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Technical content

Datasheet sections

  • 7.1 Sensor Slave Address
  • 7.2 Data Read

Features

 Gas or liquid mediums  Robust solid isolation technology  Resistant to surface contamination  No cavity to cause clogging  Resistant to vibration and pressure shock  Low-power application  High-temperature flow housing  Low signal-to-noise ratio  Analog output: 0V to 5V  Digital output: I2C  Supply voltage: 5V  Module operating temperature range: 0°C to +85°C  53.35 x 24.0 mm module with 6-pin header FS2012 Flow Sensor Module

Figure 1. Pin Assignments for Module – Top View Table 1. Pin Descriptions

1 VIN Input Supply voltage

2 SDA Input/Output Serial data

3 SCL Input Serial clock

4 GND Ground Ground

5 MOSI Do not connect

6 VOUT Output Analog output

The absolute maximum ratings are stress ratings only. Stresses greater than those listed below can cause permanent damage to the device. Table 2. Absolute Maximum Ratings Table 3. Operating Conditions

  1. Electrical Characteristics

Table 4. Electrical Characteristics Note: See important notes at the end of the table. [a] Direction of flow is from P1 In to P2 Out. [b] Board circuitry is not protected from liquids. [c] SLPM: Standard liter per minute. [d] SCCM: Standard cubic centimeter per minute.

© 2017 Integrated Device Technology, Inc. 6 July 19, 2017 6. Functional Description The FS2012 digital flow sensor accurately measures the mass flow rate of a liquid or gaseous medium across the sensor using the calorimetric principle. The MEMS flow sensor comprises a resistive heater and two clusters of thermocouples (thermopiles), each positioned symmetrically upstream and downstream of the heater. The thermopile output changes according to the rate of flow, and it is proportional to the amount of heat sensed from the heater. 7. I2C Sensor Interface The FS2012 operates as a slave device via the digital I2C compatible communication protocol bus with support for 100kHz and 400kHz bit rates. To accommodate multiple devices, the protocol uses two bi-directional open-drain lines: a Serial Data Line (SDA) and a Serial Clock Line (SCL). Pull-up resistors to VDD are required. Several slave devices can share the bus, and multiple master devices on the same bus are supported. If two or more masters attempt to initiate a data transfer simultaneously, an arbitration scheme is employed with a single maste r always winning the arbitration. Note that it is not necessary to specify one device as the master in a system; any device that transmits a START bit and a slave address becomes the master for the duration of that transfer.

7.1 Sensor Slave Address

The FS2012 default I2C address is 07HEX. The device will respond only to this address.

7.2 Data Read

The FS2012 is programmed to continuously output data to the I2C bus.  Number of bytes to read out: 2  First returned byte: MSB  Second returned byte: LSB 8. Calculating Flow Sensor Output The entire output of the FS2012 is 2 bytes. The flow rate for gas and liquid parts is calculated as follows: Output Data  Number of bytes to read out: 2  First returned byte: MSB  Second returned byte: LSB Gas Part Configurations (-NG ending for part code number)  Conversion to SLPM  Flow in SLPM = [(MSB << 8) + LSB] / 1000 Liquid Part Configurations (-LQ ending for part code number)  Conversion to SCCM  Flow in SCCM = [(MSB << 8) + LSB] / 10

The voltage output is ratiometric to the full scale span. Use the following conversion for the range examples. Figure 2. Analog Output Example

Figure 3. FS2012 Module Dimensions

© 2017 Integrated Device Technology, Inc. 9 July 19, 2017 11. Ordering Information Note: The part code depends on the application. In the part code, NG refers to “non-corrosive gas” and LQ refers to “liquid.”  For NG parts, the calibration gas is nitrogen. Other calibration gases are available on request.  For LQ parts, the calibration fluid is DI water. Orderable Part Number Description and Package Shipping Packaging Temperature FS2012-1020-NG 0 to 2 SLPM calibrated gas flow sensor mounted on a circuit board with a flow housing; digital I2C and analog output Box 0°C to +85°C FS2012-1100-NG 0 to 10 SLPM calibrated gas flow sensor mounted on a circuit board with a flow housing; digital I2C and analog output Box 0°C to +85°C FS2012-1001-LQ 0 to 0.5 SLPM (500 SCCM) calibrated liquid flow sensor mounted on a circuit board with a flow housing; digital I2C and analog output Box 0°C to +85°C FS2012-1002-LQ 0 to 1.0 SLPM (1000 SCCM) calibrated liquid flow sensor mounted on a circuit board with a flow housing; digital I2C and analog output Box 0°C to +85°C 12. Revision History Revision Date Description of Change July 19, 2017 Initial release of the preliminary datasheet. Corporate Headquarters

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San Jose, CA 95138 www.IDT.com Sales 1-800-345-7015 or 408-284-8200 Fax: 408-284-2775 www.IDT.com/go/sales Tech Support www.IDT.com/go/support DISCLAIMER Integrated Device Technology, Inc. (IDT) and its affiliated companies (herein referred to as “IDT”) reserve the right to modify the products and/or specifications described herein at any time, without notice, at IDT's sole discretion. Performanc e specifications and operating parameters of the described products are determined in an independent state and are not guaran teed to perform the same way when installed in customer products. The information contained herein is provided without representati on or warranty of any kind, whether express or implied, including, but not limited to, the suitability of IDT's products for any particular purpose, an implied warranty of merchantability, or non -infringement of the intellectual property rights of others. This document is presented only as a guide and does not convey any license under intellectual property rights of IDT or any third parties. IDT's products are not intended for use in applications involving extreme environmental conditions or in life suppor t systems or similar devices where the failure or malfunction of an IDT product can be reasonably expected to significantly affect the health or safety of users. Anyone using an IDT product in such a manner does so at their own risk, absent an express, wri tten agreement by IDT. Integrated Device Technology, IDT and the IDT logo are trademarks or registered trademarks of IDT and its subsidiaries in the United States and other countries. Other trademarks used herein are the property of IDT or their respective third party owners. Fo r datasheet type definitions and a glossary of common terms, visit www.idt.com/go/glossary . All contents of this document are copyright of Integrated Device Technology, Inc. All rights reserved.