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Technical content

Features

 Dual-Input, Single-Output Load Switch  Input Supply Operating Range: ­ 4~10.5 V at VIN ­ 4~6.5 V at VBUS  Typical RON: ­ 95 mΩ at VIN=5 V ­ 70 mΩ at VBUS=5 V  Bi-Directional Switch for VIN and VBUS  Slew Rate Controlled: ­ 50 µs at VIN for < 4.7 µF COUT ­ 90 µs at VBUS for < 4.7 µF COUT  Maximum ISW: 2 A Per Channel  Break-Before-Make Transition  Under-Voltage Lockout (UVLO)  Over-Voltage Lockout (OVLO)  Thermal Shutdown  Logic CMOS IO Meets JESD76 Standard for GPIO Interface and Related Power Supply Requirements  ESD Protected: ­ Human Body Model: >3 kV ­ Charged Device Model: >1.5 kV ­ IEC 61000-4-2 Air Discharge: >15 kV ­ IEC61000-4-2 Contact Discharge: >8 kV

Description

The FPF3040 is a 20 V-rated Dual-Input Single-Output (DISO) load switch consisting of two channels of slew- rate-controlled, low-on-resistance, N-channel MOSFET switches with protection features . The slew -rate- controlled turn-on characteristic prevents inrush current and the resulting excessive voltage droop on the input power rails. The input voltage range operates from 4 V to 6.5 V at V BUS and from 4 V to 10.5 V at V IN to align with the needs of low -voltage portable device power rails. VIN and V BUS have the over -voltage protection functionality of typ ical 12 V and 7.5 V, respectively, to avoid unwanted damage to system. VIN and VBUS bi-directional switching allow s reverse current from V OUT to VIN or VBUS for On-The-Go, (OTG) Mode. The switching is controlled by logic input EN and VIN_SEL is capable of interfacing directly with low -voltage control signal General-Purpose Input / Output (GPIO). FPF3040 is available in 1.8 mm x 2.0 mm Wafer-Level Chip-Scale Package (WLCSP), 16-bump, 0.4 mm pitch.

Applications

 Input Power Selection Block Supporting USB and Wireless Charging  Smartphone / Tablet PC

Ordering Information

Mark Channel Typical RON per Channel at 5VIN Rise Time (tR) Package FPF3040UCX QY DISO 95 mΩ for VIN 50 µs for VIN 1.8 mm x 2.0 mm Wafer-Level Chip-Scale Package (WLCSP), 16-Bump, 0.4 mm Pitch 70 mΩ for VBUS 90 µs for VBUS

Figure 31. 1.8 mm x 2.0 mm Wafer-Level Chip-Scale Package (WLCSP), 16-Bump, 0.4 mm Pitch specifically the warranty therein, which covers Fairchild products.

0.005 C A B

0.05 C E

A. NO JEDEC REGISTRATION APPLIES. B. DIMENSIONS ARE IN MILLIMETERS. ±39 MICRONS (547-625 MICRONS). G. DRAWING FILNAME: MKT-UC016AArev2.

© 2012 Fairchild Semiconductor Corporation www.fairchildsemi.com FPF3040 • Rev. 2.4.1 12 FPF3040 — IntelliMAX™ 20V-Rated Dual Input Single Output Power-Source-Selector Switch