DATASHEET SEARCH SITE | WWW.ALLDATASHEET.COM

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 3

Technical content

Features

 1.2 V to 5.5 V Input Voltage Operating Range  Typical RON: − 20 m Ω at VIN=5.5 V − 21 m Ω at VIN=4.5 V − 37 m Ω at VIN=1.8 V − 75 m Ω at VIN=1.2 V  Slew Rate / Inrush Control with tR: 2.7 ms (Typical)  3 A Maximum Continuous Current Capability  Output Capacitor Discharge Function  Low <1 µA Shutdown Current  ESD Protected: Above 8 kV HBM, 1.5 kV CDM  GPIO / CMOS-Compatible Enable Circuitry

Applications

 HDD, Storage, and Solid-State Memory Devices  Portable Media Devices, UMPC, Tablets, MIDs  Wireless LAN Cards and Modules  SLR Digital Cameras  Portable Medical Devices  GPS and Navigation Equipment  Industrial Handheld and Enterprise Equipment

Description

The FPF1039 advanced load-management switch target applications requiring a highly integrated solution for disconnecting loads powered from DC power rail (<6 V) with stringent shutdown current targets and high load capacitances (up to 200 µF). The FPF1039 consists of slew-rate controlled low-impedance MOSFET switch (21 mΩ typical) and other int egrated analog features. The slew-rate controlled turn-on characteristic prevents inrush current and the resulting excessive voltage droop on power rails. This device has exceptionally low shutdown current drain (<1 µA maximum) that facilitates compliance in low standby power applications. The input voltage range operates from 1.2 V to 5.5 V DC to support a wide range of applications in consumer , optical, medical, storage, portable, and industrial device power management. Switch control is managed by a logic input (active HIGH) capable of interfacing direct ly with low-voltage control signal / GPIO with no external pull-up required. The device is packaged in advanced fully “green” 1mm x1.5 mm Wafer-Level Chip-S cale Packaging (WLCSP); providing excellent thermal conductivity, small footprint, and low electrical resistance for wider application usage.

Ordering Information

(Typical) at 4.5 VIN Input Buffer Output Discharge ON Pin Activity tR Package FPF1039UCX QF 21m Ω CMOS 65 Ω Active HIGH 2.7 ms 6-Bump, WLCSP, 1.0 mm x 1.5 mm, 0.5 mm Pitch

Figure 35. 6 Ball, 1.0 x 1.5mm Wafer- Level Chip-Scale Packaging (WLCSP) warranty therein, which covers Fairchild products.

0.05 C E

A. NO JEDEC REGISTRATION APPLIES. B. DIMENSIONS ARE IN MILLIMETERS. ±43 MICRONS (539-625 MICRONS). G. DRAWING FILNAME: MKT-UC006AFrev2.

0.005 CAB

© 2010 Fairchild Semiconductor Corporation www.fairchildsemi.com FPF1039 • Rev. 1.0.5 13 FPF1039 — Advance Load Management Switch Management Switch Advance Load Management Switch