FPF2200 FAIRCHILD | Alldatasheet
Document overview
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Technical content
Features
1.8 to 5.5V Input Voltage Range Typical RDS(ON) = 140m @ VIN = 5.5V Typical RDS(ON) = 160m @ VIN = 3.3V Fixed 500mA Current Limit (min) 5% Accurate Current Limit 72 (typ) Output Discharge Resistance ESD Protected, above 8kV HBM and 2kV CDM
Applications
The FPF2200-FPF2202 are low RDS(ON) P-Channel MOSFET load switches with high precision current limit value. The input voltage range operates from 1.8V to 5.5V to fulfill today's Ultra Portable Device's supply requirement. Switch control is by a logic input (ON) capable of interfacing directly with low voltage control signal. On-chip pull-down is available for output quick discharge when switch is turned off. For the FPF2201, if the constant current condition still persists after 30ms, these parts will shut off the switch and pull the fault signal pin (FLAGB) low. The FPF2200 has an auto-restart feature which will turn the switch on again after 450ms if the ON pin is still active. The FPF2201 do not have this auto-restart feature so the switch will remain off until the ON pin is cycled. For the FPF2202, a current limit condition will immediately pull the fault signal pin low and the part will remain in the constant- current mode until the switch current falls below the current limit. For the FPF2200 through FPF2202, the minimum current limit is 500mA with 5% accuracy.
Ordering Information
(mA) Current Limit Blanking Time (mS) Auto-Restart Time (mS) ON Pin Activity FPF2200 500 30 450 Active HI FPF2201 500 30 NA Active HI FPF2202 500 NA NA Active HI BOTTOM TOP Pin 1
2 www.fairchildsemi.com FPF2200-FPF2202 Rev. B FPF2200-FPF2202 Integrated Load Switch with 500mA High Precision Current Limit Typical Application Circuit Functional Block Diagram OFF ON ON VIN GND FPF2200/1/2 VOUT TO LOAD FLAGB UVLO THERMAL SHUTDOWN CURRENT LIMIT CONTROL LOGIC VIN ON FLAGB GND VOUT Output Discharge
3 www.fairchildsemi.com FPF2200-FPF2202 Rev. B FPF2200-FPF2202 Integrated Load Switch with 500mA High Precision Current Limit Pin Configuration Pin Description Absolute Maximum Ratings Recommended Operating Range
Electrical Characteristics
1 N/C No Connection
2 VIN Supply Input: Input to the power switch and the supply voltage for the IC
3 VOUT Switch Output: Output of the power switch
4 FLAGB Fault Output: Active LO, open drain output which indicates an over current, supply
under voltage or over temperature state
5 GND Ground
6 ON ON/OFF Control Input
Parameter Min. Max. Unit VIN, VOUT, ON, FLAGB TO GND -0.3 6 V Power Dissipation @ TA = 25°C 1.2 W Operating and Storage Junction Temperature -65 125 °C Thermal Resistance, Junction to Ambient 86 °C/W Electrostatic Discharge Protection HBM 8000 V MM 400 V CDM 2000 V Parameter Min. Max. Unit VIN 1.8 5.5 V Ambient Operating Temperature, TA -40 85 °C Parameter Symbol Conditions Min. Typ. Max. Units Basic Operation Operating Voltage VIN 1.8 5.5 V Quiescent Current IQ IOUT=0mA, VIN=VON=1.8V 40 65 AIOUT=0mA, VIN=VON=3.3V 45 75 IOUT=0mA, VIN=VON=5.5V 55 85 VIN Shutdown Current VON=0V, VIN=5.5V, VOUT=short to GND 2.5 A FLAGB GND N/C1 VIN VOUT ON MicroFET 2x2 6L (BOTTOMVIEW)
4 www.fairchildsemi.com FPF2200-FPF2202 Rev. B FPF2200-FPF2202 Integrated Load Switch with 500mA High Precision Current Limit VOUT Shutdown Current VON=0V, VOUT=5.5V, VIN=short to GND 1 A On-Resistance RON VIN=5.5V, IOUT=200mA, TA=25°C 140 185 m VIN=3.3V, IOUT=200mA, TA=25°C 160 210 VIN=1.8V, IOUT=200mA, TA=25°C 230 300 VIN=3.3V, IOUT=200mA, TA=-40°C to 85°C 90 265 Output Discharge Resistance VIN=3.3V, VON=0V, IOUT=10mA 72 105 ON Input Logic High Voltage (ON) VIH VIN=1.8V 0.8 V VIN=5.5V 1.4 ON Input Logic Low Voltage (OFF) VIL VIN=1.8V 0.5 V VIN=5.5V 1.0 On Input Leakage VON = VIN or GND -1 1 A FLAGB Output Logic Low Voltage VIN=5.5V, ISINK=100A 0.05 0.1 V VIN=1.8V, ISINK=100A 0.12 0.25 FLAGB Output High Leakage Current VIN=5.5V, Switch on 1 A Protections Current Limit ILIM VIN=3.3V, VOUT = 3.0V, TA=25°C 504 530 557 mA Thermal Shutdown Shutdown Threshold 140 °CReturn from Shutdown 130 Hysteresis 10 Under Voltage Shutdown UVLO VIN increasing 1.55 1.65 1.75 V Under Voltage Shutdown Hysteresis 50 mV Dynamic Turn On Time tON RL=500, CL=0.001uF 70 S Turn Off Time tOFF RL=500, CL=0.001uF 600 nS VOUT Rise Time tRISE RL=500, CL=0.001uF 40 S VOUT Fall Time tFALL RL=500, CL=0.001uF 100 nS Over Current Blanking Time tBLANK FPF2200, FPF2201 15 30 60 mS Auto-Restart Time tRSTRT FPF2200 225 450 900 mS Current Limit Response Time VIN = VON = 3.3V. Over-Current Condition: RLOAD=1.55 5 S Parameter Symbol Conditions Min. Typ. Max. Units
9 www.fairchildsemi.com FPF2200-FPF2202 Rev. B FPF2200-FPF2202 Integrated Load Switch with 500mA High Precision Current Limit Description of Operation The FPF2200, FPF2201, and FPF2202 are state of the art High Precision Current Limit switches designed to meet USB OTG (On-The-Go) applications with optimum current for a safe design practice. The core of each device is a 0.16 P-channel MOSFET and a controller capable of functioning over an input operating range of 1.8- 5.5V. The controller protects or offers current limiting, UVLO(undervoltage lockout) and thermal shutdown protection. The minimum current limit value is set to 500mA allowing to draw as much as 500mA from the USB port. On/Off Control The ON pin is active high, and controls the state of the switch. Applying a continuous high signal will hold the switch in the ON state. The switch will move into the OFF state when the active high is removed, or if a fault is encountered. For all versions, an undervoltage on VIN or a junction temperature in excess of 140°C overrides the ON control to turn off the switch. In addition, excessive currents will cause the switch to turn off in the FPF2200 and FPF2201. The FPF2200 has an Auto-Restart feature which will automatically turn the switch ON again after 450ms. For the FPF2201, the ON pin must be toggled to turn-on the switch again. The FPF2202 does not turn off in response to an over current condition but instead remains operating in a constant current mode so long as ON is active and the thermal shutdown or UVLO have not activated. Fault Reporting Upon the detection of an over-current condition, an input UVLO, or an over-temperature condition, the FLAGB signals the fault mode by activating LO. In the event of an over-current condition for the FPF2200 and FPF2201, the FLAGB goes LO at the end of the blanking time while FLAGB goes LO immediately for the FPF2202. If the over-current condition lasts longer than blanking time, FLAGB remains LO through the Auto-Restart Time for the FPF2200 while for the FPF2201, FLAGB is latched LO and ON must be toggled to release it. With the FPF2202, FLAGB is LO during the faults and immediately returns HI at the end of the fault condition. FLAGB is an open-drain MOSFET which requires a pull-up resistor between VIN and FLAGB. During shutdown, the pull-down on FLAGB is disabled to reduce current draw from the supply. A 100K pull up resistor is recommended to be used in the application. Current Limiting The current limit ensures that the current through the switch doesn't exceed a maximum value while not limiting at less than a minimum value. The minimum current at which the parts will limit is set to 500mA. The FPF2200 and FPF2201 have a blanking time of 30ms (nominal) during which the switch will act as a constant current source. At the end of the blanking time, the switch will be turned-off. The FPF2202 has no current limit blanking period so it will remain in a constant current state until the ON pin is deactivated or the thermal shutdown turns-off the switch. Undervoltage Lockout (UVLO) The undervoltage lockout turns-off the switch if the input voltage drops below the undervoltage lockout threshold. With the ON pin active the input voltage rising above the undervoltage lockout threshold will cause a controlled turn-on of the switch which limits current over-shoots. Output Discharge Resistor The FPF2200/1/2 family contains an 80 on-chip load resistor for quick output discharge when the switch is turned off. This features become more attractive when application requires large output capacitor to be discharged when switch turns-off. However, VOUT pin should not be connected directly to the battery source due to the discharge mechanism of the load switch. Thermal Shutdown The thermal shutdown protects the die from internally or externally generated excessive temperatures. During an over- temperature condition the FLAGB is activated and the switch is turned-off. The switch automatically turns-on again if temperature of the die drops below the threshold temperature.
10 www.fairchildsemi.com FPF2200-FPF2202 Rev. B FPF2200-FPF2202 Integrated Load Switch with 500mA High Precision Current Limit
Application Information
To limit the voltage drop on the input supply caused by transient in-rush currents when the switch is turned on into a discharged load capacitor or a short-circuit, a capacitor is recommended to be placed between VIN and GND. A 1uF ceramic capacitor, CIN, placed close to the pins is usually sufficient. Higher values of CIN can be used to further reduce the voltage drop. Output Capacitor A 0.1uF capacitor COUT, should be placed between VOUT and GND. This capacitor will prevent parasitic board inductances from forcing VOUT below GND when the switch turns-off. For the FPF2200 and FPF2201, the total output capacitance needs to be kept below a maximum value, COUT(max), to prevent the part from registering an over-current condition and turning-off the switch. The maximum output capacitance can be determined from the following formula: Power Dissipation During normal on-state operation, the power dissipated in the device will depend upon the level at which the current limit is set. The maximum allowed setting for the current limit is 500mA and will result in a power dissipation of: If the part goes into current limit, the maximum power dissipation will occur when the output is shorted to ground. For the FPF2200, the power dissipation will scale by the Auto- Restart Time, tRSTRT, and the Over Current Blanking Time, tBLANK, so that the maximum power dissipated is: Note this is below the maximum package power dissipation, and the thermal shutdown feature will act as additional safety to protect the part from damage due to excessive heating. The junction temperature is only able to increase to the thermal shutdown threshold. Once this temperature has been reached, toggling ON will not turn-on the switch until the junction temperature drops. For the FPF2202, a short on the output will cause the part to operate in a constant current state dissipating a worst case power of: This large amount of power will activate the thermal shutdown and the part will cycle in and out of thermal shutdown so long as the ON pin is active and the short is present. PCB Layout Recommendations For best performance, all traces should be as short as possible. To be more effective, the input and output capacitors should be placed close to the device to minimize the effects that parasitic trace inductances may have on normal and short-circuit operation. Using wide traces for VIN, VOUT and GND will help minimize parasitic electrical effects along with minimizing the case to ambient thermal impedance. Improving Thermal Performance An improper layout could result in higher junction temperature and triggering the thermal shutdown protection feature. This concern applies when the switch is set at higher current limit value and an over-current condition occurs. In this case, the power dissipation of the switch, from the formula below, could exceed the maximum absolute power dissipation of 1.2W. PD = (VIN - VOUT) x ILIM (Max) The following techniques have been identified to improve the thermal performance of this family of devices. These techniques are listed in order of the significance of their impact. 1. Thermal performance of the load switch can be improved by connecting pin7 of the DAP (Die Attach Pad) to the GND plane of the PCB. 2. Embedding two exposed through-hole vias into the DAP (pin7) provides a path for heat to transfer to the back GND plane of the PCB. A drill size of Round, 14 mils (0.35mm) with 1-ounce copper plating is recommended to result in appropriate solder reflow. A smaller size hole prevents the solder from penetrating into the via, resulting in device lift-up. Similarly, a larger via-hole consumes excessive solder, and may result in voiding of the DAP. Figure 21: Two through hole open vias embedded in DAP 3. The VIN, VOUT and GND pins will dissipate most of the heat generated during a high load current condition. The layout suggested in Figure 23 provides each pin with adequate copper so that heat may be transferred as efficiently as possible out of the device. The low-power FLAGB and ON pin traces may be laid-out diagonally from the device to maximize the area available to the ground pad. Placing the input and output capacitors as close to the device as possible also contributes to heat dissipation, particularly during high load currents. COUT (Max) = ILIM (Max) X tBLANK (Min) VIN P = (ILIM)2 * RON = (0.5)2 * 0.16 = 40mW P (Max) = tBLANK tBLANK + tRSTRT * VIN (Max) * ILIM (Max) P (Max) = VIN (MAX) * ILIM (MAX) = 5.5 * 0.557 = 3.064W
12 www.fairchildsemi.com FPF2200-FPF2202 Rev. B FPF2200-FPF2202 Integrated Load Switch with 500mA High Precision Current Limit Dimensional Outline and Pad Layout
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