FPV1006 EATON | Alldatasheet

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Technical content

High current power inductors Product features

  • Magnetically shielded
  • Inductance range 85 nH to 150 nH
  • Current range from 25 A to 81 A
  • 10.3 mm x 8.7 mm footprint surface mount package in 6.4 mm height
  • Ferrite core material

Applications

  • Compatible with Picor® Cool-Power® ZVS Buck and Buck-Boost regulator families Environmental Data
  • Storage temperature range (component): -55 °C to +125 °C
  • Operating temperature range: -55 °C to +125 °C (ambient plus self-temperature rise)
  • Solder reflow temperature: J-STD-020 (latest revision) compliant Pb HALOGEN HFFREE Picor® and Cool-Power® are trademarks of Vicor Corporation.

High current power inductors www.eaton.com/electronics Product Specifications Part Number4 OCL1 (nH) ±10% Irms (A) Isat (A) DCR (mΩ) @ +20 °C maximum FPV1006-85-R 85 25 81 0.41 FPV1006-125-R 125 25 57 0.41 FPV1006-150-R 150 25 45 0.41 1. Open Circuit Inductance (OCL) Test Parameters: 100 kHz, 0.1 Vrms, 0.0 Adc, +25 °C 2. Irms: DC current for an approximate temperature rise of 40 °C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed +125 °C under worst case operating conditions verified in the end application. 3. Isat : Peak current for approximately 5% rolloff @ +25 °C 4. Part Number Definition: FPV1006-xxx-R FPV1006 = Product code and size xxx=Inductance value in nH, -R suffix = RoHS compliant Note: Hipot: 250 Vdc minimum for 2 seconds, conductor to core Dimensions (mm) Part marking: FPV1006–xxx, xxx=inductance value in nH, wwllyy= date code, R=revision level Tolerances are ±0.25 unless stated otherwise Soldering surfaces to be coplanar within 0.102 millimeters DCR measured from point “a” to point “b” Do not route traces or vias underneath the inductor. Packaging information (mm) Supplied in tape and reel packaging, 620 parts per 13” diameter reel Recommended Pad Layout Schematic Direction of feed

High current power inductors www.eaton.com/electronics Inductance characteristics 20% 30% 40% 50% 60% 70% 80% 90% 100% 110% 00 20 46 00 81 00 1201 40 % of OCL FPV1006-85-R Idc (A) -40° C +125° C +25° C 20% 30% 40% 50% 60% 70% 80% 90% 100% 110% 010 20 30 45 00 60 70 80 91 00 % of OCL FPV1006-125-R Idc (A) -40° C +125° C +25° C 20% 30% 40% 50% 60% 70% 80% 90% 100% 110% 00 10 20 34 00 50 60 70 8 % of OCL Idc (A) -40° C +125° C FPV1006-150-R +25° C

1000 Eaton Boulevard

Cleveland, OH 44122 United States www.eaton.com/electronics © 2017 Eaton All Rights Reserved Printed in USA Publication No. 10390-BU-SB15163 September 2017 Eaton is a registered trademark. All other trademarks are property of their respective owners. FPV1006 High current power inductors Technical Data 10390 Effective September 2017 Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Temperature t tP ts TC -5°C Time 25°C to Peak Time 25°C Tsmin Tsmax TL TP Preheat A Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Solder reflow profile Reference JDEC J-STD-020D Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak • Temperature min. (Tsmin) 100°C 150°C

  • Temperature max. (Tsmax) 150°C 200°C
  • Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds Average ramp up rate Tsmax to Tp 3°C/ Second Max. 3°C/ Second Max. Liquidous temperature (Tl) Time at liquidous (tL) 183°C 60-150 Seconds 217°C 60-150 Seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp) within 5 °C of the specified classification temperature (T c) 20 Seconds 30 Seconds** Average ramp-down rate (Tp to Tsmax) 6°C/ Second Max. 6°C/ Second Max. Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Table 1 - Standard SnPb Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 ≥350 ≥2.5mm 220°C 220°C Table 2 - Lead (Pb) Free Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 350 - 2000 Volume mm3 >2000 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C