FPT1006 EATON | Alldatasheet

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Technical content

Dual conductor high current power inductors

Description

  • Dual conductor, two-turn construction
  • Magnetically shielded
  • Inductance range from 340 nH to 580 nH
  • Current range from 19 A to 40.5 A
  • 10.5 mm x 8.8 mm footprint surface mount package in a 6.4 mm height
  • Ferrite core material
  • Halogen free, lead free, RoHS compliant

Applications

  • Compatible with Picor® Cool-Power® ZVS Buck and Buck-Boost Regulator Families Environmental Data
  • Storage temperature range (component): -55 °C to +125 °C
  • Operating temperature range (component): -55 °C to +125 °C (ambient plus self-temperature rise)
  • Solder reflow temperature: J-STD-020D compliant Pb HALOGEN HFFREE Picor® and Cool-Power® are trademarks of Vicor Corporation.

Dual conductor high current power inductors www.eaton.com/elx Product Specifications Part Number5 OCL1 (nH) ±10% Irms (A) Isat (A) DCR4 (mΩ) maximum @ 20°C FPT1006-340-R 340 19 40.5 1.0 FPT1006-400-R 400 19 35.5 1.0 FPT1006-500-R 500 19 27.5 1.0 FPT1006-580-R 580 19 23.0 1.0 1. Open Circuit Inductance (OCL) Test Parameters: 100 kHz, 0.1 Vrms, 0.0 Adc, +25 °C (Pins 4-2, short 1-3) 2. Irms: DC current for an approximate temperature rise of 40 °C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed +125 °C under worst case operating conditions verified in the end application. 3. Isat : Peak current for approximately 5% rolloff @ +25 °C 4. DCR tested from pins (1-2) and (3-4) 5. Part Number Definition: FPT1006-xxx-R FPT1006 = Product code and size xxx = Inductance value in nH, -R suffix = RoHS compliant Note: Hipot: 250 Vdc minimum for 2 seconds, 1.0 mA pins (1-2) and pins (4-3) to core Dimensions (mm) Part marking: FPT1006-xxx, xxx = inductance value in nH, wwllyy=date code, R=revision level Tolerances are ±0.25 unless stated otherwise All mounting surfaces to be coplanar within 0.102 mm Recommended Pad Layout Schematic 0.56 2.8 ±0.2 Resist area FPT1006-XXX wwllyy R 10.0 ±0.5 9.65 ±0.3 8.5 ±0.3 0.4 1.2 6.4 max Pins 1 and 3 connected through PCB trace 10.0 0.5 1.5 1.53.0 1

Dual conductor high current power inductors www.eaton.com/elx Inductance characteristics Packaging information (mm) Supplied in tape and reel packaging, 620 parts per 13” diameter reel Direction of feed 6.6 Section A – A 1.5 dia 1.5 dia 4.0 2.0 9.7 16.0 A A 1.75 11.5 24.0 ±0.3 FPT1006–xxx wwllyy R 8.5 3.4 30% 40% 50% 60% 70% 80% 90% 100% 110% 01 02 03 04 05 06 0 % of OCL lDC (A) FPT1006-340-R -40°C +125°C +25°C 30% 40% 50% 60% 70% 80% 90% 100% 110% 05 10 15 20 25 30 35 40 45 50 55 % of OCL -40°C +125°C +25°C FPT1006-400-R 30% 40% 50% 60% 70% 80% 90% 100% 110% 05 10 15 20 25 30 35 40 45 -40°C +125°C +25°C 30% 40% 50% 60% 70% 80% 90% 100% 110% 05 10 15 20 25 30 35 40 -40°C +125°C +25°C % of OCL FPT1006-500-R % of OCL FPT1006-580-R lDC (A) lDC (A)l DC (A)

Dual conductor high current power inductors Technical Data 10389 Effective April 2016 Eaton Electronics Division

1000 Eaton Boulevard

Cleveland, OH 44122 United States www.eaton.com/elx © 2016 Eaton All Rights Reserved Printed in USA Publication No. 10389 BU-SB15162 April 2016 Eaton is a registered trademark. All other trademarks are property of their respective owners. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Temperature t tP ts TC -5°C Time 25°C to Peak Time 25°C Tsmin Tsmax TL TP Preheat A Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Solder reflow profile Reference JDEC J-STD-020D Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak • Temperature min. (Tsmin) 100°C 150°C

  • Temperature max. (Tsmax) 150°C 200°C
  • Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds Average ramp up rate Tsmax to Tp 3°C/ Second Max. 3°C/ Second Max. Liquidous temperature (Tl) Time at liquidous (tL) 183°C 60-150 Seconds 217°C 60-150 Seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp) within 5 °C of the specified classification temperature (T c) 20 Seconds 30 Seconds** Average ramp-down rate (Tp to Tsmax) 6°C/ Second Max. 6°C/ Second Max. Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Table 1 - Standard SnPb Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 ≥350 ≥2.5mm 220°C 220°C Table 2 - Lead (Pb) Free Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 350 - 2000 Volume mm3 >2000 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C