XED100E12F2 INFINEON | Alldatasheet
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Application Note AN 2008-02 V1.3 Feb. 2011 E v a l u a t i o n D r i v e r B o a r d s f o r E c o n o D U A L ™ 3 a n d E c o n o P A C K ™ + m o d u l e s 1.1 IFAG IMM INP M AE
Application Note AN 2010-03 V1.0, November 2009 Application Note AN 2008-02 V1.3 Feb. 2011 Edition 2011-02-02 Published by Infineon Technologies AG
59568 Warstein, Germany
© Infineon Technologies AG 2011. All Rights Reserved. Attention please! THE INFORMATION GIVEN IN THIS APPLICATION NOTE IS GIVEN AS A HINT FOR THE IMPLEMENTATION OF THE INFINEON TECHNOLOGIES COMPONENT ONLY AND SHALL NOT BE REGARDED AS ANY DESCRIPTION OR WARRANTY OF A CERTAIN FUNCTIONALITY, CONDITION OR QUALITY OF THE INFINEON TECHNOLOGIES COMPONENT. THE RECIPIENT OF THIS APPLICATION NOTE MUST VERIFY ANY FUNCTION DESCRIBED HEREIN IN THE REAL APPLICATION. INFINEON TECHNOLOGIES HEREBY DISCLAIMS ANY AND ALL WARRANTIES AND LIABILITIES OF ANY KIND (INCLUDING WITHOUT LIMITATION WARRANTIES OF NON-INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS OF ANY THIRD PARTY) WITH RESPECT TO ANY AND ALL INFORMATION GIVEN IN THIS APPLICATION NOTE. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Co mponents may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life - support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. AN 2008-02 Revision History: date (11-02-02) , V1.3 Previous Version: V1.2 Page: Subjects Improvement of the active gate clamping circuit Authors: Alain Siani IFAG IMM INP M AE, Uwe Jansen IFAG IMM INP M AE We Listen to Your Comments Any information within this document that you feel is wrong, unclear or missing at all? Your feedback will help us to continuously improve the quality of this document. Please send your proposal (including a reference to this document) to: [WAR-IGBT-Application@infineon.com] Driver Boards for EconoDUALTM 3 and EconoPACKTM +
Application Note AN 2010-03 V1.0, November 2009 Application Note AN 2008-02 V1.3 Feb. 2011 Table of contents 1.1 1 Driver Boards for EconoDUALTM 3 and EconoPACKTM +
Application Note AN 2010-03 V1.0, November 2009 Application Note AN 2008-02 V1.3 Feb. 2011
1 Introduction
The Evaluation Driver Board 2ED100E12 -F2 for EconoDUAL™ 3 modules as can be seen in Figure 1 and the Evaluation Driver Board 6ED100E12 -F2 for EconoPACK™ + modules, shown in Figure 2 , were developed to support customers during their first ste ps designing applications with these modules. The basic version of each board is available from Infineon in small quantities. The properties of these parts are described in the following chapters of this document whereas the remaining paragraphs provide in formation intended to enable the customer to copy, modify and qualify the design for production, according to his specific requirements. The design of the 2ED100E12 -F2 and the 6ED100E12 -F2 was performed with respect to the environmental conditions described as design target in this document. The requirements for lead-free reflow soldering have been considered when components were selected. The design was tested as described in this documentation but not qualified regarding manufacturing and operation in the whole operating ambient temperature range or lifetime. The boards provided by Infineon are subjected to functional testing only. Due to their purpose Evaluation Boards are not subjected to the same procedures regarding Returned Material Analysis (RMA), P rocess Change Notification (PCN) and Product Discontinuation (PD) as regular products. See Legal Disclaimer and Warnings for further restrictions on Infineon’s warranty and liability. Figure 1 The 2ED100E12-F2 Evaluation Driver Board mounted on the top of the EconoDUAL™ 3 module Figure 2 The 6ED100E12-F2 Evaluation Driver Board mounted on the top of the EconoPACK™ + module Driver Boards for EconoDUALTM 3 and EconoPACKTM +
Application Note AN 2010-03 V1.0, November 2009 Application Note AN 2008-02 V1.3 Feb. 2011
2 Design features
The following sections provide an overview of the boards including main features, key data, pin assignments and mechanical dimensions.
2.1 Main features
The 2ED100E12-F2 and the 6ED100E12-F2 Evaluation Driver Board offer the following features: Dual channel IGBT driver in 2ED100E12-F2 version, adapted for use with IGBT4 Six channel IGBT driver in 6ED100E12-F2 version Electrically and mechanically suitable for 600 V and 1200 V EconoDUAL™ 3 or EconoPACK™ + IGBT modules Includes DC/DC power supply with short circuit protection Isolated temperature measurement Short circuit protection with toff < 6 µs Under Voltage Lockout of IGBT driver IC Positive logic with 5 V CMOS level for PWM and fault signals One fault output signal for each leg PCB is designed to fulfill the requirements of IEC61800-5-1, pollution degree 2, overvoltage category II Driver Boards for EconoDUALTM 3 and EconoPACKTM +
Application Note AN 2010-03 V1.0, November 2009 Application Note AN 2008-02 V1.3 Feb. 2011
2.2 Key data
All values given in the table below are typical values, measured at TA = 25 °C Table 1 Key data and characteristic values (typical values) Parameter Value Unit VDC primary DC/DC voltage supply +15 ±0.5 V VCC primary supply voltage for logic devices +5 ±0.5 V VLogicIN PWM signals for high side and low side IGBT 0 / +5 V VFAULT /FAULT detection output 0 / +5 V IFAULT max. /FAULT detection output load current 10 mA VRST /RST input 0 / +5 V IDC primary DC/DC current drawn per leg 40 mA ICC primary current drawn for logic devices per leg 25 mA Vout drive voltage level for high side and Low side channel +16 / -8 V IG max. peak output current ±10 A PDC/DC max. DC/DC output power high and low side 3 W fS max. PWM signal frequency for high and low side 1) 100 kHz tPDELAY propagation delay time 200 ns tPDISTO input to output propagation distortion 15 ns VDesat Desaturation reference level 9 V dmax max. duty cycle 100 % VCES max. collector – emitter voltage on IGBT 600/1200 V VTEMP temperature measurement output voltage digital 0/5 V ITEMP max. temperature measurement load current 5 mA Top operating temperature design target 2) -40…+85 °C Tsto storage temperature design target -40…+85 °C Uis,eff Isolation voltage 3) Transformer Vacuumschmelze 500 VAC VIORM Maximum Repetitive Insulation Voltage 4) 1ED020I12-F Driver IC 1420 Vpeak VIORM Max. working insulation voltage 5) AD7400 Sigma-Delta Converter 891 Vpeak 1) The maximum switching frequency for every EconoDUAL™ 3 or EconoPACK™ + module type should be calculated separately. Limitation factors are: max. DC/DC output power of 1.5 W per channel and max. PCB board temperature measured around gate resistors of 105 °C for used FR4 material. For detailed information see chapter 2.3 2) Maximum operating temperature strictly depends on load and cooling conditions. For detailed description see chapter 2.3 3) Values defined in datasheets: T60403-D4615-X054 date: 21.03.2000 4) 1ED020I12-F Datasheet, Version 2.2, December 2009 5) AD7400 1/11 – Revision C Driver Boards for EconoDUALTM 3 and EconoPACKTM +
Application Note AN 2010-03 V1.0, November 2009 Application Note AN 2008-02 V1.3 Feb. 2011
2.3 Pin assignment
Except pin 14 of the connectors X1 and X2 of EconoPACK™ + driver board , all connectors for both EconoDUAL™ 3 and EconoPACK™ + board are configured as listed in Table 2. Table 2 depicts the pin assignment of connector X3 shown in Figure 3. Table 2 Inputs and outputs of 6ED100E12-F2 for connector X3 Pin Label Function X3.1 MClock Clock out for temperature measurement X3.2 Supply +15 V Primary voltage for DC/DC converter X3.3 GND Primary ground for DC/DC converter supply voltage X3.4 Supply +15 V Primary voltage for DC/DC converter X3.5 TOP IN- PWM signal for high side IGBT, negative logic X3.6 TOP IN+ PWM signal for high side IGBT, positive logic X3.7 TOP RDY Ready signal for high side IGBT X3.8 TOP /FLT Fault detection output high side IGBT X3.9 TOP/BOT /RST Reset signal for high and low side IGBT -Driver X3.10 BOT /FLT Fault detection output low side IGBT X3.11 BOT RDY Ready signal for low side IGBT X3.12 BOT IN- PWM signal for low side IGBT, negative logic X3.13 BOT IN+ PWM signal for low side IGBT, positive logic X3.14 TEMP-Digital Sigma / Delta signal for temperature measurement X3.15 +5V +5 V Voltage supply for logic devices X3.16 Signal GND Primary ground logic devices Figure 3 The 6ED100E12-F2 Evaluation Driver Board connector layout of X3 Driver Boards for EconoDUALTM 3 and EconoPACKTM +
Application Note AN 2010-03 V1.0, November 2009 Application Note AN 2008-02 V1.3 Feb. 2011
2.4 Mechanical dimensions of the EconoDUAL™ 3 Driver Board
Figure 4 Dimensions of the 2ED100E12-F2 Driver Board
2.5 Mechanical dimensions of the EconoPACK™ + Driver Board
Figure 5 Dimensions of the 6ED100E12-F2 Driver Board Both Driver Boards should be fastened by self taping screws an d soldered to the auxiliary connectors on top of the IGBT module. Clearance and creepage distances for EconoDUAL™ 3 and EconoPACK™ + Driver Boards: Primary/Secondary is not less than 8 mm and Secondary/Secondary is not less than 4 mm. Driver Boards for EconoDUALTM 3 and EconoPACKTM +
Application Note AN 2010-03 V1.0, November 2009 Application Note AN 2008-02 V1.3 Feb. 2011
3 Electrical Features
The following chapter describes the board´s operation in the evaluation setup. Please note that the following paragraphs describe the circuits of the 2ED100 E12-F2 which has been modified compared to the last revision of this AN to drive IGBT4 modules and to reduce the susceptibility to erroneous triggering of the Vcesat-detection. The same changes also are applied to the 6ED100E12-12-F2, but layout and part list of this board as provided in chapter 7 still represent the initial design.
3.1 Power Supply
The 2 ED100E12-F2 and the 6ED100E12 -F2 have an integrated DC/DC converter for each leg, which generates the required secondary isolated unsymmetrical supply voltage of +16 V / -8 V. High and Low side driver voltages are independently generated by using one unipo lar input voltage of 15 V. Additionally, the power supply is protected against gate – emitter short circuit of the IGBTs. In case of DC/DC converter overload, the output voltage drops. Th e Under Voltage Lock Out function ensures gate driver operation only to take place within specified IC supply voltages range. The fault is reported to the driver’s primary side.
3.2 Input logic – PWM signals
The Evaluation Driver Boards are dedicated to solderable IGBT modules. It is necessary to connect two separate PWM signa ls for EconoDUAL TM 3 IGBT modules and six separate PWM signals in case of EconoPACKTM + IGBT modules. An i ndividual signal for each IGBT channel is necessary. Parts of t he schematic for a single driver are depicted in Figure 6. The signals dedicated to High- and Low-Side need to have the correct dead time. Both Evaluation Driver Boards do not provide dead time generation . For suggested gate resistor values according to Table 5 on page 24, the recommended minimum dead time t TD is 1µs. If larger gate resistors are used please refer to [1]. Figure 6 Schematic detail of the input circuit for a single driver. The schematic in Figure 6 shows parts of the driver circuit with positiv e logic. IN+ is used as signal input whereas IN- is used as enable signal. Therefore a +5 V signal on the IN+ input pin and a GND signal on the IN- input pin is necessary to turning-on the IGBT. To operate the whole circuit with negative logic the capacitors C1 and C2 on the input pins have to be swapped. Otherwise this would cause an additional delay. IN+ will then operate as an enable signal.
3.3 Maximum switching frequency
The switching frequency of an IGBT is limited either by the maxima um output power of the driver voltage supply or by the maxim um temperature of the PCB due to the power losses in the external gate resistors. These power losses in the gate resistors depend on the IGBT gate charge, gate voltage magnitude and on the switching frequency of the IGBT. Due to the power losses in the external gate resistors, heat will be generated, which leads to an increase of the PCB temperature in the neighborhood of these resistors. This temperature must not be higher than the m aximum temperature of the PCB, i. e. 105°C for a standard FR4 material. Driver Boards for EconoDUALTM 3 and EconoPACKTM +
Application Note AN 2010-03 V1.0, November 2009 Application Note AN 2008-02 V1.3 Feb. 2011 PCBthRGAmbthRG PCBthRGAmbthRG EXT PCBthRGAmbthRG AmbPCBPCBthRG AmbG RR RRRPRR TTRTT )()( The calculation of the power losses in the gate resistors can be done by utilizing Equation 1: GsoutINTEXTdis QfVRPRPP )()( (1) where: Pdis = dissipated power P(REXT) = dissipated power external gate resistors P(RINT) = dissipated power internal gate resistor ΔVout = voltage step at the driver output fs = switching frequency QG = IGBT gate charge for the given gate voltage range The complete gate resistor consists of the internal gate resistor together with an external gate resistor and due to that, a par t of the IGBT drive power losses will be dissipated directly in the PCB, whereas the other part of the losses will be dissipated externally to the ambient air. The ratio of the losses dissipated internally P(RINT) and externally P(R EXT) corresponds directl y to the ratio of the mentioned R INT and R EXT resistors. Corresponding to -8/+16V operation the datasheet value of Qge needs to be reduced by 20%. Due to the PCB temperature criteria the power dissipated in external gate resistors P(REXT) has to be considered for the thermal design. Based on experimentally determined board temperatures the following thermal resistances of the Evaluation Boards have been calculated as shown in Figure 7. Thermal resistance, gate resistors to PCB: RthRG-PCB = 45 K/W Thermal resistance, gate resistors to ambient: RthRG-Amb = 39 K/W Using these values, it is possible to determine the maximum board temperature, if the power losses of the external gate resistors, the maximum ambient temperature and the maximum PCB temperature are known: TAmb : Ambient temperature TPCB : Board PCB temperature TG : PCB Temperature near the external gate resistors Figure 7 Thermal model of the Gate resistor.
Application Note AN 2010-03 V1.0, November 2009 Application Note AN 2008-02 V1.3 Feb. 2011
3.4 Booster
Figure 8 shows the output stage of the driver where t wo complementary pairs of transistors are used to amplify the driver IC’s signal. This allows driving IGBTs that need more current than the driver IC can deliver. Two NPN transistors are used for turning-on the IGBT and two PNP transistors for turning-off the IGBT. The tr ansistors are dimensioned to provid e enough peak current to drive all 600 V and 1200 V EconoDUAL™ 3 and EconoPACK™ + modules. The peak current can be calculated according to Formula (2): DriverEXTINT out peak RRR VI (2) Figure 8 Driver output stage with booster Gate resistors are connected in between booster stage and IGBT module gate connection. Suggest ed values are listed in table 5 on page 25 and table 7 on page 36 . For some modules the va lue for these resistors is 0 . In this case just a jumper is required. If resistors are needed , care should be taken that these resistors have a suitable rating for repetitive pulse power to avoid degradation.
3.5 Short circuit protection and active clamping
The short circuit protection of the Evaluation Driver Board basically relies on the detect ion of a voltage level higher than 9 V on the DESAT pin of the 1ED020I12 -F driver IC and the implemented active clamp function. Thanks to this operation mode, the collector -emitter overvoltage, w hich is a result of the stray inductance and the collector current slope, is limited. The overvoltage shoots during turning-off changes as a function of the stray inductance, the current and the DC voltage . Figure 9 shows the parts of the circuit needed for the desaturation f unction and the active clamping. The EconoDUALTM 3 driver board is equipped with an additional diode D1 to avoid a bypass current during the turning-on sequence. Figure 9 Desaturation detection and active clamping Driver Boards for EconoDUALTM 3 and EconoPACKTM +
Application Note AN 2010-03 V1.0, November 2009 Application Note AN 2008-02 V1.3 Feb. 2011 Active clamping is a technique wh ich keeps transient overvoltages below the critical limits when the IGBT turns-off. The standard approach to active clamping is to use a chain of avalanche diodes connected between the auxiliary collector and the gate of an IGBT module. When the Collector-Emitter voltage exceeds the diodes breakdown voltage the diodes current sums up with the current from the driver output. Due to the now increased gate -emitter voltage the transistor is held in an act ive mode and the turning-off process is prolonged. The dI C/dt slows down which results in a limited voltage overshoot. Avalanche diodes conduct high peak currents during the time period in which the clamping is actively limiting the overvoltage. A typical turn-off waveform u nder short circuit condition of a FF60 0R12ME4 module at room temperature without any overvoltage limiting function is shown in Figure 10 a. Under short circuit condition at room temperature with active clamp function a typical waveform is shown in Figure 10b. Figure 10 a) Short circuit without active clamping b) with active clamping function
3.6 Fault output
When a short circuit occurs, the voltage increase across the IGBT is detected by the desaturation protection of the 1ED020I12 -F and the IGBT is turning-off. The fault is reported to the primary side of the driver as a low active signal. A red LED is turning-on to signalize the failure condition. The /FLT status remains active as long as there is no reset signa l applied to the driver. The /F LT signal is active low, the according schematic can be seen in Figure 11. Figure 11 Fault output for a single driver Driver Boards for EconoDUALTM 3 and EconoPACKTM +
Application Note AN 2010-03 V1.0, November 2009 Application Note AN 2008-02 V1.3 Feb. 2011
3.7 Temperature measurement
Based on the NTC built int o both module types, the driver boards offer IGBT base plate temperature measurement in the range of -40 °C…150 °C. Both Evaluation Driver Board s work with a Sigma/Delta converter. Thus a digital signal is provided featuring the advantage that digital signal processing can be used without particular hardware efforts and that the subsequent error is low. However an analog signal can be produced with the use of the schematic in Figure 12. Figure 12 Schematic to convert digital Σ/Δ to analog output Table 3 Bill of Material Σ/Δ to analog converter Type Qty Value / Device Package size imperial Part Name Recommended Manufacturer Capacitor 1 100n/50V/X7R C0603 C1 Capacitor 1 1n/50V/C0G C0603 C2 Capacitor 1 10n/50V/X7R C0603 C3 Capacitor 1 100p/50V/C0G C0603 C4 Amplifier 1 AD8542ARZ SOIC08 IC1 Analog Devices Resistor 2 39k R0603 R1, R5 Resistor 2 100k R0603 R2, R6 Resistor 2 22k R0603 R3, R4 Resistor 1 10R R0603 R7 All electronic parts used in the design are lead -free with 260 °C soldering profile. The tolerances for resistors should be less or equal to ±1 %, for capacitors of the type C0G less or equal to ±5 % and for capacitors of the type X7R less or equal to ±10 %. Driver Boards for EconoDUALTM 3 and EconoPACKTM +
Application Note AN 2010-03 V1.0, November 2009 Application Note AN 2008-02 V1.3 Feb. 2011 Using the base plate temperature and a thermal mo del, the junction temperature can be estimated. The complexity of the thermal model needed for this purpose depends on application and heat sink conditions as well as on requirements regarding accuracy and dynamic response. In case of a broken wire the out put shuts down to 0 V. The relation between output voltage and base plate temperature is shown in Figure 13. Temperature Measurement V TEMP=f(TJ) -50 -30 -10 10 30 50 70 90 110 130 150 TJ [°C] VTEMP [V] Figure 13 Characteristics of the temperature measurement Note: This temperature measurement is not suitable for short circu it detection or short term overload but may be used to protect the module from long term overload conditions or malfunction of the cooling system. Driver Boards for EconoDUALTM 3 and EconoPACKTM +
Application Note AN 2010-03 V1.0, November 2009 Application Note AN 2008-02 V1.3 Feb. 2011
4 Switching losses
The setup used for preparing this application note varies from the setup used to characte rize the devices in three aspects 1. DC-link inductance: The DC-link inductance of t he setup used for these test has a value of approximately 35 nH for all modules inve stigated here in contrast to varying values between 35 nH to 80 nH us ed for device characterization; see device datasheets for de tails. For a detailed discussion on the impact of DC - link inductance on switching losses please refer to [2]. 2. Gate voltage: This Evaluation Board provides a gate voltage of -8 V for turning-off and 16 V for turning-on whereas characterization is done with a driver providing +/- 15 V of gate voltage. 3. Gate driver output impedance: According to IEC 60747 -9 for characterization of an IGBT the driver used should resemble an ideal voltage source as far as possible. For the Evaluation Board a driver output stage has been chosen that considers board space as well as cost constraints. Therefore it cannot provide close to zero output impedance. All aspects discussed above have an impact on the switching speed of the module and hence also on the switching losses. Gate resistor values have been chosen so that di/dt at turn -on is comparable to characterization conditions. Nevertheless small deviations in the turn-on losses persist.
4.1 Turn-on losses
The turn-on losses are expected to correspond to the datasheet values of the modules. As an example the measured turn-on losses for an EconoDUAL™ 3 FF450R12ME3 are shown in Figure 14. FF450R12ME3 Switching losses, Eon= f(Uce,Ic) 100 120 140 160 0 100 200 300 400 500 600 700 800 900 1000 Current [A] Losses Eon [mJ] 400V 500V 600V 700V 800V 400V 500V 600V 700V 800V Eon @ Tj = 25°C Eon @ Tj = 125°C Figure 14 Turn-on losses of a FF450R12ME3 measured using the 2ED100E12-F2 Driver Boards for EconoDUALTM 3 and EconoPACKTM +
Application Note AN 2010-03 V1.0, November 2009 Application Note AN 2008-02 V1.3 Feb. 2011 The 2ED100E12-F2 is designed to also work on IGBT4-modules as well. Figure 15 depicts the turn-on losses of a FF450R12ME4 module as an example. FF450R12ME4 Switching losses, Eon= f(Uce,Ic) 100 120 140 160 0 100 200 300 400 500 600 700 800 900 1000 Current [A] Losses Eon [mJ] 400V 500V 600V 700V 800 400V 500V 600V 700V 800V 400V 500V 600V 700V 800V Eon @ Tj = 25°C Eon @ Tj = 125°C Eon @ Tj = 150°C Figure 15 Turn-on losses of a FF450R12ME4 measured using the 2ED100E12-F2 Driver Boards for EconoDUALTM 3 and EconoPACKTM +
Application Note AN 2010-03 V1.0, November 2009 Application Note AN 2008-02 V1.3 Feb. 2011
4.2 Turn-off losses
In general the turn -off losses linearly increase with the DC -Link voltage. The following Figure 16 and Figure 17 confirm these characteristics and show the dependencies of the measured turning-off losses vs. the DC - link voltage and the current. FF450R12ME3 Switching losses, Eoff= f(Uce,Ic) 100 120 140 160 0 100 200 300 400 500 600 700 800 900 1000 Current [A] Losses Eoff [mJ] 400V 500V 600V 700V 800V 400V 500V 600V 700V 800V Eoff @ Tj = 25°C Eoff @ Tj = 125°C Figure 16 Turn-off losses with FF450R12ME3 module FF450R12ME4 Switching losses, Eoff= f(Uce,Ic) 100 120 140 0 100 200 300 400 500 600 700 800 900 1000 Current [A] Losses Eoff [mJ] 400V 500V 600V 700V 800V 400V 500V 600V 700V 800V 400V 500V 600V 800V 700V Eoff @ Tj = 25°C Eoff @ Tj = 125°C Eoff @ Tj = 150°C Figure 17 Turn-off losses with FF450R12ME4 module All losses are measured according to the IEC 60747-9 standard. Driver Boards for EconoDUALTM 3 and EconoPACKTM +
Application Note AN 2010-03 V1.0, November 2009 Application Note AN 2008-02 V1.3 Feb. 2011
5 Schematic, Layout and Bill of Material - EconoDUAL™ 3 board
Both driver boards were made by keeping the following rules for the copper thickness and the space between different layers as shown in Figure 18. Layers: Figure 18 Copper and isolation used
5.1 Schematic
To meet the individual customer requirement s and make the Evaluation Driver Board for the EconoDUAL™ 3 module simple for development or modification, all necess ary technical data like schematic, layout and components are included in this chapter. Figure 19 High side IGBT driver Figure 20 Low side IGBT driver Copper Isolation 1: 35 µm 1-2: 0.5 mm 2-3: 0.5 mm 3-4: 0.5 mm 2: 35 µm 3: 35 µm 4: 35 µm Driver Boards for EconoDUALTM 3 and EconoPACKTM +
Application Note AN 2010-03 V1.0, November 2009 Application Note AN 2008-02 V1.3 Feb. 2011 Figure 24 External connector
5.2 Assembly drawing
Figure 25 Assembly drawing of the EconoDUAL™ 3 driver board
Application Note AN 2010-03 V1.0, November 2009 Application Note AN 2008-02 V1.3 Feb. 2011
5.3 Layout
Figure 26 EconoDUAL™ 3 IGBT driver – a) Top layer and b) Layer 2 Figure 27 EconoDUAL™ 3 IGBT driver – a) Layer 3 and b) Bottom layer Driver Boards for EconoDUALTM 3 and EconoPACKTM +
Application Note AN 2010-03 V1.0, November 2009 Application Note AN 2008-02 V1.3 Feb. 2011
5.4 Bill of Material
The bill of material includes a part list as well as assembly notes. The external gate resistors are not assembled, a list for the resistor values is presented in chapter 6.5. The tolerances for resistors should be less or equal to ±1 %, for capacitors of the type C0G less or equal to ±5 % and for capacitors of the type X7R less or equal to ±10 %. Table 4 Bill of Material for EconoDUAL™ 3 Driver Board Type Qty Value / Device Package size imperial Part Name Recommended Manufacturer Assem- bled
Description
Capacitor 4 100p/50V/C0G C0603 C1,C4,C10,C12 Capacitor 9 100n/50V/X7R C0603 C1B, C1T, C4B, C4T, C3, C6, C8, C13, C18T Capacitor 2 .../50V/C0G C0603 C1C,C2C no Capacitor 2 470p/50V/X7R C0603 C1R,C2R Capacitor 5 10n/50V/X7R C0603 C2, C5, C15T, C16T, C17T Capacitor 19 4µ7/25V/X7R C-EUC1206 C2B, C2T, C3B, C3T,C5B,C5T, C6B, C6T,C9B, C9T, C10B, C10T, C11B, C11T, C14T, C7, C14, C15, C16 Murata Capacitor 2 220p/50V/C0G C0603 C7B,C7T Capacitor 2 33p/50V/C0G C0603 C8B,C8T no Capacitor 3 1µ/25V/X7R C0805 C11,C12T,C13T Capacitor 2 optional/50V/C0G C0603 CGE1,CGE2 Connector 1 TYCO16POL TYCO16POL X1 TYCO no Diode 2 STTH112U SOD6 D5B,D5T Diode 4 ES1D DO214AC D6,D7,D8,D9 Diode 2 ZLLS1000 SOT23 D7B,D7T Driver IC 2 1ED020I12-F P-DSO-16 IC1,IC2 Infineon Half-Bridge Driver IC
1 IR2085SPBF SO08 IC3
Schottky Diode 2 BAT165 SOD323R DB,DT Infineon no Isolated Sigma- Delta Modulator
1 AD7400YRWZ P-DSO-16 IC5
LED1, LED2 Resistor 4 27R R0603 BB, BT, BB1, BT3 Resistor 4 10R R0603 BT2,R1L,R2L,R2L1 no Resistor 4 100R R0402 R1,R2,R7,R8 Resistor 4 12R R0805 R1B,R1T,R1B2,R1T2 Vishay / CRCW080512R 0FKEAHP Pulsresistor Driver Boards for EconoDUALTM 3 and EconoPACKTM +
Application Note AN 2010-03 V1.0, November 2009 Application Note AN 2008-02 V1.3 Feb. 2011 Type Qty Value / Device Package size imperial Part Name Recommended Manufacturer Assem- bled Resistor 2 220R R0805 R1B1,R1T1 no Resistor 5 0R R0603 R1C,R1C1,R2C,R2C1,R8T no Resistor 2 0R R0402 R_FR1,R_FR2 Resistor 2 1k R0603 R2B,R2T Resistor 5 4k7 R0402 R3,R4,R9,R10,R_R Resistor 2 4R7 R0603 R20,R21 Resistor 4 10k R0402 R6,R12,R22,R23 Resistor 2 39R R0805 R5,R11 Resistor 8 variable R2010 R4B, R4T, R5B, R5T, R6B, R6T, R7B, R7T TT electronics no Pulsresistor Resistor 1 1k2 R0603 R9T Resistor 1 820R R0603 R10T Resistor 3 2k2 R0603 R11T,R13T,R17 Resistor 1 270R R0603 R12T Resistor 2 10R R1206 R13,R19 Resistor 2 15R R0603 R15,R16 Resistor 1 68k R0603 R14 Resistor 1 0R15 R0805 R18 Resistor 1 39k R0603 R25 Schmitt-Trigger 1 SN74LVC1G17D BVR SOT23-5 IC4 Schottky Diode 17 BAT165 SOD323R D2B,D2R,D2T,D3, D3B,D3T,D4,D4B, D4T,D5,D10,D11, D12,D13,D1, D1R,D2 Infineon Shunt Regulator 1 TLV431BIDCKT SC70-6L IC7 Transformer 1 T60403-D4615- X054 D4615- X054 TR Vacuum- schmelze Transistor 2 BC856 SOT23 T1,T2 Infineon Transistor 4 ZXTN2010Z SOT89 T1B, T1B1, T1T, T1T1 Diodes Transistor 4 ZXTP2012Z SOT89 T2B, T2B1, T2T, T2T1 Diodes 1 TrenchMOS 2 PMV45EN SOT23 T3,T4 philips Unipolar TVS Diode 2 P6SMB440A SMB D1.1C,D2.1C Vishay Unipolar TVS Diode 2 P6SMB510A SMB D2.1C,D2.2C Vishay Zener diode 4 MM3Z5V6T1G SOD323-R D1.1B, D1.1T, D1.2B, D1.2T On Semiconductor no Voltage regulator 1 ZMR500FTA SOT23 IC6 Zener diode 2 BZX84-C11 SOT23 ZB,ZT no Driver Boards for EconoDUALTM 3 and EconoPACKTM +
Application Note AN 2010-03 V1.0, November 2009 Application Note AN 2008-02 V1.3 Feb. 2011
5.5 Gate resistor list
Table 5 External gate resistors RGext, all packages are 2010 types Module RGon [] RGoff [] R4T, R4B, R6T, R6B [] R5T, R5B, R7T, R7B [] Assembled FF150R12ME3G 5.6 3,7 7,5 3,7 no FF150R12MS4 5.1 3,2 6,2 4 no FF225R12MS4 3 1,5 3 3 no FF225R12ME3 1.5 0 0 3 no FF225R12ME4 0 0 0 0 no FF300R12ME3 1.1 0 0 2,2 no FF300R12ME4 0 0 0 0 no FF300R12MS4 1.5 0,5 1 2 No FF450R12ME3 1 0,25 0,5 1,5 no FF450R12ME4 1 0 0 2 no FF600R06ME3 2.0 1,25 2,5 1,5 No FF600R12ME4 1.5 0,6 2,5 1,5 No Driver Boards for EconoDUALTM 3 and EconoPACKTM +
Application Note AN 2010-03 V1.0, November 2009 Application Note AN 2008-02 V1.3 Feb. 2011
6 Schematic, Layout and Bill of Material - EconoPACK™ + board
To meet the individual customer requirement s and to ease the development or modific ation using the Evaluation Driver Board for the EconoPACK™ + module, all necessary technical data like schematic, layout and components are included in this chapter. The tolerances for resistors should be less or equal to ±1 %, for capacitors of the type C0G less or equal to ±5 % and for capacitors of the type X7R less or equal to ±10 %.
6.1 Schematic
For the EconoDUALTM 3 and EconoPACKTM + evaluation boards, the high and low side driver schematics including their power supplies are similar for all half bridges. Therefore it is sufficient to depict only the schematic of the EconoDUALTM 3. Figure 28 High side IGBT driver Figure 29 Low side IGBT driver Driver Boards for EconoDUALTM 3 and EconoPACKTM +
Application Note AN 2010-03 V1.0, November 2009 Application Note AN 2008-02 V1.3 Feb. 2011 Figure 33 Connector
6.2 Assembly drawing
Figure 34 Assembly drawing of the EconoPACK™ + driver board For detailed information use the zoom function of your PDF viewer. Driver Boards for EconoDUALTM 3 and EconoPACKTM +
Application Note AN 2010-03 V1.0, November 2009 Application Note AN 2008-02 V1.3 Feb. 2011
6.3 Layout
Figure 35 EconoPACK™ + IGBT driver – Top layer Figure 36 EconoPACK™ + IGBT driver – Layer 2 Driver Boards for EconoDUALTM 3 and EconoPACKTM +
Application Note AN 2010-03 V1.0, November 2009 Application Note AN 2008-02 V1.3 Feb. 2011
6.4 Bill of material
The bill of material includes a part list as well as assembly notes. The external gate resistors are not assembled, a list for the resistor values is presented in Table 7 on page 33. The tolerances for resistors should be less or equal to ±1 %, for capacitors of the type C0G less or equal to ±5 % and for capacitors of the type X7R less or equal to ±10 %. Table 6 Bill of Material for EconoPACK™ + Driver Board Type Qty Value / Device Package size imperal Part Name Recommended Manufacturer Assembled Capacitor 6 .../50V/C0G C0603 C1C, C2C, C3C, C4C, C5C, C6C no Capacitor 9 10n/50V/X7R C0603 C2, C5, C18, C21, C34, C37, C40T, C41T, C42T Capacitor 6 33p/50V/C0G C0603 C8B, C8T, C20B, C20T, C32B, C32T no Capacitor 23 100n/50V/X7R C0603 C1B, C1T, C3, C4B, C4T, C6, C13, C13B, C13T, C16B, C16T, C19, C22, C25B, C25T, C28B, C28T, C29, C35, C38, C43T, C45, C49 Capacitor 12 100p/50V/C0G C0603 C1, C4, C10, C12, C17, C20, C26, C28, C33, C36, C42, C44 Capacitor 6 220p/50V/C0G C0603 C7B, C7T, C19B, C19T, C31B, C31T Capacitor 6 470p/50V/X7R C0603 C1R, C2R, C3R, C4R, C5R, C6R Capacitor 6 optional/50V/C0G C0603 CGE1, CGE2, CGE3, CGE4, CGE5, CGE6 no Capacitor 5 1µ/25V/X7R C0805 C11, C27, C37T, C38T, C43 Capacitor 55 4µ7/25V/X7R C1206 C2B, C2T, C3B, C3T, C5B, C5T, C6B, C6T, C7, C9B, C9T, C10B, C10T, C11B, C11T, C14, C14B, C14T, C15, C15B, C15T, C16, C17B, C17T, C18B, C18T, C21B, C21T, C22B, C22T, C23, C23B, C23T, C26B, C26T, C27B, C27T, C29B, C29T, C30, C30B, C30T, C31, C32, C33B, C33T, C34B, C34T, C35B, C35T, C39, C39T, C46, C47, C48 Murata Transformer 3 T60403-D4615- X054 D4615-X054 TR1, TR2, TR3 Vacuum- schmelze Driver Boards for EconoDUALTM 3 and EconoPACKTM +
Application Note AN 2010-03 V1.0, November 2009 Application Note AN 2008-02 V1.3 Feb. 2011 Type Qty Value / Device Package size imperal Part Name Recommended Manufacturer Assembled LED 6 LEDCHIP- LED0805 LED1, LED2, LED3, LED4, LED5, LED6 Schottky Diodes
39 BAT64-02W SCD80
D1, D2, D2B, D2T, D3, D3B, D3T, D4, D4B, D4T, D5, D6, D7, D8, D9, D9B, D9T, D10, D10B, D10T, D11, D11B, D11T, D12, D13, D14, D15, D16, D16B, D16T, D17, D17B, D17T, D18, D18B, D18T, D19, D20, D21 Infineon Rectifier Diode
6 ES1D DO214AC D28, D29, D30, D31, D32, D33
Diode 6 BAT64-02W SCD80 DB1, DB2, DB3, DT1, DT2, DT3 Infineon no Unipolar TVS Diode
6 P6SMB/440V SMB
D1.1C, D2.1C, D3.1C, D4.1C, D5.1C, D6.1C, Unipolar TVS Diode
6 P6SMB/510V SMB
D1.2C, D2.2C, D3.2C, D4.2C, D5.2C, D6.2C Diode 6 STTA112U SOD6 D5B, D5T, D12B, D12T, D19B, D19T Zener Diode 12 MM3Z5V6T1G SOD323-R D1.1B, D1.1T, D1.2B, D1.2T, D8.1B, D8.1T, D8.2B, D8.2T, D15.1B, D15.1T, D15.2B, D15.2T On Semiconductor no Zener Diode 6 BZX84-C11 SOT23 ZB1, ZB2, ZB3, ZT1, ZT2, ZT3 no Diode 6 ZLLS1000 SOT23 D7B, D7T, D14B, D14T, D21B, D21T Diodes Driver IC 6 1ED020I12-F P-DSO-16 IC1, IC2, IC5, IC6, IC8, IC9 Half-Bridge Driver
3 IR2085SPBF SO08 IC3, IC7, IC10
R SOT23-5 IC11 Isolated Sigma-Delta Modulator
1 AD7400YRWZ P-DSO-16 IC12
1 ZMR500FTA SOT23 IC13
1 TLV431BIDCKT SC70-6L IC14
Driver Board for EconoDUALTM3 and EconoPACKTM+
Application Note AN 2010-03 V1.0, November 2009 Application Note AN 2008-02 V1.3 Feb. 2011 Type Qty Value / Device Package size imperal Part Name Recommended Manufacturer Assembled Resistor 6 0R R0402 R_FR1, R_FR2, R_FR3, R_FR4, R_FR5, R_FR6 Resistor 15 4k7 R0402 R_R1, R_R2, R_R3, R3, R4, R9, R10, R22, R23, R28, R29, R41, R42, R47, R48 Resistor 6 10k R0402 R6, R12, R25, R31, R44, R50 Resistor 12 100R R0402 R1, R2, R7, R8, R20, R21, R26, R27, R39, R40, R45, R46 Resistor 6 0R R0603 R1C1, R2C1, R3C1, R4C1, R5C1, R6C1 no Resistor 6 27R R0603 BB1, BB2, BB3, BT1, BT2, BT3 Resistor 6 1k R0603 R2B, R2T, R10B, R10T, R18B, R18T Resistor 1 1k2 R0603 R26T Resistor 5 2k2 R0603 R18, R28T, R30T, R37, R56 Resistor 6 4R7 R0603 R13, R14, R51, R52, R60, R61 Resistor 6 10R R0603 R1L, R2L, R3L, R4L, R5L, R6L no Resistor 6 15R R0603 R16, R17, R35, R36, R54, R55 Resistor 1 39k R0603 R64 Resistor 3 68k R0603 R15, R34, R53 Resistor 1 270R R0603 R29T Resistor 1 820R R0603 R27T Resistor 3 0R15 R0805 R19, R38, R57 Resistor 7 0R R0603 R1C, R2C, R3C, R4C, R5C, R6C, R25T no Resistor 6 12R R0805 R1B, R1T, R9B, R9T, R17B, R17T Resistor 6 39R R0805 R5, R11, R24, R30, R43, R49 Resistor 6 220R R0805 R1B1, R1B2, R1B3, R1T1, R1T2, R1T3 no Resistor 6 10R R1206 R32, R33, R58, R59, R62, R63 Resistor 24 variable R2010 R4B, R4T, R5B, R5T, R6B, R6T, R7B, R7T, R12B, R12T, R13B, R13T, R14B, R14T, R15B, R15T, R20B, R20T, R21B, R21T, R22B, R22T, R23B, R23T TT electronics no: See Table 8 Driver Boards for EconoDUALTM3 and EconoPACKTM + Driver Boards for EconoDUALTM3 and EconoPACKTM + Driver Boards for EconoDUALTM 3 and EconoPACKTM +
Application Note AN 2010-03 V1.0, November 2009 Application Note AN 2008-02 V1.3 Feb. 2011 Type Qty Value / Device Package size imperal Part Name Recommended Manufacturer Assembled Transistor 6 BC856 SOT23 T1, T2, T5, T6, T9, T10 TrenchMOS 6 PMV45EN SOT23 T3, T4, T7, T8, T11, T12 Philips Transistor 6 ZXTN2010Z SOT89 T1B, T1T, T3B, T3T, T5B, T5T Diodes Transistor 6 ZXTP2012Z SOT89 T2B, T2T, T4B, T4T, T6B, T6T Diodes Connector 3 8-188275-6 16POL X1, X2, X3 Tyco
6.5 Gate resistor list
Table 7 External gate resistors RGext are listed below, all packages are 2010 types Module RGext [] R4T, R4B, R6T, R6B R12T, R12B, R14T, R14B R20T, R20B, R22T, R22B [] R5T, R5B, R7T, R7B R13T, R13B, R15T, R15B R21T, R21B, R23T, R23B [] FS150R12KE3G 8.2 5.6 5.6 FS225R12KE3 3.3 1.5 1.5 FS300R12KE3 2.4 1.1 1.1 FS450R12KE3 1.6 1 1
7 How to order Evaluation Driver Boards
Every Evaluation Driver Board has its own IFX order number and can be ordered via your Infineon Sales Partner. Information can also be found at the Infineons Web Page: www.infineon.com CAD-data for the board described here are available on request. The use of this data is subjected to the disclaimer given in this AN. Please contact: WAR-IGBT-Application@infineon.com IFX order number for EconoDUAL™ 3 Evaluation Driver Board: 31165 IFX order number for EconoPACK™ + Evaluation driver board: 31166
8 References
[1] Infineon Technologies AG, AN2007-04, ‘How to calculate and to minimize the dead time requirement for IGBTs properly’, V1.0, May 2007, www.infineon.com [2] Bäßler, M., Ciliox A., Kanschat P. , ‘On the loss – softness trade -off: Are different chip versions needed for softness improvement?’ PCIM Europe 2009, Nuremberg, May 2009 Driver Boards for EconoDUALTM 3 and EconoPACKTM +