FPF2498

FPF2498 ONSEMI | Alldatasheet

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© 2013 Fairchild Semiconductor Corporation www.fairchildsemi.com FPF2498 • Rev. 1.11 FPF2498 — Adjustable OVP with 28 V Input OVT Load Switch FPF2498 Adjustable OVP with 28 V Input OVT Load Switch

Features

Function Advanced Load Switch Input 3.5 – 12 V

1.7 A Maximum Continuous

80 mΩ RON Typical Over-Voltage Protection (OVP) Over-Current Protection (OCP) Thermal Shutdown Under-Voltage Lockout (UVLO) Reverse Current Blocking (RCB) ESD 15 kV IEC 61000-4-2 Air Gap Operating Temperature Range -40 to +85°C Package 6-Ball WLCSP (1.05 x 1.3 x 0.625 mm, 0.4 mm Pitch) Ordering Information FPF2498BUCX Top Mark TK

Description

The FPF2498 advanced load -management switch targets applications requiring a highly integrated solution. It disconnects loads powered from the DC power rail (<12 V) with stringent off-state current targets and high load capacitances (<100 µF). The FPF2498 consists of a slew -rate controlled low -impedance MOSFET switch. FPF2498 has over -voltage protection and over-temperature protection.

Applications

 Cellular Phones, Smart Phones  Tablets Related Resources  FPF2498 Evaluation Board CLOAD V_IO Rpull-up CIN3-6V CONTROL FPF2498 OVP Charge Pump Thermal Shutdown UVLO RCB ONOFF VOUT FLAGB VIN ON GND OVLO Figure 1. Block Diagram and Typical Application

1. Recommend CLOAD value be larger than 2.2 μf.

Figure 2. Pin Assignments

© 2013 Fairchild Semiconductor Corporation www.fairchildsemi.com FPF2498 • Rev. 1.11 3 FPF2498 — Adjustable OVP with 28 V Input OVT Load Switch Absolute Maximum Ratings Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol Parameters Min. Max. Unit VPIN Voltage on VIN to GND, VIN to VOUT, OVLO Pins -0.3 28.0 V Voltage on ON, FLAGB Pins -0.3 6.0 Voltage on VOUT to GND Pins -0.3 20.0 ISW Maximum Switch Current 1.75 A tPD Total Power Dissipation at TA=25°C 1 W TJ Operating Junction Temperature -40 +150 °C TSTG Storage Junction Temperature -65 +150 °C JA Thermal Resistance, Junction-to-Ambient (1-inch Square Pad of 2 oz. Copper) 95(2) °C/W 110(3) ESD Electrostatic Discharge Capability Human Body Model, ANSI / ESDA / JEDEC JS-001-2012 3 kV Charged Device Model, JESD22-C101 2 IEC61000-4-2 System Level Air Discharge (VIN, VON, VOUT to GND) 15 Contact Discharge (VIN, VON, VOUT to GND) 8 Notes: 2. Measured using 2S2P JEDEC std. PCB. 3. Measured using 2S2P JEDEC PCB cold plate method. Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to Absolute Maximum Ratings. Symbol Parameters Min. Max. Unit VIN Supply Voltage 3.5 12.0 V ISW Maximum Continues Switch Current(4) 1.7 A TA Ambient Operating Temperature -40 85 °C Note: 4. Maximum Junction Temperature = 85°C

© 2013 Fairchild Semiconductor Corporation www.fairchildsemi.com FPF2498 • Rev. 1.11 4 FPF2498 — Adjustable OVP with 28 V Input OVT Load Switch

Electrical Characteristics

Unless otherwise noted; VIN=3.5 to 5.5 V, TA=-40 to +85°C; typical values are at VIN=5 V and TA=25°C. Symbol Parameter Conditions Min. Typ. Max. Unit Basic Operation ISD(OFF) Shutdown Current VIN=5.5 V, VOUT=0 V, VON=GND 0.4 3.0 μA IQ Quiescent Current VIN=5.5 V, VOUT=Floating, IOUT=0 mA 90 125 μA RON On Resistance VIN=3.7 V, IOUT=200 mA 90 mΩ VIN=5.0 V, IOUT=200 mA 80 95(5) VIN=9 V, IOUT=200 mA VIN=12 V, IOUT=200 mA VIH ON Input Logic HIGH Voltage VIN=3.5 V to 5.5 V 1.15 V VIL ON Input Logic LOW Voltage VIN=3.5 V to 5.5 V 0.65 V VOL_FLAG FLAGB Output Logic LOW Voltage VIN=5 V, ISINK=1 mA 0.10 0.20 V IFLAGB_LK FLAGB Output HIGH Leakage Current VIN=5 V, Switch On 0.5 μA RPD Pull-Down Resistance on ON Pin VIN=5 V, OVLO=GND 3 MΩ Over-Voltage Protection VOV_TRIP Default Input OVP Lockout VIN Rising Threshold OVLO=GND 6.2 6.5 6.8 V VIN Falling Threshold OVLO=GND 6.2 VOVLO_SEL Voltage threshold for OVLO selection VIN=3.5 V to 5.5 V, OVLO=GND 0.3 V VOVP_HYS Input OVP Hysteresis VIN Falling Threshold OVLO=External Setting 0.3 V VOVLO_TH OVLO Set Threshold VIN=3.5 to VOVLO 1.20 V tOVP Response Time IOUT=0.5 A, CL=0 µF, TA=25°C, VIN=6 V to 7 V 0.5 1 μs VUVLO Under-Voltage Lockout VIN Rising 3.2 V VIN Falling 3.0 VUVLO_HYS UVLO Hysteresis 200 mV IRCB RCB Current VON=0 V, VOUT=5.5 V, VIN=0 V 2 5 μA TSD Thermal Shutdown Shutdown Threshold 150 °C Return from Shutdown 130 Hysteresis 20 Over-Current Protection IOCP Over-Current Protection Trip Point ISW > IOCP 2 A Dynamic Characteristics tDON Turn-On Delay(7) VIN=5 V, RL=100 Ω, CL=10 µF, TA=25°C 4.3 ms tR VOUT Rise Time(7) 3.0 ms tON Turn-On Time(8) 7.3 ms tDOFF Turn-Off Delay(6,7) 600 µs tF VOUT Fall Time(6,7) 2.0 ms tOFF Turn-Off Time(6,9) 2.5 ms tREADY Time for Device Ready for Large Load Current(10) CL=10 µF 5 ms Continued on the following page…

© 2013 Fairchild Semiconductor Corporation www.fairchildsemi.com FPF2498 • Rev. 1.11 5 FPF2498 — Adjustable OVP with 28 V Input OVT Load Switch Unless otherwise noted; VIN=3.5 to 5.5 V, TA=-40 to +85°C; typical values are at VIN=5 V and TA=25°C. Symbol Parameter Conditions Min. Typ. Max. Unit tRESTART Over-Current Blanking Time(6) VIN=5 V IOUT ≥ 1.7 A 64 ms tOCP Over-Current Response Time(6) Moderate Over-Current Condition; IOUT ≥ ILIM VOUT ≤ VIN 4 µs tHOCP Hard Over-Current Response Time Moderate Over-Current Condition; IOUT ≥ ILIM VOUT ≤ 0 V 3 µs tFLAGB_Release Over-Current/Voltage/Temp. Flag Release Time(6) Time for Flag to Release when Fault Condition Removed 100 ms Notes: 5. TA=25°C. 6. This parameter is guaranteed by design and characterization; not production tested. 7. tDON/tDOFF/tR/tF are defined in figure below. 8. tON=tR + tDON. 9. tOFF=tF + tDOFF. 10. After tREADY, the device is ready for maximum DC current load condition.

© 2013 Fairchild Semiconductor Corporation www.fairchildsemi.com FPF2498 • Rev. 1.11 7 FPF2498 — Adjustable OVP with 28 V Input OVT Load Switch Operation and Application Description Input Capacitor To limit the voltage drop on the input supply caused by transient inrush current when the switch turns on into discharge load capacitor; a capacitor must be placed between the VIN and GND pins. A high -value C IN capacitor can be used to reduce the voltage drop in high-current applications. Output Capacitor An output capa citor should be placed between the VOUT and GND pins. This capacitor prevents parasitic board inductance from forcing V OUT below ground when the switch is on. This capacitor also prevents reverse inrush current from creating a voltage spike that could damage the device in the case of a VOUT short. Fault Reporting Upon the detection of an over -voltage, over -current, or over-temperature condition, the FLAGB signals the fault by activating LOW. Under-Voltage Lockout (UVLO) The under-voltage lockout turns the switch off if the input voltage drops below the lockout threshold. With the ON pin active, the input voltage rising above the UVLO threshold releases the lockout and enables the switch. Over-Voltage Lockout (OVLO) The OVLO pin sets the over-voltage lockout trip point with a resistor-divider network. OVLO adjustment is set by R1 and R2 and is compared to 1.2 V – VIN × R2 / (R1+R2) >1.2 V. when V IN > VOVLO the switch turn s off to ensure protection to devices connect ed to VOUT . A 1 MΩ or larger resistor is recommended on R1 to reduce standby power consumption. To use the default values of 5.8 V for VOVLO, connect the OVLO pin directly to GND. Reverse-Current Blocking (RCB) The reverse-current blocking feature protects the input source against current flow from output to input. When the load switch is OFF, no current flows from the output to input. Thermal Shutdown (TSD) Thermal shutdown protects the die from internally or externally generated excessive temperature. During an over-temperature condition, the switch is turned off. The switch automatically turns on again if the temperature of the die drops below the threshold temperature. Current Limit The current limit ensures that the current flow though the switch doesn’t exceed a maximum value, which can damage the device. If the current flow though the switch exceeds the trip point, the switch turn s off and enter s the blanking time. After the blanking time , the switch is re-enabled and checks if the fault still exists. Board Layout For best performance, all traces should be as short as possible. The input and output capacitors should be placed close to the device to minimize the effect that parasitic trace inductance may have on normal and short-circuit operation. Using wide traces f or VIN, VOUT, GND minimize s parasitic electrical effects along with minimizing the case-to-ambient thermal impedance. Package Specific Dimensions D E X Y

TOP VIEWRECOMMENDED LAND PATTERN(NSMD PAD TYPE) EDBABALL A1INDEX AREAA10.03C2X 0.03C2X 12ABC0.400.400.005CAB 0.40 ED F F 0.40(Ø0.20)Bottom of Cu Pad(Ø0.30)Solder MaskOpening F 0.586±0.039

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