FPT705-300-R

FPT705 COOPER | Alldatasheet

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 6

Technical content

• Halogen free, lead free, RoHS com pliant
• 125°C m axim um total operating tem perature
• 8 .0 x 7.1 x 5.3 5m m m axim um surface m ount package
• Ferrite core m aterial
• D ual conductor, tw o-turn construction
• Inductance range from 150nH to 3 00nH Dual Conductor , High Current Pow er Inductors Flat-Pac™ FPT705 Series 08 12 BU -SB126 18 Page 1 of 6 D ata Sheet: 4451 HALOGEN HFFREE Pb

Applications

• D esigned specifically for use w ith Picor ® C ool-Pow er ® ZVS-Buck Regulator Fam ily (Picor part num ber Series PI3 3 xx and PI3 4xx) Environm ental D ata
• Storage tem perature range: -40°C to +125°C
• O perating tem perature range: -40°C to +125°C (am bient + self-tem perature rise)
• Solder reflow tem perature: J-STD -020D com pliant Packaging
• Supplied in tape-and reel packaging, 14 00 parts per 13 ” diam eter reel Product Specifications Part Number 6 OCL 1 ±10% (nH) FLL 2 min. (nH) Irms 3 (Amps) Isat 4 @ 25°C (Amps) DCR 5 (m Ω) @ 20°C FPT705-150-R 150 13 5 3 5 FPT705-170-R 170 153 3 1 FPT705-190-R 190 171 28 FPT705-200-R 200 18 0 13 25 0.6 5 ± 0.15 FPT705-23 0-R 23 0 207 23 FPT705-270-R 270 243 19 FPT705-3 00-R 3 00 270 17 1. O pen C ircuit Inductance (O C L) test param eters: 100kHz, 0.1V rm s , 0.0A dc @ 25°C (Pins 1-3 , short 2-4). 2. Full Load Inductance (FLL) test param eters: 100kHz, 0.1V rm s , Isat 1 @ 25°C (Pins 1-3 , short 2-4). 3 . Irm s : D C current for an approxim ate tem perature rise of 40°C w ithout core loss. D erating is necessary for A C currents. PC B layout, trace thickness and w idth, air-flow , and proxim ity of other heat-generating com ponents w ill affect the tem perature rise. It is recom m ended that the tem perature of the part not exceed 125°C under w orst case operating conditions verified in the end application. 4. Isat 1: Peak current for approxim ately 2% rolloff at +25 ℃. 5. D C R Tested from Pins (1-2) and (3 -4) @ 20°C . 6 . Part N um ber D efinition: FPT705-xxx-R FPT705 = Product code and size xxx= Inductance value in nH “-R” Suffix = RoHS com pliant

08 12 BU -SB126 18 Page 2 of 6 D ata Sheet: 4451 5.55 Section A-A Dire cti on of Feed Supplied in tape and reel packaging, 1400 parts on a 13 ” diam eter reel. Packaging Inform ation - m m D im ensions - m m Top View Side View Bottom View Recommended Pad Layout Schematic 5.35 D C R is m easured betw een points "A " and point "B" Part M arking:

• FPT705 (Product code and size)
• xxx = (Inductance= (Inductance value in nH)
• w w llyy= D ate C ode, R= Revision level A ll soldering surfaces to be coplanar w ithin 0.10 m illim eters.

08 12 BU -SB126 18 Page 3 of 6 D ata Sheet: 4451 Inductance C haracteristics FPT705-150-R FPT705-170-R 30% 40% 50% 60% 70% 80% 90% 100% 110% 05 1 0 1 5 2 0 2 5 3 0 3 5 4 0 4 5 5 0 5 5 % of OCL Idc (Amps) 30% 40% 50% 60% 70% 80% 90% 100% 110% 05 1 0 1 5 2 0 2 5 3 0 3 5 4 0 4 5 5 0 5 5 6 0 6 5 % of OCL Idc (Amps)

08 12 BU -SB126 18 Page 4 of 6 D ata Sheet: 4451 Inductance C haracteristics FPT705-190-R FPT705-200-R & -230-R 30% 40% 50% 60% 70% 80% 90% 100% 110% 0 5 10 15 20 25 30 35 40 45 50 of OCL Idc (Amps) 30% 40% 50% 60% 70% 80% 90% 100% 110% 05 1 0 1 5 2 0 2 5 3 0 3 5 4 0 4 5 5 0 % of OCL Idc (Amps) FPT705 -200-R FPT705 -230-R

08 12 BU -SB126 18 Page 5 of 6 D ata Sheet: 4451 Inductance C haracteristics FPT705-270-R & -300-R 30% 40% 50% 60% 70% 80% 90% 100% 110% 05 1 0 1 5 2 0 2 5 3 0 3 5 4 0 % of OCL Idc (Amps) FPT705 -270-R FPT705 -300-R

© 2012 C ooper B ussm ann w w w .cooperbussm ann.com 08 12 BU -SB126 18 Page 6 of 6 D ata Sheet: 4451 Solder R eflow Profile Temperature t tP ts TC -5°C Time 25°C to Peak Time 25°C Tsmin Tsmax TL TP Preheat A Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s TTaabbllee 11 -- SSttaannddaarrdd SSnnPPbb SSoollddeerr ((TTcc)) Volume Vo lume Package mm 3 mm3 Thickness <3 50 > _350 <2.5mm 2 35°C 220°C TTaabbllee 22 -- LLeeaadd ((PPbb)) FFrreeee SSoollddeerr ((TTcc)) Volume Vo lume Vo lume Package mm 3 mm3 mm3 Thickness <3 50 3 50 - 2000> 2 000 <1.6mm 2 60°C 2 60°C 2 60°C 1.6 – 2 .5mm 2 60°C 2 50°C 2 45°C >2.5mm 2 50°C 2 45°C 2 45°C Reference JDEC J-STD-020D Profile Feature S tandard SnPb Solder Le ad (Pb) Free Solder Preheat and Soak • Tem perature min. (Tsmin)1 0 0 ° C 1 5 0 ° C

• Temperature max. (Tsmax)1 5 0 ° C 2 0 0 ° C
• Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Se conds Average ramp up rate Tsmax to Tp 3°C/ Se cond Max. 3°C/ Se cond Max. Liquidous temperature (TL)1 8 3 ° C 2 1 7 ° C Time at liquidous (tL) 60-150 Seconds 60-150 Se conds Peak package body temperature (TP)* Tab le 1 T able 2 Time (tp) within 5 ° C of the specified classification temperature (Tc) 20 Second s 30 Se conds** Average ramp-down rate (Tp to Tsmax)6 ° C/ Second Max. 6°C/ Se cond Max. Time 25° C to Peak Temperature 6 M inutes Max. 8 M inutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. N orth Am erica C ooper Electronic T echnologies

1225 Broken Sound Parkw ay N W

Boca Raton, FL 3 3 48 7-3 53 3 T el: 1-56 1-998 -4100 Fax: 1-56 1-241-6 6 40 T oll Free: 1-8 8 8 -414-26 45 C ooper Bussm ann P .O . Box 1446 0 St. Louis, M O 6 3 178 -446 0 T el: 1-6 3 6 -3 94-28 77 Fax: 1-6 3 6 -527-16 07 Europe C ooper Electronic T echnologies C ooper (UK ) Lim ited Burton-on-the-W olds Leicestershire • LE12 5TH UK T el: +44 (0) 1509 8 8 2 73 7 Fax: +44 (0) 1509 8 8 2 78 6 C ooper Electronic T echnologies Avda. Santa Eulalia, 290 08 223 T errassa, (Barcelona), Spain T el: +3 4 93 7 3 6 2 8 12 +3 4 93 7 3 6 2 8 13 Fax: +3 4 93 7 3 6 2 719 Asia Pacific C ooper Electronic T echnologies

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#06 -01 Pacific T ech C entre Singapore 1593 03 T el: +6 5 278 6 151 Fax: +6 5 270 416 0 The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document are by definition uncontrolled. This bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Cooper Bussmann reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to change or update, without notice, any technical information contained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications. Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.