5 0.8 IIN Control Input Leakage VIN = 0V to VCC 2.7 to 3.6 −1.0 1.0 μA INO(OFF), INC(OFF) OFF-Leakage Current of Port B 0 and B1 A = 1V, 4.5V, B IA(ON) ON Leakage Current of Port A A = 1V, 4.5V, RON Switch ON Resistance MicroPak(4) Ω Switch ON Resistance MSOP / TSSOP(4) IOUT = 100mA, B0 or B1 = 1.5V 2.7 2.8 4.5 IOUT = 100mA, B0 or B1 = 3.5V 4.5 1.5 2.3 ΔRON ON Resistance Matching 5etween Channels(4) MicroPak IOUT = 100mA, B0 or B1 = 3.5V 4.5 0.06 0.12 0.15 Ω ON Resistance Matching Between Channels (5) MSOP / TSSOP IOUT = 100mA, B0 or B1 = 3.5V 4.5 0.7 0.3 RFLAT(ON) ON Resistance Flatness(6) IOUT = 100mA, B0 or B1 = 0V, Ω IOUT = 100mA, B0 or B1 = 0V, 1V, 2V 4.5 0.2 0.3 0.4 ICC Quiescent Supply Current VIN = 0V or VCC, IOUT = 0V 3.6 0.1 0.5 1.0 μA 5.5 0.1 0.5 1.0

FSA2257 Low RON Low-Voltage Dual SPDT Bi-Directional Analog Switch © 2006 Fairchild Semiconductor Corporation www.fairchildsemi.com FSA2257 Rev. 1.0.3 5 All typical values are at 25°C unless otherwise specified. Capacitance Symbol Parameter Conditions VCC (V) TA =+25°CT A =−40°C to +85°C Figure tON Turn-On Time B0 or B1 = 1.5V, RL = 50Ω, CL = 35pF 2.7 to 3.6 50.0 60.0 ns Figure 6. B0 or B1 = 3.0V, RL = 50Ω, CL = 35pF 4.5 to 5.5 35.0 40.0 tOFF Turn-Off Time B0 or B1 = 1.5V, RL = 50Ω, CL = 35pF 2.7 to 3.6 20.0 30.0 ns Figure 6. B0 or B1 = 3.0V, RL = 50Ω, CL = 35pF 4.5 to 5.5 15.0 20.0 tB-M Break-Before- Make Time B0 or B1 = 1.5V, RL = 50Ω, CL = 35pF 2.7 to 3.6 1.0 ns Figure 7. B0 or B1 = 3.0V, RL = 50Ω, CL = 35pF 4.5 to 5.5 20.0 1.0 Q Charge Injection CL = 1.0nF, VGEN = 0V, RGEN = 0Ω 2.7 to 3.6 20.0 pC Figure 9. 4.5 to 5.5 10.0 OIRR Off Isolation f = 1MHz, R L = 50Ω 2.7 to 3.6 –70.0 dB Figure 8. 4.5 to 5.5 –70.0 Xtalk Crosstalk f = 1MHz, R L = 50Ω 2.7 to 3.6 –75.0 dB Figure 8. 4.5 to 5.5 –75.0 BW −3db Bandwidth R L = 50Ω 2.7 to 3.6 350 MHz Figure 11. 4.5 to 5.5 350 THD Total Harmonic Distortion RL = 600Ω, VIN = 0.5V P .P , f = 20Hz to 20kHz 2.7 to 3.6 0.002 % Figure 12. 4.5 to 5.5 0.002 Symbol Parameter Conditions VCC (V) TA =+25°C TA= 40 to +85°C Units Figure CIN Control Pin Input Capacitance f = 1MHz 0.0 3.5 pF Figure 10. COFF B Port Off Capacitance f = 1MHz 4.5 12.0 pF Figure 10. CON A Port On Capacitance f = 1MHz 4.5 40.0 pF Figure 10.

FSA2257 Low RON Low-Voltage Dual SPDT Bi-Directional Analog Switch © 2006 Fairchild Semiconductor Corporation www.fairchildsemi.com FSA2257 Rev. 1.0.3 8 Package Specifications Tape Dimensions for MicroPak 10 Dimensions are in millimeters unless otherwise specified. Reel Dimensions for MicroPak 10 Dimensions are in inches (millimeters) unless otherwise noted. Package Designator Tape Section Number Cavities Cavity Status Cover Tape Status L10X Leader (Start End) 125 (typ) Empty Sealed Carrier 5000 Filled Sealed Trailer (Hub End) 75 (typ) Empty Sealed T a p e S i z e ABCDN W 1 W 2 W 3 (8mm) 7.0 (177.8) 0.059 (1.50) 0.512 (13.00) 0.795 (20.20) 2.165 (55.00) 0.567 (14.40) W1 +0.078 / −0.039 (W1 +2.00 / −1.00)

FSA2257 Low RON Low-Voltage Dual SPDT Bi-Directional Analog Switch © 2006 Fairchild Semiconductor Corporation www.fairchildsemi.com FSA2257 Rev. 1.0.3 9 Tape Dimensions for MSOP Dimensions are in inches (millimeters) unless otherwise specified. Reel Dimensions for MSOP Dimensions are in inches (millimeters) unless otherwise specified T a p e S i z e ABCDN W 1 W 2 W 3 (12mm) (330) 0.059 (1.5) 0.512 (13) 0.795 (20.2) 7.008 (178) 0.448 (12.4) 0.724 (18.4) 0.468-0.606 (11.9 -15.4)

Dimensions are in millimeters unless otherwise noted. Figure 13. 10-Lead MicroPak, 1.6 x 2.1mm

Dimensions are in millimeters unless otherwise noted. Figure 14. 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide

Dimensions are in millimeters unless otherwise noted. Figure 15. 10-Lead Molded Small Outline Package (MSOP), JEDEC MO-187, 3.0mm

FSA2257 Low RON Low-Voltage Dual SPDT Bi-Directional Analog Switch © 2006 Fairchild Semiconductor Corporation www.fairchildsemi.com FSA2257 Rev. 1.0.3 13