FA1105W ETC1 | Alldatasheet

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I Electro-Optical Characteristics Part No. Water Clear TYP. IF Wavelength Spectral Line Half Width Forward Voltage VF TYP. MAX. IF Reverse Current IR MAX. VR Viewing Angle (2 θ 1/2) Red Orange Yellow 180 200 180 635 609 592 626 605 590 1.9 1.9 1.9 2.4 2.4 2.4 100 100 100 AlInGaP AlInGaP AlInGaP FR1105W FA1105W FY1105W Units mcd mA nm mA mA µA V Deg. V MIN. TYP. Peak λp TYP. Dominant λd TYP. IF Luminous Intensity IV Lens Color Emitted Color 50° I Outline Dimensions I Features

  • High brightness AllnGaP die material
  • Dome lens provides intensified narrow, bright beam
  • Available for both standard and reverse mounting
  • Wider operating temperature: -40° ~ +100°C I Applications
  • High-beam indicator for automotive use
  • Backlighting for automotive dashboards
  • Indoor / outdoor full-color signboards Anode Polarity Mark PCB Cathode Cathode Mark 0.5 3.2 0.6 0.6 1.6 0.5 1.55 R0.8 0.3 1.6 (1.6) (2) (4.6) 2.3+0.05 1.6 HOLE 1.5 2.1 + 0.05 1.5 F_1105W Series, Dome Lens Type AlInGaP SMT LED F_1105W Series, Dome Lens Type AlInGaP SMT LED Material Unit: mm Tolerance + 0.1 (Ta=25°C) I Recommended Solder Pad at Surface Mount I Recommended Solder Pad at reverse mount

1.0 (DC) 3.33 (Pulse) -40 to +100 -40 to +120 Red-Orange FR 100 Orange-Red FA 100 I Absolute Maximum Ratings Power Dissipation Forward Current Peak Forward Current Reverse Voltage Operating Temperature Storage Temperature Derating* Symbol Pd IF IFM VR Topr Tstg ∆IF Amber FY 100 mW mA mA V mA/°C * Ta=25°C, IFM applies for the pulse width ≤1msec. and duty cycle ≤1/20. Units Item FR, FA, FY (X & Y) I Spatial Distribution Stanley Electric Sales of America, Inc.

2660 Barranca Parkway, Irvine, CA 92606 •• Tel: 800-LED-LCD1 (533-5231) •• Fax: 949-222-0555

Website: www.stanley-electric.com (Ta=25°C) I Precautions Please follow these handling precautions to prevent damage to the chip and ensure its reliability. 1. Soldering conditions:

  • Soldering iron: Temperature at tip of iron: 280°C max. (30W max.) Soldering time: 3 sec. max.
  • Dip soldering: Preheating: 120 ~ 150°C max. (resin surface temp.)
  • Reflow Soldering: 2. Cleaning:
  • If cleaning is required, use the following solutions for less than 1 minute, at less than 40°C.
  • Appropriate chemicals: Ethyl alcohol and isopropyl alcohol.
  • Effect of ultrasonic cleaning on the LED resin body differs depending on such factors as the oscillator output, size of PCB and LED mounting method. The use of ultrasonic cleaning should be enforced at proper output after confirming there is no problem. Product specifications subject to change without notice. PGF_1105W-0301 Operation Heating Pre-heating LED Surface Temperature Temperature rise: 5°C/sec. Cooling: —5°C/sec. 60 to 120 sec. 5 sec. max 120 150 240 I Operation Current Derating Chart (DC) FR, FA, FY I Taping Specifications (3.45) (0.25) (2.1) Center Hole Center Hole (1.85) 4+0.1 φ 1.5 +0.1 8+0.2 2+0.05 4+0.1 3.5+0.05 1.75+0.1 φ 1.1) Quantity on tape: 2000 pieces per reel φ 21+0.8 9+0.3 11.4+1 φ 13+0.2 φ 180+0 φ 60 +1 φ 13+0.2 2+0.5 I Taping Specifications φ 1.5 (1.8) (0.25) (0.5) (2.2) (3.5) +0.1 4+0.1 4+0.1 2+0.05 1.75+0.1 3.5+0.05 8+0.2 Center Hole φ 1.1) Quantity on tape: 2000 pieces per reel Cathode RR Direction to pull Cathode TR Direction to pull for Reverse Mount Type for Standard Mount Type