FPT705 EATON | Alldatasheet

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Technical content

Dual conductor, high current power inductors Product features

  • Dual conductor, two-turn construction
  • Magnetically shielded
  • 8.3 mm x 7 .5 mm footprint surface mount pack- age in a 5.35 mm height
  • Ferrite core material

Applications

  • Compatible with Picor® Cool-Power® ZVS Buck and Buck-Boost Regulator Families (Picor part number series PI33xx and PI34xx) Environmental Data
  • Storage temperature range (component): -55 °C to +125 °C
  • Operating temperature range: -55 °C to +125 °C (ambient plus self-temperature rise)
  • Solder reflow temperature: J-STD-020 (latest revision) compliant Pb HALOGEN HFFREE Picor® and Cool-Power® are trademarks of Vicor Corporation.

Dual conductor, high current power inductors www.eaton.com/electronics Recommended Pad Layout Schematic 7.8 ±0.5 A 5.35 max 7.2 ±0.3 7.0 ±0.3 1.25 ±0.1 0.1 typ 0.60 ±0.20 1.5 ±0.25 3.7 1.7 1.0 7.9 1.65 0.40 Resist area B Product Specifications Part Number5 OCL1 (nH) ±10% Irms (A) Isat (A) DCR (mΩ) @ +20 °C ±0.15 mΩ FPT705-170-R 170 (±12%) 13 31 0.65 FPT705-190-R 190 13 28 0.65 FPT705-200-R 200 13 25 0.65 FPT705-230-R 230 13 23 0.65 FPT705-270-R 270 13 19 0.65 FPT705-300-R 300 13 17 0.65 1. Open Circuit Inductance (OCL) Test Parameters: 1.0 MHz, 0.1 Vrms, 0.0 Adc, +25 °C 2. Irms: DC current for an approximate temperature rise of 40 °C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed +125 °C under worst case operating conditions verified in the end application. 3. Isat Peak current for approximately 2% rolloff @ +25 °C 4. DCR tested from pins (1-2) and pins (4-3) 5. Part Number Definition: FPT705-xxx-R FPT705 = Product code and size xxx= Inductance value in nH, -R suffix = RoHS compliant Dimensions (mm) Packaging information (mm) Supplied in tape and reel packaging, 1,000 parts per 13” diameter reel Part marking: FPT705, xxx=inductance value in nH, wwllyy= date code R= revision level Soldering surfaces to be coplanar within 0.10 millimeters DCR is measured from point “a” to point “b” Pins 2 and 4 are connected through the PCB trace Do not route traces or vias underneath the inductor 4.0 1.5 dia 1.5 dia 2.0 1.75 16.0 ±0.3 7.5 8.2 5.55 12.0 7.4 Direction of Feed Section A–A A A

Dual conductor, high current power inductors www.eaton.com/electronics Inductance characteristics 30% 40% 50% 60% 70% 80% 90% 100% 110% 501 01 52 02 53 03 54 04 55 05 5 % of OCL Idc (A) FPT705-170-R- 30% 40% 50% 60% 70% 80% 90% 100% 110% 51 01 52 02 53 03 54 04 55 0 % of OCL Idc (A) FPT705-190-R 30% 40% 50% 60% 70% 80% 90% 100% 110% 501 01 52 02 53 03 54 04 55 0 % of OCL FPT705-200-R Idc (A) FPT705-200-R, FPT705-230-R FPT705-230-R 30% 40% 50% 60% 70% 80% 90% 100% 110% 05 10 15 20 25 30 35 40 % of OCL Idc (A) FPT705-270-R FPT705-270-R, FPT705-300-R FPT705-300-R

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Cleveland, OH 44122 United States www.eaton.com/electronics © 2017 Eaton All Rights Reserved Printed in USA Publication No. 4451- BU-SB15121 September 2017 Eaton is a registered trademark. All other trademarks are property of their respective owners. FPT705 Dual conductor, high current power inductors Technical Data 4451 Effective September 2017 Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Temperature t tP ts TC -5°C Time 25°C to Peak Time 25°C Tsmin Tsmax TL TP Preheat A Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Solder reflow profile Reference JDEC J-STD-020D Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak • Temperature min. (Tsmin) 100°C 150°C

  • Temperature max. (Tsmax) 150°C 200°C
  • Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds Average ramp up rate Tsmax to Tp 3°C/ Second Max. 3°C/ Second Max. Liquidous temperature (Tl) Time at liquidous (tL) 183°C 60-150 Seconds 217°C 60-150 Seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp) within 5 °C of the specified classification temperature (T c) 20 Seconds 30 Seconds** Average ramp-down rate (Tp to Tsmax) 6°C/ Second Max. 6°C/ Second Max. Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Table 1 - Standard SnPb Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 ≥350 ≥2.5mm 220°C 220°C Table 2 - Lead (Pb) Free Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 350 - 2000 Volume mm3 >2000 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C