FRDMKW24DUG NXP
Document overview
- Manufacturer or author: Provided By www.digicamel.com(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 30
Technical content
User’s Guide
1 Introduction
This manual describes the development platform, FRDM-KW24D512. It has a diverse reference design with all necessary I/O connections to use as a self-contained platform or for connection to an external application. The MKW24D512 is a 2.4 GHz Industrial, Scientific, and Medical (ISM) single-chip device intended for the IEEE® Std. 802.15.4, including Thread, ZigBee® Pro stack, ZigBee RF4CE standards, and IPv6/6loWPAN protocols. The FRDM-KW24D512 contains the MKW24D512 transceiver that is typically combined with a software stack to implement an IEEE Std. 802.15.4 platform solutions.
1.1 Audience
This document is intended for system designers.
2 Safety Information
2.1 FCC guidelines
This equipment is used by developers for evaluation purposes only and must not be incorporated into any other Document Number: FRDMKW24DUG Rev. 1, 05/2016
Contents
4.3.Schematic, platform layout, and bill of material . 17 FRDM-KW24D512 Freedom Development Platform User’s Guide
Freedom Development Board FRDM-KW24D512 User’s Guide, Rev. 1, 05/2016
2 NXP Semiconductors
devices or systems. Integrators are responsible for reevaluating the end product (including the transmitter) and obtaining a separate FCC authorization. FCC approval of this device only covers the original configuration of this device as supplied. Any modifications to this product, including changes shown in this document, may violate the rules of the Federal Communications Commission and Industry Canada and make operation of the product unlawful.
2.1.1 Labeling
FCC labels are physically located on the back of the platform.
2.1.2 Operating conditions
This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions:
- This device may not cause harmful interference.
- This device must accept any inte rference received, including interference that may cause undesired operation.
2.1.3 Exposure limits
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. The antenna(s) used for this equipment must be installed to provide a separation distance of at least 8 inches (20 cm) from all persons.
2.1.4 Antenna restrictions
An intentional radiator is designed to ensure that no antenna other than that furnished by the responsible party is used with the device. The use of a permanently attached antenna or of an antenna that uses a unique coupling to the intentional radiator is considered sufficient to comply with the provisions of this Section. The manufacturer may design the unit so that a broken antenna can be replaced by the user, but the use of a standard antenna jack or electrical connector is prohibited. This requirement does not apply to carrier current devices or to devices operated under the provisions of Sections 15.211, 15.213, 15.217, 15.219, or must be professionally installed, such as perimeter protection systems and some field disturbance sensors, or to other intentional radiators which, in accordance with Section 15.31(d) of the IEEE Std. 802.15.4, must be measured at the installation site. However, the installer is responsible for ensuring that the proper antenna is employed so that the limits in this Part are not exceeded.
2.2 Regulatory approval for Canada (IC RSS 210)
This equipment complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions:
- This platform may not cause interference.
- This platform must accept a ny interference, including interference that may cause undesired operation of the device.
Freedom Development Board FRDM-KW24D512 User’s Guide, Rev. 1, 05/2016 NXP Semiconductors 3 FRDM-KW24D512 Overview and Description 2.2.1 26 PART 5 – Appendix Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: 1. l'appareil ne doit pas produire de brouillage, et 2. l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
2.3 Electrostatic discharge considerations
Although damage from electrostatic discharge (ESD) is much less common on these devices than on early CMOS circuits, normal handling precautions should be used to avoid exposure to static discharge. Qualification tests are performed to ensure that these devices can withstand exposure to reasonable levels of static without suffering any permanent damage. All ESD testing is in conformity with the JESD22 Stress Test Qualification for Commercial Grade Integrated Circuits. During the device qualification, ESD stresses are performed for the human body model (HBM), the machine model (MM), and the charge device model (CDM). All latch-up tests are in conformity with the JESD78 IC Latch-Up Test. When operating or handling the development platforms or components, it is strongly recommended to use at least the grounding wrist straps plus any, or all, of the following ESD dissipation methods:
- Flexible fabric, solid fixed size, or disposable ESD wrist straps
- Static control workstations, static control moni tors, and table or floor static control systems
- Static control packaging and transporta tion materials and environmental systems
2.4 Disposal instructions
The NXP development platforms must be disposed of in compliance with current local waste disposal regulations. Appliances disposal should be done by a qualified company.
3 FRDM-KW24D512 Overview and Description
3.1 Introduction
The FRDM-KW24D512 development platform is an evaluation environment based on the NXP MKW24D512 transceiver (MKW24). The MKW24D512 device incorporates a complete low power IEEE Std. 802.15.4 2.4 GHz radio frequency transceiver and a Kinetis family low-power, mixed-signal ARM® Cortex®-M4 MCU into a single package. NXP supplements the MKW24D512 with tools and software that include hardware evaluation and development platforms, software development IDE, and applications, drivers, custom PHY usable with the NXP IEEE Std. 802.15.4 compatible MAC.
4 NXP Semiconductors
3.2 Platform features
3.2.1 FRDM-KW24D512 platform
connect with the Freedom development platforms. Figure 1 shows the FRDM-KW24D512 development platform. Figure 1. FRDM-KW24D512 development platform
- The low-power Kinetis MKW24D512 transceiver
- Full IEEE Std. 802.15.4-compliant wirele ss node; ZigBee and Thread capable
- Reference design area with smal l footprint, low-cost RF node — RF circuitry includes a Balun to convert the differential input/output pin of the MKW24D512 transciever to single-ended for onboard signal routing — Low off-chip component count
Freedom Development Board FRDM-KW24D512 User’s Guide, Rev. 1, 05/2016
6 NXP Semiconductors
FRDM-KW24D512 Development Platform
3.3 Software and driver considerations
The FRDM-KW24D512 platform includes an OpenSDAv2.1, a serial and debug adapter circuit that includes an open-source bootloader, and debug interface software. It bridges serial and debug communications between a USB host and an embedded target processor. The hardware circuit is based on the Kinetis K20 family. For additional information about our 2.4 GHz Kinetis family platforms, see the following:
- Wireless on nxp.com
- Kinetis KW2xD on nxp.com
4 FRDM-KW24D512 Development Platform
4.1 FRDM-KW24D512 platform overview
The FRDM-KW24D512 is an evaluation platform based on the MKW24D512 transceiver. The FRDM-KW24D512 platform provides a platform to evaluate the MKW24D512 transceiver, develop software and applications. The core device is accompanied by a 32 MHz reference oscillator crystal, RF circuitry including antenna, and supporting circuitry. The FRDM-KW24D512 platform is intended as the core PCB for MKW24D512 transceiver evaluation and application development, and can be used in the following modes:
- Simple standalone evaluation platform
- Daughter card to other development pl atforms (Freedom development platform)
- Mother card to an appli cation-specific daughter card, such as a shield card
4.1.1 PCB features
The FRDM-KW24D512 platform provides the following features:
- The Freedom development platform form factor
- 4-Layer metal, 0.062 inch thick FR4 platform
- LGA footprint and power supply bypass
- Printed metal F-Antenna and footprint fo r installing a (user supplied) SMA connector
- 32 MHz reference oscillator crystal
- 32.768 kHz crystal provided for optional timing oscillator
- Standard FRDM card mounting interface
- External serial flash for OTAP support
- Combo sensor, 6-axis sensor with integr ated linear accelerometer and magnetometer
4.1.2 Form factor
Figure 3 shows the FRDM-KW24D512 platform’s connector and header locations.
8 NXP Semiconductors
Figure 4. FRDM-KW24D512 platform top side (component side) footprint
4.1.3 Platform level specifications
Table 1. FRDM-KW24D512 platform specifications maximum temperature of +85 °C.
4.2 Functional description
1 Harmonic trap adds 1 to 2 dB of loss. Table 1. FRDM-KW24D512 platform specifications (continued)
10 NXP Semiconductors
Figure 5. FRDM-KW24D512 block diagram
4.2.1 RF performance and considerations
- Programmable output power from -35 dBm to +8 dBm at the SMA, no trap.
- Typical sensitivity is -102 dBm (@1% PER for 20 byte payload packet).
- Frequency range is 2360 to 2480 MHz.
- Differential bidirectional RF input/output port with integrated transmit/receive switch.
- “F” printed metal antenna for a small footprint, low cost design.
- Platform features a low component count RF matching network with off-chip 1:1 Balun. The layout has provision for out-of-band signal suppression (components L5 and C19) if required. Figure 6 shows the typical topology for the RF circuitry. A footprint is available to install the RF connector J48 for measurement purposes. When using J48, install C17 and remove C18.
Figure 6. FRDM-KW24D512 RF circuitry
4.2.2 Clocks
- 32 MHz Reference Oscillator: Figure 7 shows the external 32 MHz external crystal Y1. This mounted crystal must meet the specifications outlined in the AN3251 application note (AN3251). The IEEE Std. 802.15.4 requires that the frequency be accurate to less that ±40 ppm. — Capacitors C21 and C22 provide th e bulk of the crystal load capacitance. At 25°C, it is desired to have the frequency accurate to ±10 ppm or less to allow for temperature variation. — To measure the 32 MHz oscillator freque ncy, signal CLKOUT (PTA18/CLK_OUT) can optionally be programmed to provide a buffered output clock signal.
- Optional 32.768 kHz Crystal Oscillato r: Provision is also made for a secondary 32.768 kHz crystal Y2 (see Figure 8). This oscillator can be used for a low-power accurate time base. — The module comes provided with this Y2 cr ystal and its load capacitors C23 and C24. — Load capacitors C23 and C24 pr ovide the entire crystal load capacitance. There is no onboard trim capacitance. — The 32 kHz oscillator compone nts are supplied, but not enabled. Zero-ohm resistors R82 and R83 to disable 32 kHz.
12 NXP Semiconductors
Figure 7. FRDM-KW24D512 platform’s 32 MHz reference oscillator circuit Figure 8. FRDM-KW24D512 platform’s 32.768 kHz optional oscillator circuit
4.2.3 Power management
FRDM-KW24D512 power management circuit is shown in Figure 9. Figure 9. FRDM-KW24D512 platform’s power management circuit
- The platform can be supplied through the mi cro USB type B connector (J16), which provides P5V_USB to LDO 3V3.
- The platform can be supplied th rough the development platform’s headers, which provide either P3.3V or P5-9V_VIN on header J3 pin 16 to LDO 3V3.
- The platform can be supplied from an external DC supply in the following way: — Connect an adaptor capable of suppling more than 3.3 VDC (15 V maximum) to J28 header. Additionally, J40, a two-pin 1x2 cut-trace header, provides current to the MCU and the transceiver. A red LED marked as LED D4 is available as a power indicator. Power headers provide the means to supply either the LED, MCU, or peripheral circuits. Current measurements can be made by inserting a current meter in place of a designated jumper. Connection configurations are described in Table 2.
4.2.4 FRDM-KW24D512 peripheral functions
off-board FRDM development platform peripherals can be used.
4.2.4.1 Serial flash (SPI interface)
parameters. Figure 10 shows the memory circuit.
- The memory power supply is P3V3_BRD.
- Place J38 and J39 Jumpers to perform SPI communication with the serial flash module.
Table 2. Power distribution headers
- Jumper is shorted by a cut-trace on the bottom layer
- Usage: Measure MCU current P3V3 SH18 — Supply voltage to header
- Normally traced P3V3_BRD SH19 — Supply voltage to LEDs, switches, and some modules
- Normally traced
14 NXP Semiconductors
- The SPI Write Protect and Rese t has discrete pullup resistors
Figure 10. AT45DB161E (2 Mbyte) serial flash memory
4.2.4.2 Combo sensor (I 2C interface)
magnetometer, very low-power consumption, and I2C selectable. Figure 11 shows the sensor circuit.
- The sensor power supply is P3V3_BRD.
- Discrete pullup resistors for the I 2C port are provided.
- One interrupt signal.
Figure 11. FXOS8700CQ combo sensor
4.2.4.3 Interface connectors J1, J2, J3 and J4
supporting the Freedom standard connector.
- P3V3, 5V_USB, and P5-9V_VIN provide the headers connector with its supply voltage — Peripheral I/O to the FRDM-KW24D512 platfo rm and the Freedom development platform supply must use this same voltage supply to avoid potential damage. The pin definitions for the headers are shown in Table 3 and Table 4.
Table 3. J2 and J1 connector
1 NC NC 1 PTE0_TX UART1_TX
2 PTA19 PTA19 (D8/int) 2 PTD7_TX UART0 (D0/RX/INT)
3 NC NC 3 PTE1_RX UART1_RX
4 PTA18/EXTAL0 PTA18 (D9/int) 4 PTD6_RX UART0 (D1/TX/INT)
5 NC NC 5 PTE2_CTS UART1_CTS
6 PTC4_SPI_SS PTC4 (D10/SPI_SS) 6 PTD5_CTS UART0 (D2/INT)
7 NC NC 7 PTE3_RST UART1_RST
8 PTC6_SPI_SOUT PTC6 (D11/MOSI) 8 PTD4_RST UART0 (D3/PWM/INT)
9 NC NC 9 NC NC
10 PTC7_SPI_SIN PTC7 (D12/MISO) 10 GPIO2 GPIO2 (D4/INT)
11 NC NC 11 NC NC
12 PTC5_SPI_CLK PTC5 (D13/SCK) 12 GPIO1 GPIO1 (D5/PWM/INT)
13 NC NC 13 NC NC
14 GND GND 14 PTE4 PTE4
15 NC NC 15 NC NC
16 P3V3_BRD P3V3_BRD 16 PTD1 PTD1 (D7/CMP/INT)
17 NC NC — — —
18 PTD3_I2C_SDA PTD3 (D14/Ana/Int) — — —
19 NC NC — — —
20 PTD2_I2C_SCL PTD2 (D15/Ana/Int) — — —
Freedom Development Board FRDM-KW24D512 User’s Guide, Rev. 1, 05/2016
16 NXP Semiconductors
FRDM-KW24D512 Development Platform Table 4. J3 and J4 connector
Description
MKW24D512 pin name MKW24D512 pin name
1 NC NC 1 NC NC
2N C N C 2 A N T _ A A 0 / I N T
3 NC NC 3 PTA0 JTAG_TCLK
4 P3V3 P3V3 4 ANT_B A1/INT
5 NC NC 5 PTA1 JTAG_TDI
6 RST_B RST_TGTMCU_B 6 RX_SWITCH A2/INT
7N C N C 7 P T A 2 J T A G _ T D O
8 P3V3 P3V3 8 TX_SWITCH A3_INT
9 NC NC 9 PTA3 and
RST_TGTMCU_B JTAG_TMS
10 P5V P5V 10 NC NC
11 NC NC 11 PTA4 NMI_B
12 GND GND 12 NC NC
13 NC NC — — —
14 GND GND — — —
15 NC NC — — —
16 P5-9V_VIN Unregulated Voltage — — —
4.3 Schematic, platform lay out, and bill of material
Figure 12. FRDM-KW24D512 platform schematic rev. A (1/4)
18 NXP Semiconductors
Figure 13. FRDM-KW24D512 platform schematic rev. A (2/4)
Figure 14. FRDM-KW24D512 platform schematic rev. A (3/4)
20 NXP Semiconductors
Figure 15. FRDM-KW24D512 platform schematic rev. A (4/4)
22 NXP Semiconductors
Figure 18. FRDM-KW24D512 platform PCB layout (top view) Figure 19. FRDM-KW24D512 platform PCB layout (bottom view)
4.3.1 Bill of materials
Table 5. Bill of materials (common parts for all frequency bands) (Sheet 1 of 4)
61 C 1 7 DNP 10PF CAP CER 10PF 50V 5% C0G 0402 AVX 04025A100JAT2A
91 C 3 4 DNP 18PF CAP CER 18PF 50V 5% C0G 0603 YAGEO AMERICA CC0603JRNPO9BN180
24 NXP Semiconductors
0 RES MF ZERO OHM 1/16W 5% 0402 VISHAY CRCW04020000Z0ED
220 RES MF 220 OHM 1/16W 5% 0402 VISHAY
Table 5. Bill of materials (common parts for all frequency bands) (Sheet 2 of 4)
0 CUT TRACE RESISTOR NOT A COMPONENT NOT A COMPONENT
Table 5. Bill of materials (common parts for all frequency bands) (Sheet 3 of 4)
26 NXP Semiconductors
5 PCB Manufacturing Specifications
circuit board (PCB) described in this document.
- The PCB must comply with Perfag1D/3C ( www.perfag.dk/en/).
- The PCB manufacturer’s logo is required.
- The PCB production week and year code is required. — The manufacturer’s logo and week/year code must be stamped on the back of the PCB solder mask. — The PCB manufacturer cannot insert text on the PCB either in copper or in silkscreen without written permission from Freescale Semiconductor, Inc.
- The required Underwriter’s Labor atory (UL) Flammability Rating: — The level is 94V-0 ( Standard for Tests for Flammability of Plastic Materials for Parts in Devices and Appliancesl). — The UL information must be stampe d on the back of the PCB solder mask 77 1 U6 MK20DX128VF IC MCU FLASH 128KB 50MHZ 1.71-3.6V QFN32 FREESCALE SEMICONDUCTOR MK20DX128VFM5 78 1 U7 MIC2005-0.8YM IC LIN SW PWR 0.8A 2.5-5.5V SOT23-6 MICREL MIC2005-0.8YM6 79 1 U8 NTSX2102GU8H IC DUAL SUPPLY XCVR 50 MBPS 5.5V XQFN8 NXP SEMICONDUCTORS NTSX2102GU8H 80 6 U10,U11,U12,U17, U18,U19 0402ESDA-MLP DIODE TVS BIDIR -- 30V 0402 COOPER BUSSMANN 0402ESDA-MLP1 81 1 U13 AT45DB161E-SS HD IC FLASH 16MBIT 85MHZ 2.5-3.6V SOIC8 ATMEL AT45DB161E-SSHD-T 82 1 U15 MIC5205-3.3 LDO 150MA 16V SOT23-5 MICREL MIC5205-3.3YM5 83 1 U16 FXOS8700CQ IC FXOS8700CQ 6-AXIS SENSOR 1.95V-3.6V, QFN-16 FREESCALE SEMICONDUCTOR FXOS8700CQR1 84 1 Y1 32MHZ XTAL 32MHZ 9PF -- SMT 3.2X2.5MM NDK EXS00A-CS02368 85 1 Y2 32.768KHZ XTAL 32.768KHZ SMT ROHS COMPLIANT EPSON ELECTRONICS FC-135 32.7680KA-A3 86 1 Y3 8MHZ XTAL 8MHZ 20PPM PAR 18PF ESR 200OHM SMT ABRACON CORPORATION ABM3B-8.000MHZ-B2-T 87 1 Z1 2400MHZ 50OHM XFMR BALUN 2400 ±100MHZ SMT MURATA LDB212G4005C-001
Table 5. Bill of materials (common parts for all frequency bands) (Sheet 4 of 4)
- A complete set of design files is available for the FRDM-KW24D512 transceiver at the NXP website under “Software and Tools.” These reference designs should be used as a starting point for a custom application. (TWR-KW2x: Kinetis KW2x Tower System Modules)
- The Freescale IEEE 802.15.4 / ZigBee Package and Hardware Layout Considerations Reference Manual (ZHDCRM) is also available at the same website to provide additional design guidance.
5.1 Single PCB construction
This section describes individual PCB construction details.
- The FRDM-KW24D512 PCBs are f our-layer, multilayer designs.
- The PCBs contain no blind, buried, or micro vias.
- PCB data: — FRDM-KW24D512 platform’s size: Approxima tely 81 mm x 53 mm (3.20 inches x 2.10 inches). — FRDM-KW24D512 platform’s final thickness (Cu/Cu): 1.57 mm (0.62 inches) ±10% (excluding solder mask). Table 6 defines some of the layers of the completed PCB. The artwork identification refers to the name of the layer in commonly used terms. CAUTION: The FRDM-KW24D512 development platform contains high-frequency 2.4 GHz RF circuitry. As a result, RF component placement, line geometries and layout, and spacing to the ground plane are critical parameters. As a result, BOARD STACKUP GEOMETRY IS CRITICAL. Dielectric and copper thicknesses and spacing must not be changed. Follow the stackup (see Figure 20) information provided with the reference design.
Table 6. FRDM-KW24D512 layer by layer overview
28 NXP Semiconductors
Figure 20. FRDM-KW24D512 PCB stackup cross-section (four layer)
- A solder mask is required.
- A silk screen is required.
5.2 Panelization
The panel size can be negotiated depending on production volume.
5.3 Materials
- Laminate: The base material (laminate) must be FR4. If the laminate material is changed, the RF electrical characteristics may change and degrade the RF performance.
- Copper foil: — Top and Bottom copper layers must be 1 oz. copper. — Interior layers must be 1 oz. copper.
- Plating: All pad plating must be Hot Air Levelling (HAL).
5.4 Solder mask
- Solder mask type: Liquid Film Electra EMP110 or equivalent.
- Solder mask thickness: 10–30 µm.
5.5 Silk screen
- Silk screen color: White.
- Silk screen must be applied after application of solder mask if solder mask is required.
- The silk screen ink must not extend into any plated-through-holes.
- The silk screen must be clippe d back to the line of resistance.
Freedom Development Board FRDM-KW24D512 User’s Guide, Rev. 1, 05/2016 NXP Semiconductors 29
Revision History
5.6 Electrical PCB testing
- All PCBs must be 100% tested for opens and shorts.
- Impedance measurement: An impedance measurement report is not mandatory.
5.7 Packaging
Packaging for the PCBs must meet the following requirements:
- Finished PCBs must remain in panel.
- Finished PCBs must be packed in plastic bags th at do not contain silicones or sulphur materials. These materials can degrade solderability.
5.8 Hole specification/tool table
See the ncdrill-1-4.tap file included with the Gerber files and the F AB-28684.pdf file.
5.9 File description
Files included with the download include Design, Gerber, and PDF files. Gerber files are RS-274x format. Not all files included with the Gerber files are for PCB manufacturing. PDF files included are:
- F AB-28684.pdf—FRDM-KW24D512 platform fabrication drawing
- GRB-28684.zip—FRDM-KW24D512 Metal layers, solder ma sk, solder paste and silk screen
- SPF-28684.pdf—FRDM-KW24D512 Schematic You can download those files from the Design Files package on the web page: FRDM-KW24D512: NXP Freedom Development Platform for Kinetis KW2x MCUs. Design files are in Allegro format with OrCAD® schematic capture.
6 Revision History
Revision number Date Substantive changes 0 05/2016 Initial release
Information in this document is provided solely to enable system and software implementers to use Freescale products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document. Freescale reserves the right to make changes without further notice to any products herein. Freescale makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including “typicals,” must be validated for each customer application by customer’s technical experts. Freescale does not convey any license under its patent rights nor the rights of others. Freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address: freescale.com/SalesTermsandConditions. How to Reach Us: Home Page: nxp.com Web Support: nxp.com/support Freescale, the Freescale logo, and Kinetis are trademarks of Freescale the property of their respective owners. ARM, the ARM logo, and Cortex are registered trademarks of ARM Limited (or its subsidiaries) in the EU and/or elsewhere. All rights reserved. IEEE 802.15.4 is a registered trademark of the Institute of Electrical and Electronics Engineers, Inc. (IEEE). This product is not endorsed or approved by the IEEE. ZigBee Stack is a trademark of Integration Asssociates. © 2016 Freescale Semiconductor, Inc. Document Number: FRDMKW24DUG Rev. 1