FS900R08A2P2_B31 INFINEON | Alldatasheet
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HybridPACK™2Module FS900R08A2P2_B31 FinalDataSheet V3.2,2017-08-30 AutomotiveHighPower
FS900R08A2P2_B31 HybridPACKª2Module V3.2,2017-08-30Final Data Sheet 1Features/Description T T T VCES = 750V IC nom = 900A TypicalApplications
- AutomotiveApplications
- HybridElectricalVehicles(H)EV
- CommercialAgricultureVehicles
- MotorDrives
- Optimized for automotive applications with DC link voltagesupto450V ElectricalFeatures
- VCEsatwithpositiveTemperatureCoefficient
- LowVCEsat
- LowSwitchingLosses
- LowQgandCres
- LowInductiveDesign
- Tvjop=150°C
- Short-time extended Operation Temperature Tvjop=175°C MechanicalFeatures
- 2.5kVAC1minInsulation
- DirectCooledPinFinBasePlate
- HighPowerDensity
- IntegratedNTCtemperaturesensor
- CopperBasePlate
- IsolatedBasePlate
- RoHScompliant ProductName OrderingCode FS900R08A2P2_B31 -
FS900R08A2P2_B31 HybridPACKª2Module V3.2,2017-08-30Final Data Sheet 2IGBT,Inverter 2.1MaximumRatedValues Parameter Conditions Symbol Value Unit Collector-emittervoltage Tvj = 25°C VCES 750 V Implementedcollectorcurrent ICN 900 A ContinuousDCcollectorcurrent TF = 105°C, Tvj max = 175°C IC nom 550 A Repetitivepeakcollectorcurrent tP = 1 ms ICRM 1800 A Totalpowerdissipation TF = 25°C, Tvj max = 175°C Ptot 1546 W Gate-emitterpeakvoltage VGES +/-20 V 2.2CharacteristicValues min. typ. max. Collector-emittersaturationvoltage IC = 550 A, VGE = 15 V IC = 550 A, VGE = 15 V IC = 550 A, VGE = 15 V VCE sat 1.10 1.10 1.10 1.25 V Tvj = 25°C Tvj = 125°C Tvj = 150°C Gatethresholdvoltage IC = 13.0 mA, VCE = VGE VGEth 4.90 5.80 6.50 VTvj = 25°C Gatecharge VGE = -8 V ... 15 V, VCE = 400V QG 5.80 µC Internalgateresistor RGint 0.5 ΩTvj = 25°C Inputcapacitance f = 1 MHz, VCE = 25 V, VGE = 0 V Cies 105 nFTvj = 25°C Reversetransfercapacitance f = 1 MHz, VCE = 25 V, VGE = 0 V Cres 0.50 nFTvj = 25°C Collector-emittercut-offcurrent VCE = 450 V, VGE = 0 V ICES 0.5 mATvj = 25°C Gate-emitterleakagecurrent VCE = 0 V, VGE = 20 V IGES 400 nATvj = 25°C Turn-ondelaytime,inductiveload IC = 550 A, VCE = 400 V VGE = -8 V / +15 V RGon = 3.3 Ω td on 0.39 0.39 0.39 µs Tvj = 25°C Tvj = 125°C Tvj = 150°C Risetime,inductiveload IC = 550 A, VCE = 400 V VGE = -8 V / +15 V RGon = 3.3 Ω tr 0.09 0.11 0.11 µs Tvj = 25°C Tvj = 125°C Tvj = 150°C Turn-offdelaytime,inductiveload IC = 550 A, VCE = 400 V VGE = -8 V / +15 V RGoff = 2.0 Ω td off 0.63 0.71 0.74 µs Tvj = 25°C Tvj = 125°C Tvj = 150°C Falltime,inductiveload IC = 550 A, VCE = 400 V VGE = -8 V / +15 V RGoff = 2.0 Ω tf 0.06 0.08 0.08 µs Tvj = 25°C Tvj = 125°C Tvj = 150°C Turn-onenergylossperpulse IC = 550 A, VCE = 400 V, LS = 20 nH VGE = -8 V / +15 V RGon = 3.3 Ω di/dt (Tvj = 150°C) = 4100 A/µs Eon 21.0 29.0 30.5 mJ Tvj = 25°C Tvj = 125°C Tvj = 150°C Turn-offenergylossperpulse IC = 550 A, VCE = 400 V, LS = 20 nH VGE = -8 V / +15 V RGoff = 2.0 Ω dv/dt (Tvj = 150°C) = 2600 V/µs Eoff 27.5 36.0 38.5 mJ Tvj = 25°C Tvj = 125°C Tvj = 150°C SCdata VGE ≤ 15 V, VCC = 400 V VCEmax = VCES -LsCE ·di/dt ISC 4500 A Tvj = 150°C tP ≤ 4 µs, Thermalresistance,junctiontocoolingfluid perIGBT;ΔV/Δt=10dm³/min RthJF 0.097 K/W Temperatureunderswitchingconditions top continuous top max 30h over life time, for 10s within period of 10min Tvj op -40 150 150 175 °C
FS900R08A2P2_B31 HybridPACKª2Module V3.2,2017-08-30Final Data Sheet 3Diode,Inverter 3.1MaximumRatedValues Parameter Conditions Symbol Value Unit Repetitivepeakreversevoltage Tvj = 25°C VRRM 750 V Implementedforwardcurrent IFN 860 A ContinuousDCforwardcurrent IF 550 A Repetitivepeakforwardcurrent tP = 1 ms IFRM 1720 A I²t-value VR = 0 V, tP = 10 ms, Tvj = 125°C VR = 0 V, tP = 10 ms, Tvj = 150°C I²t 19500 19000 A²s A²s 3.2CharacteristicValues min. typ. max. Forwardvoltage IF = 550 A, VGE = 0 V IF = 550 A, VGE = 0 V IF = 550 A, VGE = 0 V VF 1.40 1.30 1.25 1.65 V Tvj = 25°C Tvj = 125°C Tvj = 150°C Peakreverserecoverycurrent IF = 550 A, - diF/dt = 4100 A/µs (Tvj = 150°C) VR = 400 V VGE = -8 V IRM 265 385 420 A Tvj = 25°C Tvj = 125°C Tvj = 150°C Recoveredcharge IF = 550 A, - diF/dt = 4100 A/µs (Tvj = 150°C) VR = 400 V VGE = -8 V Qr 23.0 49.5 58.5 µC Tvj = 25°C Tvj = 125°C Tvj = 150°C Reverserecoveryenergy IF = 550 A, - diF/dt = 4100 A/µs (Tvj = 150°C) VR = 400 V VGE = -8 V Erec 7.20 15.0 17.5 mJ Tvj = 25°C Tvj = 125°C Tvj = 150°C Thermalresistance,junctiontocoolingfluid perdiode;ΔV/Δt=10dm³/min RthJF 0.125 K/W Temperatureunderswitchingconditions top continuous top max 30h over life time, for 10s within period of 10min Tvj op -40 150 150 175 °C 4NTC-Thermistor min. typ. max. Parameter Conditions Symbol Value Unit Ratedresistance TC = 25°C R25 5.00 kΩ DeviationofR100 TC = 100°C, R100 = 493 Ω ΔR/R 5 5 % Powerdissipation TC = 25°C P25 20.0 mW B-value R2 = R25 exp [B25/50(1/T2 - 1/(298,15 K))] B25/50 3375 K B-value R2 = R25 exp [B25/80(1/T2 - 1/(298,15 K))] B25/80 3411 K B-value R2 = R25 exp [B25/100(1/T2 - 1/(298,15 K))] B25/100 3433 K Specificationaccordingtothevalidapplicationnote.
FS900R08A2P2_B31 HybridPACKª2Module V3.2,2017-08-30Final Data Sheet 5Module Parameter Conditions Symbol Value Unit Isolationtestvoltage RMS, f = 50 Hz, t = 1 min. VISOL 2.5 kV Materialofmodulebaseplate Cu Internalisolation basicinsulation(class1,IEC61140) Al2O3 Creepagedistance terminaltoheatsink terminaltoterminal dCreep 7.0 5.5 mm Clearance terminaltoheatsink terminaltoterminal dClear 7.0 5.0 mm Comperativetrackingindex CTI > 200 min. typ. max. Pressuredropincoolingcircuit ΔV/Δt = 10.0 dm³/min; TF = 25°C Δp 119 mbar Maximumpressureincoolingcircuit p 2.5 bar Strayinductancemodule LsCE 14 nH Moduleleadresistance,terminals-chip TF=25°C,perswitch RCC'+EE' 0.80 mΩ Storagetemperature Tstg -40 125 °C Mountingtorqueformodulmounting ScrewM6baseplatetoheatsink M 3.00 6.00 Nm Terminalconnectiontorque ScrewM6 M 2.5 - 5.0 Nm Weight G 1340 g * Kühleraufbau gemäß gültiger Application Note. * Cooler setup according to the valid application note.
FS900R08A2P2_B31 HybridPACKª2Module V3.2,2017-08-30Final Data Sheet 6CharacteristicsDiagrams outputcharacteristicIGBT,Inverter(typical) IC=f(VCE) VGE=15V VCE [V] IC [A] 0,0 0,2 0,4 0,6 0,8 1,0 1,2 1,4 1,6 1,8 2,0 100 200 300 400 500 600 700 800 900 1000 1100 1200 1300 1400 1500 1600 1700 1800 Tvj = 25°C Tvj = 125°C Tvj = 150°C outputcharacteristicIGBT,Inverter(typical) IC=f(VCE) Tvj=150°C VCE [V] IC [A] 0,0 0,5 1,0 1,5 2,0 2,5 3,0 3,5 4,0 100 200 300 400 500 600 700 800 900 1000 1100 1200 1300 1400 1500 1600 1700 1800 VGE = 19V VGE = 17V VGE = 15V VGE = 13V VGE = 11V VGE = 9V transfercharacteristicIGBT,Inverter(typical) IC=f(VGE) VCE=20V VGE [V] IC [A] 100 200 300 400 500 600 700 800 900 1000 1100 1200 1300 1400 1500 1600 1700 1800 Tvj = 25°C Tvj = 125°C Tvj = 150°C switchinglossesIGBT,Inverter(typical) Eon=f(IC),Eoff=f(IC) VGE=±15V,RGon=3.3Ω ,RGoff=2Ω ,VCE=400V IC [A] E [mJ] 100 200 300 400 500 600 700 800 900 Eon, Tvj = 125°C Eoff, Tvj = 125°C Eon, Tvj = 150°C Eoff, Tvj = 150°C
FS900R08A2P2_B31 HybridPACKª2Module V3.2,2017-08-30Final Data Sheet switchinglossesIGBT,Inverter(typical) Eon=f(RG),Eoff=f(RG) VGE=±15V,IC=550A,VCE=400V RG [Ω ] E [mJ] 100 120 140 160 180 Eon, Tvj = 125°C Eoff, Tvj = 125°C Eon, Tvj = 150°C Eoff, Tvj = 150°C transientthermalimpedanceIGBT,Inverter ZthJF=f(t)(ΔV/Δt=10dm³/min) t [s] ZthJF [K/W] 0,001 0,01 0,1 0,001 0,01 0,1 ZthJF : IGBT ri[K/W]: τi[s]: 0,0062 0,0005 0,022 0,02 0,0238 0,058 0,038 0,45 0,01 2,19 reversebiassafeoperatingareaIGBT,Inverter(RBSOA) IC=f(VCE) VGE=±15V,RGoff=2Ω ,Tvj=150°C VCE [V] IC [A] 100 200 300 400 500 600 700 800 200 400 600 800 1000 1200 1400 1600 1800 2000 IC, Modul IC, Chip thermalimpedanceIGBT,Inverter RthJF=f(ΔV/Δt) coolingfluid=50%water/50%ethylenglycol ΔV/Δt [dm³/min] RthJF [K/W] 0,090 0,092 0,094 0,096 0,098 0,100 0,102 0,104 RthJF: IGBT
FS900R08A2P2_B31 HybridPACKª2Module V3.2,2017-08-30Final Data Sheet forwardcharacteristicofDiode,Inverter(typical) IF=f(VF) VF [V] IF [A] 0,0 0,2 0,4 0,6 0,8 1,0 1,2 1,4 1,6 1,8 2,0 100 200 300 400 500 600 700 800 900 1000 1100 1200 1300 1400 1500 1600 1700 1800 Tvj = 25°C Tvj = 125°C Tvj = 150°C switchinglossesDiode,Inverter(typical) Erec=f(IF) RGon=3.3Ω ,VCE=400V IF [A] E [mJ] 100 200 300 400 500 600 700 800 900 Erec, Tvj = 125°C Erec, Tvj = 150°C switchinglossesDiode,Inverter(typical) Erec=f(RG) IF=550A,VCE=400V RG [Ω ] E [mJ] Erec, Tvj = 125°C Erec, Tvj = 150°C transientthermalimpedanceDiode,Inverter ZthJF=f(t)(ΔV/Δt=10dm³/min) t [s] ZthJF [K/W] 0,001 0,01 0,1 0,01 0,1 ZthJF : Diode ri[K/W]: τi[s]: 0,0112 0,0006 0,035 0,017 0,0373 0,053 0,0295 0,39 0,012 3,2
FS900R08A2P2_B31 HybridPACKª2Module V3.2,2017-08-30Final Data Sheet thermalimpedanceDiode,Inverter RthJF=f(ΔV/Δt) coolingfluid=50%water/50%ethylenglycol ΔV/Δt [dm³/min] RthJF [K/W] 0,118 0,120 0,122 0,124 0,126 0,128 0,130 0,132 RthJF: Diode NTC-Thermistor-temperaturecharacteristic(typical) R=f(T) TC [°C] R[Ω ] 100 120 140 160 100 1000 10000 100000 Rtyp pressuredropincoolingcircuit Δp=f(ΔV/Δt) coolingfluid=50%water/50%ethylenglycol,TF=25°C ΔV/Δt [dm³/min] Δp [mbar] 120 160 200 240 280 320 360 400 Δp: Modul
FS900R08A2P2_B31 HybridPACKª2Module V3.2,2017-08-30Final Data Sheet 7Circuitdiagram T T11 T12 T T21 T22 T T31 T32
FS900R08A2P2_B31 HybridPACKª2Module V3.2,2017-08-30Final Data Sheet 8Packageoutlines D ( 3 : 1 ) A C D A A B B C C D D E E F F G G H H I I J J K K L L Revision |nderungen Datum Name Bearb. Norm Datum Name 23.10.2012 07.03.2013 broerman EU\\broerman Mat.-Nr.:Mastab: Werkstoff: Ersatz f¯r: Ersetzt durch: Oberflche:Kanten: Modell: Revision: n.a. n.a. 00.F Benennung: package outline Dokumentstatus: Entwicklungsfreigabe HybridPACK 2 enhanced D00018099 n.a. Alle Rechte bei INFINEON TECHNOLOGIES AG , auch fr den Fall von Schutzrechtanmeldungen. Freimatoleranz: A00012275 Blatt-Nr.: Gepr. DE 1.5 ISO 8015 principle of independency dimensions ISO 14405 GG target geometry according CAD file with general tolerances method of least-squares1 edges general tolerances surface DIN ISO 13715 1. DIN 16742-TG6 2. DIN ISO 2768-mk DIN EN ISO 1302 Drawing: D00018099.00.G All dimensions refer to module in delivery condition T31 T32 T21 T22 T11 T12 N3 P3 N2 P2 N1 P1 3 2 1 B 0,2 4,6B 0,2 tin coating all side 0,64 -0,03 0,64 B 0,03 20,5B 0,4 20,3B 0,4 17B 0,4 B 0,15 208,7 216( ) 7,5B 0,15 25,15 46,15 68,2 92,25 113,25 131,8 159,35 180,35 200 205,5B 0,45 F 09B 0,4 4,35 28,9 72,55 96 127,45 163,1 195,65 207B 0,4 16B0,2 15,75 -0,075 0,125+ 68,75 -0,2 0 3,54 -0,10,4 194,46-0,40,1 97( 213( ) min. 10,5 for PCB mounting thread forming screw 3,0 x 10 mm (8x) assembly aid for PCB P3 x 10 mm (2x) (100) 0,2B 0,1 L P0,85AFG 0,1 P L P 0,33AFG G8x L P0,84AD-EB-C L P0,84AD-EB-C 24x L P0,84AD-EB-C 0,1Pin-Fin pedestal 0,3 A 3,55 6,25B0,1 7,75B0,4 84,5 88,05 90,75B0,2 92,25B0,4 B E 208,7 31,35 38,65 98,45 103,85 104,35 28,35 35,75 104,15 104,35 D C 7,32 14,94 22,56 27,64 7,32 14,94 22,56 27,64 M6/10 depth
FS900R08A2P2_B31 HybridPACKª2Module V3.2,2017-08-30Final Data Sheet 9LabelCodes 9.1ModuleCode CodeFormat Data Matrix Encoding ASCII Text SymbolSize 16x16 Standard IEC24720 and IEC16022 CodeContent Content Module Serial Number Module Material Number Production Order Number Datecode (Production Year) Datecode (Production Week) Digit 1 - 5 6 - 11 12 - 19 20 - 21 22 - 23 Example(below) 71549 142846 55054991 Example 71549142846550549911530 9.2PackingCode CodeFormat Code128 Encoding Code Set A SymbolSize 34 digits Standard IEC8859-1 CodeContent Content Backend Construction Number Production Lot Number Serial Number Date Code Box Quantity Identifier X S Q Digit 2 - 9 12 - 19 21 - 25 28 - 31 33 - 34 Example(below) 95056609 2X0003E0 754389 1139 Example X950566091T2X0003E0S754389D1139Q15
FS900R08A2P2_B31 HybridPACKª2Module V3.2,2017-08-30Final Data Sheet RevisionHistory Major changes since previous revision
Revision History
Reference Date Description V1.0 2014-07-11 Initial Version V2.0 2016-01-13 preliminary data V2.1 2016-04-11 - V3.0 2016-11-07 Final datasheet V3.1 2016-11-14 - V3.2 2017-08-30 -
FS900R08A2P2_B31 HybridPACKª2Module V3.2,2017-08-30Final Data Sheet Terms&Conditionsofusage Edition2014-05-30 Publishedby InfineonTechnologiesAG 81726Munich,Germany ©2014InfineonTechnologiesAG AllRightsReserved. LegalDisclaimer Theinformationgiveninthisdocumentshallinnoeventberegardedasaguaranteeofconditionsorcharacteristics.Withrespecttoany examplesorhintsgivenherein,anytypicalvaluesstatedhereinand/oranyinformationregardingtheapplicationofthedevice,Infineon Technologiesherebydisclaimsanyandallwarrantiesandliabilitiesofanykind,includingwithoutlimitation,warrantiesofnon-infringementof intellectualpropertyrightsofanythirdparty. Information Forfurtherinformationontechnology,deliverytermsandconditionsandprices,pleasecontactthenearestInfineonTechnologiesOffice (http://www.infineon.com) Warnings Duetotechnicalrequirements,componentsmaycontaindangeroussubstances.Forinformationonthetypesinquestion,pleasecontactthe nearestInfineonTechnologiesOffice. InfineonTechnologiescomponentsmaybeusedinlife-supportdevicesorsystemsonlywiththeexpresswrittenapprovalofInfineon Technologies,ifafailureofsuchcomponentscanreasonablybeexpectedtocausethefailureofthatlife-supportdeviceorsystemortoaffect thesafetyoreffectivenessofthatdeviceorsystem.Lifesupportdevicesorsystemsareintendedtobeimplantedinthehumanbodyorto supportand/ormaintainandsustainand/orprotecthumanlife.Iftheyfail,itisreasonabletoassumethatthehealthoftheuserorotherpersons maybeendangered. Trademarks TrademarksofInfineonTechnologiesAG AURIX™,C166™,CanPAK™,CIPOS™,CIPURSE™,EconoPACK™,CoolMOS™,CoolSET™,CORECONTROL™,CROSSAVE™,DAVE™, DI-POL™,EasyPIM™,EconoBRIDGE™,EconoDUAL™,EconoPIM™,EconoPACK™,EiceDRIVER™,eupec™,FCOS™,HITFET™, HybridPACK™,I²RF™,ISOFACE™,IsoPACK™,MIPAQ™,ModSTACK™,my-d™,NovalithIC™,OptiMOS™,ORIGA™,POWERCODE™, PRIMARION™,PrimePACK™,PrimeSTACK™,PRO-SIL™,PROFET™,RASIC™,ReverSave™,SatRIC™,SIEGET™,SINDRION™, SIPMOS™,SmartLEWIS™,SOLIDFLASH™,TEMPFET™,thinQ™,TRENCHSTOP™,TriCore™. OtherTrademarks AdvanceDesignSystem™(ADS)ofAgilentTechnologies,AMBA™,ARM™,MULTI-ICE™,KEIL™,PRIMECELL™,REALVIEW™,THUMB™, µVision™ofARMLimited,UK.AUTOSAR™islicensedbyAUTOSARdevelopmentpartnership.Bluetooth™ofBluetoothSIGInc.CAT-iq™of FLEXGO™ofMicrosoftCorporation.FlexRay™islicensedbyFlexRayConsortium.HYPERTERMINAL™ofHilgraeveIncorporated.IEC™of CommissionElectrotechniqueInternationale.IrDA™ofInfraredDataAssociationCorporation.ISO™ofINTERNATIONALORGANIZATION FORSTANDARDIZATION.MATLAB™ofMathWorks,Inc.MAXIM™ofMaximIntegratedProducts,Inc.MICROTEC™,NUCLEUS™ofMentor MICROWAVEOFFICE™(MWO)ofAppliedWaveResearchInc.,OmniVision™ofOmniVisionTechnologies,Inc.Openwave™Openwave SystemsInc.REDHAT™RedHat,Inc.RFMD™RFMicroDevices,Inc.SIRIUS™ofSiriusSatelliteRadioInc.SOLARIS™ofSun Microsystems,Inc.SPANSION™ofSpansionLLCLtd.Symbian™ofSymbianSoftwareLimited.TAIYOYUDEN™ofTaiyoYudenCo. TEAKLITE™ofCEVA,Inc.TEKTRONIX™ofTektronixInc.TOKO™ofTOKOKABUSHIKIKAISHATA.UNIX™ofX/OpenCompanyLimited. VERILOG™,PALLADIUM™ofCadenceDesignSystems,Inc.VLYNQ™ofTexasInstrumentsIncorporated.VXWORKS™,WINDRIVER™of WINDRIVERSYSTEMS,INC.ZETEX™ofDiodesZetexLimited. Last update 2011-11-11
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