FPF1203 ONSEMI | Alldatasheet
Document overview
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Technical content
Features
1.2 V to 5.5 V Input Voltage Operating Range Typical RON: 45 mΩ at VIN=5.5 V 55 mΩ at VIN=3.3 V 90 mΩ at VIN=1.8 V 185 mΩ at V IN=1.2 V Slew Rate Control w ith tR: FPF1203/FPF1203l/FPF1204: 100 µs FPF12045: 2 µs Output Discharge Function on FPF1204 / 45 Low <1.5 µA Quiescent Current ESD Protected: Above 7 kV HBM, 2 kV CDM GPIO / CMOS-Compatible Enable Circuitry 4-Bump, WLCSP 0.76 mm x 0.76 mm, 0.4 mm Pitch
Description
The FPF1203 / 03L / 04 / 45 are ultra-s mall integrated IntelliMA X™ load sw itch es w ith integrated P-channel sw itch and analog control features. Integrated s lew - rate control prevents inrush current and the resulting excessive voltage drop on the pow er rail. The input voltage range operates from 1.2 V to 5.5 V to provide pow er-disconnect capability for post-regulated pow er rails in portable and cons umer products. The low shut- off current allow s pow er designs to meet standby and off- pow er drain specifications. The FPF120x are c ontrolled by a logic input (ON pin) compatible w ith standard CMOS GPIO circuitry found on Field Programmable Gate Array (FPGA) embedded processors. The FPF120x are available in 0.76 mm x 0.76 mm 4-bump WLCSP.
Applications
Mobile Devices and Smart Phones Portable Media Devices Tablet PCs Advanced Notebook, UMPC, MID Portable Medical Devices GPS and Navigation Equipment
Ordering Information
(Typical) at 3.3VIN Output Discharge ON Pin Activity tR Package FPF1203UCX QL 55 mΩ NA Active HIGH 100 µs 4-Bump, Wafer -Level Chip- Scale Package (WLCSP), 0.76 mm x 0.76 mm, 0.4 mm Pitch FPF1203LUCX QP 55 mΩ NA Active LOW 100 µs FPF1204UCX QM 55 mΩ 65 Ω Active HIGH 100 µs FPF1204UCX-F013 (Amkor Assembly Only) QM 55 mΩ 65 Ω Active HIGH 100 µs FPF1204BUCX (Backside Laminate) QM 55 mΩ 65 Ω Active HIGH 100 µs FPF12045UCX NC 55 mΩ 65 Ω Active HIGH 2 µs
www.onsemi.com FPF1203 / FPF1203L / FPF1204 / FPF12045 — IntelliMAX™ Ultra-Small, Slew-Rate-Controlled Load Switch Absolute Maximum Ratings Stresses exceeding the absolute maxim um ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating c onditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol Parameter Min. Max. Unit VIN VIN, VOUT, VON to GND -0.3 6.0 V ISW Maximum Continuous Sw itch Current at Ambient Operating Temperature 2.2 A PD Pow er Dissipation at T A=25°C 1.0 W TSTG Storage Temperature Range -65 +150 °C JA Thermal Resistance, Junction-to-Ambient 1S2P w ith One Thermal Via (1) 110 °C/W 1S2P w ithout Thermal Via(2) 95 ESD Electrostatic Discharge Capability(1,2) Human Body Model, JESD22-A114 7 kV Charged Device Model, JESD22-C101 2 Notes: 1. Measured using 2S2P JEDEC std. PCB. 2. Measured using 2S2P JEDEC PCB COLD PLATE Method . Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet spec ifications. ON Semiconductor does not recommend exceeding them or designing to Absolute Maximum Ratings. Symbol Parameter Min. Max. Unit VIN Input Voltage 1.2 5.5 V TA Ambient Operating Temperature -40 +85 °C
www.onsemi.com FPF1203 / FPF1203L / FPF1204 / FPF12045 — IntelliMAX™ Ultra-Small, Slew-Rate-Controlled Load Switch
Electrical Characteristics
Symbol Parameter Condition Min. Typ. Max. Unit Basic Operation VIN Supply Voltage 1.2 5.5 V IQ(OFF) Off Supply Current FPF1203/04/45 VON=GND, V OUT=Open, VIN=5.5 V 0.1 1.0 μA FPF1203L VON=VIN, VOUT=Open, VIN=5.5 V 1.0 2.0 ISD Shutdow n Current FPF1203/04/45 VON=GND, VOUT=GND 0.1 1.0 μA FPF1203L VON=VIN, VOUT=GND 1.2 3.0 IQ Quiescent Current FPF1203/04/45 IOUT=0 mA, VON=VIN, =5.5 V 0.1 1.5 μA FPF1203L IOUT=0 mA, VON=GND, VIN, = 5.5 V RON On Resistance VIN=5.5 V, IOUT=200 mA, TA=25°C 45 55(3) mΩ VIN=3.3 V, IOUT=200 mA, TA=25°C 55 65(3) VIN=1.8 V, IOUT=200 mA, TA=25°C 90 100(3) VIN=1.2 V, IOUT=200 mA, TA=25°C 185 220(3) VIN=1.8 V, IOUT=200 mA, TA=85°C(3) 105 RPD Output Discharge R PULL DOWN VIN=3.3 V, VON=OFF, IFORCE=20 mA, TA=25°C, FPF1204 / FPF12045 65 75 Ω VIH On Input Logic HIGH Voltage VIN=1.2 V to 5.5 V 1.15 V VIL On Input Logic LOW Voltage VIN=1.2 V to 5.5 V 0.65 V RON_PD Pull-Dow n Resistance at ON Pin VIN=1.2 V to 5.5 V 8.3 MΩ ION On Input Leakage VON=VIN or GND 1 μA Dynamic Characteris tics tDON Turn-On Delay(4) VIN=3.3 V, RL=10 Ω, CL=0.1 µF, TA=25°C, FPF12045 μs tR VOUT Rise Time(4) 100 tON Turn-On Time(6) 170 tDON Turn-On Delay(4) 2 tR VOUT Rise Time(4) 2 tON Turn-On Time(6) 4 tDOFF Turn-Off Delay(4,5) VIN=3.3 V, RL=10 Ω, CL=0.1 µF, TA=25°C, FPF1203L 0.5 μs tF VOUT Fall Time(4,5) 2.0 tOFF Turn-Off Time(5,7) 2.5 tDOFF Turn-Off Delay(4,5) VIN=3.3 V, RL=500 Ω, CL=0.1 µF, TA=25°C, FPF1203L μs tF VOUT Fall Time(4,5) 115 tOFF Turn-Off Time(5,7) 121 tDOFF Turn-Off Delay(4,5) VIN=3.3 V, RL=10 Ω, CL=0.1 µF, TA=25°C, FPF1203 4.0 μs tF VOUT Fall Time(4,5) 2.9 tOFF Turn-Off Time(5,7) 7.3 tDOFF Turn-Off Delay(4,5) VIN=3.3 V, RL=500 Ω, CL=0.1 µF, TA=25°C, FPF1203 μs tF VOUT Fall Time(4,5) 115 tOFF Turn-Off Time(5,7) 121 Continued on the following page…
www.onsemi.com FPF1203 / FPF1203L / FPF1204 / FPF12045 — IntelliMAX™ Ultra-Small, Slew-Rate-Controlled Load Switch Symbol Parameter Condition Min. Typ. Max. Unit tDOFF Turn-Off Delay(4,5) VIN=3.3 V, RL=10 Ω, CL=0.1 µF, TA=25°C, FPF1204/45(5) 4.0 μs tF VOUT Fall Time(4,5) 2.5 tOFF Turn-Off Time(5,7) 6.5 tDOFF Turn-Off Delay(4,5) VIN=3.3 V, RL=500Ω, C L=0.1 µF, TA=25°C, FPF1204/45(5) μs tF VOUT Fall Time(4,5) 11 tOFF Turn-Off Time(5,7) 17 Notes: 3. This parameter is guaranteed by design and characterization; not production tested. 4. tDON/tDOFF/tR/tF are defined in Figure 23. 5. Output discharge enabled during off -state. 6. tON=tR + tDON. 7. tOFF=tF + tDOFF.
Figure 24. 4-Bump, 0.76 x 0.76 mm , Wafer -Level Chip -Scale Packaging
0.005 C A B
0.05 C E
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