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R02,JUL-15 FS1000FL THRU FS1006FL 1.0A Super Fast Recovery Rectifier 1. 封裝 Package 封裝方式 Method: SOD‐123S 封裝尺寸 Dimension: 如圖示 2. 產品特色 Features For surface mounted applications in order to optimize board space Ideal for automated placement Glass Passivated Chip Junction High temperature soldering : 260℃/10 seconds at terminals Lead‐free & halogen‐free parts, RoHS compliant 3. 機械數據 Mechanical Data Case: Molded plastic over passivated junction Terminals: Solder plated solderable per MIL‐STD‐750 Method 2026 Polarity: Color band denotes cathode end Weight: approx.. 0.0173 grams 4. 極限值與電參數 Maximum Ratings & Electrical Characteristic PARAMETER Symbol FS1000FL FS1001FL FS1002FL FS1004FL FS1006FL UNITS Marking Code ‐ E1A E1B E1D E1G E1J ‐ Repetitive Peak Reverse Voltage VRRM 50 100 200 400 600 Volts RMS Voltage VRMS 35 70 140 280 420 Volts DC Blocking Voltage VDC 50 100 200 400 600 Volts Average Forward Current TL=120 O C IF(AV) 1.0 Amps Peak Forward Surge Current: 8.3ms single half sine‐wave TL=25 O C IFSM 30 Amps DC Reverse Current at Rated TJ=25 OC DC Blocking Voltage TJ=100 O C IR uA Reverse Recovery Time IF=0.5A IR=1A IRR=0.25A Trr 35 ns Typical Thermal Resistance (NOTE1.2) RÈJA RÈJC 200 ℃/W Operating Junction and Storage Temperature Range TJ,TSTG ‐55 to +150 ℃ Notes: (1) Mounted on an FR4 PCB, single‐sided copper, mini pad. (2) Mounted on an FR4 PCB, single‐sided copper, with 10cm x 10cm copper pad area. 單位 Unit: millimeters
R02,JUL-15 FS1000FL THRU FS1006FL 1.0A Super Fast Recovery Rectifier Fig. 1 Forward Current Derating Curve Fig. 2 Typical Forward Characteristics Fig. 3 Typical Leakage Current vs. Junction 5. 特性曲線 Rating & Characteristic Curves