FPF1504 ONSEMI | Alldatasheet
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© 2012 Fairchild Semiconductor Corporation www.fairchildsemi.com FPF1504 / FPF1504L • Rev. 1.11 FPF1504 / FPF1504L — Advanced Load Management Switch FPF1504 / FPF1504L Advanced Load Management Switch
Features
1.0 V to 3.6 V Input Voltage Operating Range Typical RDS(ON): - 15 mΩ at VIN=3.3 V - 20 mΩ at VIN=1.8 V - 40 mΩ at VIN=1.0 V Slew Rate Control Output Discharge Function Low <1 µA Quiescent Current at VON=VIN ESD Protected: 4000 V HBM, 2000 V CDM GPIO/CMOS-Compatible Enable Circuitry Active HIGH and active LOW versions
Applications
Mobile Devices and Smart Phones Portable Media Devices Digital Cameras Advanced Notebook, UMPC, and MID Portable Medical Devices GPS and Navigation Equipment
Description
The FPF1504/FPF1504L are low-RDS P-channel MOSFET load switch es of the IntelliMAX™ family. Integrated s lew-rate control prevents excessive inrush current from the supply rails with capacitive loads common in power applications. In addition, the FPF1504/FPF1504L feature output discharge capability. The input voltage range operates from 1 .0 V to 3.6 V to fulfill today's mobile device supply requirements. Switch control is by a logic input (ON pin) capable of interfaci ng directly with low-voltage CMOS control signals and GPIOs in embedded processors. Figure 1. Block Diagram
Ordering Information
(Typical) At 1.8 VIN Input Buffer Output Discharge ON Pin Activity Package FPF1504UCX G4 20 mΩ CMOS YES Active HIGH 4-Ball, WLCSP, 0.5 mm Pitch FPF1504BUCX G4 20 mΩ CMOS YES Active HIGH 4-Ball, WLCSP with Backside Laminate, 0.5 mm Pitch FPF1504LUCX GZ 20 mΩ CMOS YES Active LOW 4-Ball, WLCSP, 0.5 mm Pitch FPF1504LBUCX GZ 20 mΩ CMOS YES Active LOW 4-Ball, WLCSP with Backside Laminate, 0.5 mm Pitch
© 2012 Fairchild Semiconductor Corporation www.fairchildsemi.com FPF1504 / FPF1504L • Rev. 1.11 3 FPF1504 / FPF1504L — Advanced Load Management Switch Absolute Maximum Ratings Stresses exceeding the absolute maximum ratings may dama ge the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol Parameter Min. Max. Unit VIN VIN, VOUT, VON to GND -0.3 4.0 V ISW Maximum Continuous Switch Current 1.5 A PD Power Dissipation at TA=25°C 1.0 W TSTG Storage Junction Temperature -65 +150 °C TA Operating Temperature Range -40 +85 °C JA Thermal Resistance, Junction-to-Ambient 1S2P with 1 Thermal Via 95 °C/W 1S2P without Thermal Via 187 ESD Electrostatic Discharge Capability Human Body Model, JESD22-A114 kV Charged Device Model, JESD22-C101 Recommended Operating Conditions The Recommended Operating Conditions table defines the condi tions for actual device operation. Recommended operating conditions are specified to ensure optimal perfo rmance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to Absolute Maximum Ratings. Symbol Parameter Min. Max. Unit VIN Supply Voltage 1.0 3.6 V TA Ambient Operating Temperature -40 +85 °C
© 2012 Fairchild Semiconductor Corporation www.fairchildsemi.com FPF1504 / FPF1504L • Rev. 1.11 4 FPF1504 / FPF1504L — Advanced Load Management Switch
Electrical Characteristics
Unless otherwise noted, VIN=1.0 to 3.6 V, TA=-40 to +85°C; typical values are at VIN=3.3 V and TA=25°C. Symbol Parameter Conditions Min. Typ. Max. Units Basic Operation VIN Supply Voltage 1.0 3.6 V IQ(OFF) Off Supply Current FPF1504 VON=GND, VOUT=Open 0.25 μA FPF1504L VON= VIN, VOUT=Open 0.3 ISD(OFF) Off Switch Current FPF1504 VON=GND, VOUT=GND 0.25 FPF1504L VON= VIN, VOUT=GND 0.3 IQ Quiescent Current FPF1504 IOUT=0 mA, VIN=3.6 V, VON=VIN 0.08 IOUT=0 mA, VON=VIH(MIN) 0.75 FPF1504L IOUT=0 mA, VIN=3.6 V, VON=GND 0.08 IOUT=0 mA, VON=VIL(MAX) 0.95 RON On Resistance VIN=3.3 V, IOUT=200 mA, TA=25°C 15 30 mΩ VIN=1.8 V, IOUT=200 mA, TA=25°C 20 40 VIN=1.5 V, IOUT=200 mA, TA=25°C 30 VIN=1.0 V, IOUT=200 mA, TA=25°C 40 80 VIN=1.8 V, IOUT=200 mA, TA=85°C(3) 35 50 RPD Output Discharge Pull-Down Resistance VON=0 V or VIN, IOUT=-20 mA 65 95 Ω VIH On Input Logic High Voltage FPF1504 0.8 V VIL On Input Logic Low Voltage FPF1504 0.3 ION On Input Leakage VON=VIN or GND 1 μA Dynamic Characteristics tDON Turn-On Delay(4) FPF1504 RL=10 Ω, CL=0.1 µF, VIN=3.3 V, TA=25°C μs tR VOUT Rise Time(4) FPF1504 130 tON Turn-On Time(4) FPF1504 210 tDON Turn-On Delay(4) FPF1504 RL=500 Ω, CL=0.1 µF, VIN=3.3 V, TA=25°C 70 100 μs FPF1504L 95 tR VOUT Rise Time(4) FPF1504 110 150 FPF1504L 115 tON Turn-On Time(4) FPF1504 180 250 FPF1504L 210 Continued on the following page…
Unless otherwise noted, VIN=1.0 to 3.6 V, TA=-40 to +85°C; typical values are at VIN=3.3 V and TA=25°C.
- This parameter is guaranteed by design and characterization; n ot production tested.
- t DON/tDOFF/tR/tF are defined in Figure 7.
- Output discharge path is enabled during off.
Figure 7. Timing Diagram for FPF1504
© 2012 Fairchild Semiconductor Corporation www.fairchildsemi.com FPF1504 / FPF1504L • Rev. 1.11 8 FPF1504 / FPF1504L — Advanced Load Management Switch
Application Information
IntelliMAX™ switches don’t require an input capacitor. To reduce device inrush current, a 0.1 µF ceramic capacitor, CIN, is recommended close to the VIN pin. A higher value of C IN can be used to further reduce the voltage drop experienced as the switch is turned on into a large capacitive load. Output Capacitor IntelliMAX™ switches work without an output capacitor. If the applications parasitic board inductance forces VOUT below GND when switching off, a 0.1 µF capacitor, COUT, should be placed between VOUT and GND. Fall Time Device output fall time can be calculated based on RC constant of external components as follows: 2 . 2CRt LLF (1) where tF is 90% to 10% fall time, RL is output, load and CL is output capacitor. The same equation works for a device with a pull-down output resistor, then R L is replaced by a paralle l connected pull-down and external output resistor combination, as follows: 2 . 2CRR RRt L PDL PDL F (2) where tF is 90% to 10% fall time, RL is output load, RPDis output pull-down resistor (65 typical, and CL is the output capacitor. Recommended Land Pattern and Layout For best thermal performance and minimal inductance and parasitic effects, it is recommended to keep input and output traces short and the capacitors as close to the device as possible. Below is a recommended layout for this device to achieve optimum performance. Figure 24. Recommended Land Pattern and Layout
© 2012 Fairchild Semiconductor Corporation www.fairchildsemi.com FPF1504 / FPF1504L • Rev. 1.11 9 FPF1504 / FPF1504L — Advanced Load Management Switch The following information applies to the WLCSP package dimensions on the next page: Product-Specific Dimensions Product D E X Y FPF1504UCX 960 µm ±30 µm 960 µm ±30 µm 0.230 mm 0.230 mm FPF1504BUCX FPF1504LUCX FPF1504LBUCX
TOP VIEW RECOMMENDED LAND PATTERN (NSMD PAD TYPE) NOTES: A. NO JEDEC REGISTRATION APPLIES. B. DIMENSIONS ARE IN MILLIMETERS. C. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 2009. D. DATUM C IS DEFINED BY THE SPHERICAL CROWNS OF THE BALLS. E. PACKAGE NOMINAL HEIGHT IS 582 MICRONS 0,&5216 0,&5216 F. FOR DIMENSIONS D, E, X, AND Y SEE PRODUCT DATASHEET. G. DRAWING FILENAME: MKT-UC004ABrev3. PIN A1 AREA 0.03 C E D A B 0.03 C 0.05 C 0.625 0.539 C SEATING PLANE D F F 0.06 C 1 2 A B
0.005 C A B
0.50 0.50 Bottom Cu Pad Solder Mask 0.50 0.50
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