FPF2006 FAIRCHILD | Alldatasheet
Document overview
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Technical content
Features
1.8 to 5.5V Input Voltage Range Controlled Turn-On 50mA and 100mA Current Limit Options Under voltage Lockout Thermal Shutdown <1uA Shutdown Current Auto Restart Fast Current limit Response Time
- 3us to Moderate Over Currents
- 20ns to Hard Shorts Fault Blanking
Applications
The FPF2000 through FPF2007 is a family of load switches which provide full protection to systems and loads which may encounter large current conditions. These devices contain a 0.7 Ω current-lim- ited P-channel MOSFET which can operate over an input voltage range of 1.8-5.5V. Switch control is by a logic input (ON) capable of interfacing directly with low voltage control signals. Each part con- tains thermal shutdown protection which shuts off the switch to pre- vent damage to the part when a continuous over-current condition causes excessive heating. When the switch current reaches the current limit, the part oper- ates in a constant-current mode to prohibit excessive currents from causing damage. For the FPF2000-FPF2002 and FPF2004- FPF2006, if the constant current condition still persists after 10ms, these parts will shut off the switch and pull the fault signal pin (FLAGB) low. The FPF2000, FPF2001, FPF2004 and FPF2005, have an auto-restart feature which will turn the switch on again after 80ms if the ON pin is still active. The FPF2002 and FPF2006 do not have this auto-restart feature so the switch will remain off until the ON pin is cycled. For the FPF2003 and FPF2007, a cur- rent limit condition will immediately pull the fault signal pin low and the part will remain in the constant-current mode until the switch current falls below the current limit. For the FPF2000 through FPF2003, the minimum current limit is 50mA while that for the FPF2004 through FPF2007 is 100mA. These parts are available in a space-saving 5 pin SC-70 package. Functional Block Diagram VIN VOUT FLAGB GND UVLO CONTROL LOGIC THERMAL SHUTDOWN CURRENT LIMIT ON
www.fairchildsemi.com FPF2000-FPF2007 Rev. C1 FPF2000-FPF2007 IntelliMAX™ Advanced Load Management Products Pin Configuration Pin Description Absolute Maximum Ratings Recommended Operating Range Pin Name Function OUT Switch Output: Output of the power switch
2 GND Ground
3 FLAGB Fault Output: Active LO, open drain output which indicates an over current, supply under voltage or over temperature state. 4O N On Control Input IN Supply Input: Input to the power switch and the supply voltage for the IC Parameter Min. Max. Units V IN -0.3 6 V DC Input Voltage -0.7 6 V Power Dissipation for Single Operation @ 85°C 250 mW Operating Junction Temperature -40 85 °C Storage Temperature -65 150 °C Thermal Resistance, Junction to Ambient 400 °C/W Electrostatic Discharge Protection HBM 4000 V MM 400 V Parameter Min. Max. Units V IN 1.8 5.5 V Ambient Operating Temperature, T A -40 85 °C VINVOUT 1 ON SC70-5 GND FLAGB
www.fairchildsemi.com FPF2000-FPF2007 Rev. C1 FPF2000-FPF2007 IntelliMAX™ Advanced Load Management Products
Electrical Characteristics
V IN = 1.8 to 5.5V, T A = -40 to +85°C unless otherwise noted. Typical values are at V IN = 3.3V and T A = 25°C. Parameter Symbol Conditions Min. Typ. Max. Units Basic Operation Operating Voltage V IN 1.8 5.5 V Quiescent Current I Q I OUT = 0mA V IN = 1.8 to 3.3V 60 µA V IN = 3.3 to 5.5V 100 Latch-Off Current I LATCH FPF2002, FPF2006 40 µA Shutdown Current I SHDN 1µ A On-Resistance R ON T A = 25°C, I OUT = 20mA 0.7 1 Ω T A = -40 to +85°C, I OUT = 20mA 0.85 ON Input Logic High Voltage V IH V IN = 1.8V 0.5 0.66 V V IN = 5.5V 0.9 1.22 ON Input Logic Low Voltage V IL V IN = 1.8V 0.64 0.8 V V IN = 5.5V 1.17 1.5 ON Input Leakage V ON = V IN or GND 1 µA Off Switch Leakage I SWOFF V ON = 0V, V OUT = 0V 1 µA FLAGB Output Logic Low Voltage V IN = 5V, I SINK = 10mA 0.1 0.2 V V IN = 1.8V, I SINK = 10mA 0.1 0.3 FLAGB Output High Leakage Current V IN = 5V, Switch on 1 µA Protections Current Limit I LIM V IN = 3.3V, V OUT = 0V FPF2000, FPF2001, FPF2002, FPF2003 50 75 100 mA V IN = 3.3V, V OUT = 0V FPF2004, FPF2005, FPF2006, FPF2007 100 150 200 Thermal Shutdown T J Increasing 140 °C T J Decreasing 130 °C Under Voltage Shutdown UVLO V IN Increasing 1.5 1.6 1.7 V Under Voltage Shutdown Hysteresis 50 mV Dynamic Turn on time t ON Ω , CL=0.1µF 50 µs Turn off time t OFF Ω , CL=0.1µF 0.5 µs Rise Time t RISE Ω , CL=0.1µF 10 µs Fall Time t FALL Ω , CL=0.1µF 0.1 µs OVER Current Blanking Time t BLANK FPF2000, FPF2001, FPF2002, FPF2004, FPF2005, FPF2006 51 0 2 0 m s Auto-Restart Time t RESTART FPF2000, FPF2001, FPF2004, FPF2005 40 80 160 ms Short Circuit Response Time Vin = Von = 3.3V. Moderate Over-current condition. 3µ s Vin = Von = 3.3V. Hard Shorts. 20 nS
www.fairchildsemi.com FPF2000-FPF2007 Rev. C1 FPF2000-FPF2007 IntelliMAX™ Advanced Load Management Products
Application Information
To limit the voltage drop on the input supply caused by transient in-rush currents when the switch turns-on into a discharged load capacitor or a short-circuit, a capacitor needs to be placed between V IN and GND. A 0.1µF ceramic capacitor, C IN , placed close to the pins is usually sufficient. Higher values of C IN can be used to further reduce the voltage drop. Output Capacitor A 0.1µF capacitor COUT, should be placed between V OUT and GND. This capacitor will prevent parasitic board inductances from forcing V OUT below GND when the switch turns-off. For the FPF2000-FPF2002 and the FPF2004-FPF2006, the total output capacitance needs to be kept below a maximum value, COUT(max), to prevent the part from registering an over-current condition and turning-off the switch. The maximum output capacitance can be determined from the following formula, Due to the integral body diode in the PMOS switch, a C IN greater than C OUT is highly recommended. A C OUT greater than C IN can cause V OUT to exceed V IN when the system supply is removed. This could result in current flow through the body diode from V OUT to V IN Power Dissipation During normal operation as a switch, the power dissipation is small and has little effect on the operating temperature of the part. The parts with the higher current limits will dissipate the most power and that will only be, If the part goes into current limit the maximum power dissipation will occur when the output is shorted to ground. For the FPF2000, FPF2001, FPF2004 and FPF2005, the power dissi- pation will scale by the Auto-Restart Time, t RESTART , and the Over Current Blanking Time, t BLANK , so that the maximum power dissipated is, When using the FPF2002 and FPF2006 attention must be given to the manual resetting of the part. Continuously resetting the part at a high duty cycle when a short on the output is present can cause the temperature of the part to increase. The junction temperature will only be allowed to increase to the thermal shut- down threshold. Once this temperature has been reached, tog- gling ON will not turn-on the switch until the junction temperature drops. For the FPF2003 and FPF2007, a short on the output will cause the part to operate in a constant current state dissipating a worst case power as calculated in (3) until the thermal shutdown activates. It will then cycle in and out of thermal shutdown so long as the ON pin is active and the short is present. Board Layout For best performance, all traces should be as short as possible. To be most effective, the input and output capacitors should be placed close to the device to minimize the effects that parasitic trace inductances may have on normal and short-circuit opera- tion. Using wide traces for V IN , V OUT and GND will help mini- mize parasitic electrical effects along with minimizing the case to ambient thermal impedance. VOUT To Load ON GND FPF2000-FPF2007 FLAGBOFF ON COUT ILIM max() tBLANK min()× VIN P max() tBLANK
9 www.fairchildsemi.com FPF2000-FPF2007 Rev. C1 FPF2000-FPF2007 IntelliMAX™ Advanced Load Management Products Dimensional Outline and Pad Layout SC70-5
Ordering Information
[mA] Current Limit Blanking Time [ms] Auto-Restart Time [ms] ON Pin Activity Top Mark FPF2000 50 10 80 Active HI 200 FPF2001 50 10 80 Active LO 201 FPF2002 50 10 NA Active HI 202 FPF2003 50 0 NA Active HI 203 FPF2004 100 10 80 Active HI 204 FPF2005 100 10 80 Active LO 205 FPF2006 100 10 NA Active HI 206 FPF2007 100 0 NA Active HI 207 2.00±0.20 1.25±0.10 (0.25) 1.9 0.65 SYMM CL .5 min 0.4 min 1.30 2.10±0.10 (0.43) LAND PATTERN RECOMMENDATION SEE DETAIL A 0.10 0.00 0.45 0.30 0.30 0.15 R0.10 0.20 GAGE PLANE DETAIL A NOTES: A. THIS PACKAGE CONFORMS TO EIAJ SC-88A, 1996. B. DIMENSIONS ARE IN MILLIMETERS. C. DIMENSIONS DO NOT INCLUDE BURRS OR MOLD FLASH. 0°-30° 1.10 0.80 0.25 0.10 1.00 0.80
0.10 A B
0.10 C M 0.65 1.30 Seating Plane 5 4 B A C
10 www.fairchildsemi.com FPF2000-FPF2007 Rev. C1 FPF2000-FPF2007 IntelliMAX™ Advanced Load Management Products DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY , FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Preliminary No Identification Needed Obsolete This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Formative or In Design First Production Full Production Not In Production IntelliMAX™ ISOPLANAR™ LittleFET™ MICROCOUPLER™ MicroFET™ MicroPak™ MICROWIRE™ MSX™ MSXPro™ OCX™ OCXPro™ OPTOLOGIC OPTOPLANAR™ PACMAN™ FAST FASTr™ FPS™ FRFET™ GlobalOptoisolator™ GTO™ HiSeC™ I 2C™ i-Lo™ ImpliedDisconnect™ Rev. I15 ACEx™ ActiveArray™ Bottomless™ CoolFET™ CROSSVOLT™ DOME™ EcoSPARK™ E 2CMOS™ EnSigna™ FACT™ FACT Quiet Series™ POP™ Power247™ PowerEdge™ PowerSaver™ PowerTrench QFET QS™ QT Optoelectronics™ Quiet Series™ RapidConfigure™ RapidConnect™ µSerDes™ SILENT SWITCHER SMART START™ SPM™ Stealth™ SuperFET™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SyncFET™ TinyLogic TINYOPTO™ TruTranslation™ UHC™ UltraFET UniFET™ VCX™ Across the board. Around the world.™ The Power Franchise Programmable Active Droop™