FR5305 VBSEMI | Alldatasheet
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P-Channel 60 V (D-S) MOSFET
FEATURES
- TrenchFET ® Power MOSFET M aterial categorization:
APPLICATIONS
Load Swit ch Notes: a. Duty cycle 1 %. b. When mounted on 1" square PCB (FR-4 ma terial). c. See SOA curve for voltage derating. d. Package limited. PRODUCT SUMMARY VDS (V) RDS(on) ()I D (A) - 60 0.02 at VGS = - 10 V - 50 0.025 at VGS = - 4.5 V - 45 TO-252 SG D Top View S G D P-Channel MOSFET ABSOLUTE MAXIMUM RATINGS (TA = 25 °C , unless otherwise noted) Parameter Symbol Limi t Unit Drain-Source Voltage VDS - 60 V Gate-Source Vo ltage VGS ± 20 Continuous Drain Current (TJ = 175 °C) TC = 25 °C ID - 50 A TC = 125 °C - 40 Pulsed Dra in Current IDM - 160 Avalanche Current IAS - 50 Single Pulse Avalanche Energya L = 0.1 mH EAS 125 mJ Power Dissipation TC = 25 °C PD 113c WTA = 25 °C 2.5b, c Operating Junction and Storage Temperature Range TJ, Tstg - 55 to 150 °C THERMAL RESISTANCE RATINGS Parameter Sym bol Typical Maximum Unit Junction-to-Ambientb t 10 s RthJA 15 18 °C/WSteady State 40 50 Juncti on-to-Case RthJC 0.82 1.1 www.VBsemi.tw E-mail:China@VBsemi TEL:86-755-83251052 FR5305 A ll data sheet.com
Notes: a. P ulse test; pulse width 300 µs, duty cycle 2 %. b. Guaranteed by design, not subject to production testing. c. Independent of operating temperature. Stresses beyond those list ed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. SPECIFICATIONS (TJ = 25 °C, u nless otherwise noted) Parameter Symbol T est Conditions Min. Typ. Max. Unit Static Drain-Source Breakdown Voltage VDS VGS = 0 V, ID = - 250 µA - 60 V Gate Threshold Voltage VGS(th) VDS = VGS, ID = - 250 µA - 1.5 - 3 Gate-Body Leakage IGSS VDS = 0 V, VGS = ± 20 V ± 100 nA Zero Gate V oltage Drain Current IDSS VDS = - 60 V, VGS = 0 V - 1 µAVDS = - 60 V, VGS = 0 V, TJ = 125 °C - 50 VDS = - 60 V, VGS = 0 V, TJ = 150 °C - 100 On-State Drain Currenta ID(on) VDS = -5 V, VGS = - 10 V - 50 A Drain-Source On-State Resistancea RDS(on) VGS = - 10 V, ID = - 17 A 0.020 0.025 VGS = - 10 V, ID = - 40 A, TJ = 125 °C 0.030 VGS = - 10 V, ID = - 40 A, TJ = 150 °C 0.035 VGS = - 4.5 V, ID = - 14 A 0.0 Forward Transconductancea gfs VDS = - 15 V, ID = - 17 A 61 S Dynamicb Input Capacitance Ciss VGS = 0 V, VDS = - 25 V, f = 1 MHz 2950 pFOutput Capacitance Coss 380 Reverse Transfe r Capacitance Crss 305 Total Gate Chargec Qg VDS = - 30 V, VGS = - 10 V, ID = - 40 A 110 165 nCGate-Source Chargec Qgs 19 Gate-Drain Chargec Qgd 28 Tur n-On Delay Timec td(on) VDD = - 30 V, RL = 0.6 Ω ID ≅ - 40 A, VGEN = - 10 V, RG = 6 Ω 15 23 nsRise Timec tr 70 105 Turn-Off Delay T imec td(off) 175 260 Fall Ti mec tf 175 260 Source-Drain Diode Rating s and Characteristics TC = 25 °Cb Continuous Current IS - 40 A Pulsed Current ISM - 80 Forward Voltagea VSD IF = - 40 A, VGS = 0 V - 1 - 1.6 V Reve rse Recovery Time trr IF = - 40 A, dI/dt = 100 A/µs 45 70 ns 400.025 www.VBsemi.tw E-mail:China@VBsemi TEL:86-755-83251052 FR5305 A ll data sheet.com
TYPICAL CHARACTERISTICS ( 25 °C, unless otherwise noted) Output Characteristics Tra nsconductance Capacitance VDS - Drain-to-Source Voltage (V) - Drain Current (A)ID 3 V 012345 VGS = 10 thru 4 V 100 0 1 02 03 04 05 06 0 VGS - Gate-to-Source Voltage (V) - Transconductance (S)g fs TC = - 55 °C 25 °C 125 °C 500 1000 1500 2000 2500 3000 3500 4000 0 1 02 03 04 05 06 0 VDS - Drain-to-Source Voltage (V) C - Capacitance (pF) Ciss Coss Crss Transfer Characteristics On-Resistance vs. Drain Current Gate Charge 3.5 4.0 VGS - Gate-to-Source Voltage (V) - Drain Current (A)ID 25 °C - 55 °C TC = 125 °C 0.000 0.020 0.030 0.040 0.050 0.060 0 1 02 03 04 0 5 06 07 08 0 - On-Resistance (Ω) ID - Drain Current (A) RDS(on) VGS = 10 V VGS = 4.5 V 0 20 40 60 80 100 120 - Gate-to-Source Voltage (V) Qg - Total Gate Charge (nC) VGS VDS = 30 V ID = 40 A www.VBsemi.tw E-mail:China@VBsemi TEL:86-755-83251052 FR5305 A ll data sheet.com
MAL RATINGS (25 °C, unless otherwise noted) On-Resistance vs. Junction Tem perature 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 (Normalized)- On-Resistance TJ - Junction Temper ature (°C) RDS(on) VGS = 10 V ID = 17 A - 50 - 25 0 25 50 75 100 125 150 Source-Drain Diod e Forward Voltage VSD - Source-to-Drain Voltage (V) - Source Current (A)I S 100 TJ = 25 °C TJ = 150 °C Drain Current vs. C ase Temperature TC - Case Temperature ( °C) - Drain Current (A)I D 0 25 50 75 100 125 150 Safe Operating Area 100 0.1 1 10 100 - Drain Current (A)I D TC = 25 °C Single Pulse RDS(on)* Limited by P(t) = 0.01 P(t) = 0.001 P(t) = 0.0001 P(t) = 1 P(t) = 0.1 BVDSS Limited VDS - Drain-to-Source Voltage (V) *V GS > minimum VGS at which RDS(on) is specified Normalized Thermal Transient Imp edance, Junction-to-Case Square Wave Pulse Dur ation (s) 0.1 0.01 10-4 10-3 10-2 10-1 Normalized Effective Transient Thermal Impedance 0.2 0.1 0.05 Duty Cycle = 0.5 Single Pulse 0.02 www.VBsemi.tw E-mail:China@VBsemi TEL:86-755-83251052 FR5305 A ll data sheet.com
- Dimen si on L3 is for reference only. L3D b b2 C gage plane height (0.5 mm) e E A L H MILLIMETERS INCHES DIM. MIN. MAX. M IN. MAX. A 2.18 2.38 0.086 0.094 A1 - 0.127 - 0.005 b 0.64 0.88 0.025 0.035 b2 0.76 1.14 0.030 0.045 b3 4.95 5.46 0.195 0.215 C 0.46 0.61 0.018 0.024 C2 0.46 0.89 0.018 0.035 D 5.97 6.22 0.235 0.245 D1 5.21 - 0.205 - E 6.35 6.73 0.250 0.265 E1 4.32 - 0.170 - H 9.40 10.41 0.370 0.410 e 2.28 BSC 0.090 BSC e1 4.56 BSC 0.180 BSC L 1.40 1.78 0.055 0.070 L3 0.89 1.27 0.035 0.050 L4 - 1.02 - 0.040 L5 1.14 1.52 0.045 0.060 ECN: X12-0247-Rev. M, 24-Dec-12 DWG: 5347 www.VBsemi.tw E-mail:China@VBsemi TEL:86-755-83251052 FR5305 A ll data sheet.com
DS FOR DPAK (TO-252) 0.420 (10.668) Recommended Minimum Pads Dimensions in Inches/(mm) 0.224 (5.690) 0.180 (4.572) 0.055 (1.397) 0.243 (6.180) 0.087 (2.202) 0.090 (2.286) www.VBsemi.tw E-mail:China@VBsemi TEL:86-755-83251052 FR5305 A ll data sheet.com
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