FPF1003 FAIRCHILD | Alldatasheet
Document overview
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Technical content
Features
1.2 to 5.5V Input Voltage Range RDS(ON) = 30 mΩ @ VIN = 5.5V RDS(ON) = 35 mΩ @ VIN = 3.3V ESD Protected, above 2000V HBM
Applications
PDAs Cell Phones GPS Devices MP3 Players Digital Cameras Peripheral Ports Hot Swap Supplies General Description The FPF1003 is a low RDS P-Channel MOSFET load switch with controlled turn-on. The input voltage range operates from 1.2V to 5.5V to fulfill today' s Ultra Portable Device's supply requirement. Switch control is by a logic input (ON) capable of interfacing directly with low voltage control signal. FPF1003 is available in a space-saving 1.0x1.5 mm2 chip scale package, 1.0X1.5CSP-6. Typical Application Circuit
Ordering Information
Part Switch Input buffer Output Discharge ON Pin Activity Top Mark FPF1003 30 mΩ, PMOS Schmitt NA Active HI 3 OFF ON ON VIN GND FPF1003 VOUT TO LOAD BOTTOM TOP VOUT VOUT GND VIN VIN ON VOUT VOUT GND VIN VIN ON Pin 1
2 www.fairchildsemi.com FPF1003 Rev. G FPF1003 IntelliMAX™ Advanced Load Management Products Functional Block Diagram Pin Configuration Pin Description Pin Name Function A2, B2 V IN Supply Input: Input to the power switch and the supply voltage for the IC C2 ON ON Control Input A1, B1 V OUT Switch Output: Output of the power switch C1 GND Ground CONTROL LOGIC VIN ON VOUT GND Turn-On Slew Controlled Driver 1.0 x 1.5 CSP Bottom View A1A2 B1B2 C1C2
3 www.fairchildsemi.com FPF1003 Rev. G FPF1003 IntelliMAX™ Advanced Load Management Products Absolute Maximum Ratings Recommended Operating Range
Electrical Characteristics
Parameter Min. Max. Unit VIN, VOUT, to GND -0.3 6 V Power Dissipation @ TA = 25°C 1.2 W Maximum Continuous Switch Current 2.0 A Operating Temperature Range -40 125 °C Storage Temperature -65 150 °C Thermal Resistance, Junction to Ambient 85 °C/W Electrostatic Discharge Protection HBM 2000 V MM 200 V Parameter Min. Max. Unit VIN 1.2 5.5 V Ambient Operating Temperature, TA -40 85 °C Parameter Symbol Conditions Min. Typ. Max Units Basic Operation Operating Voltage V IN 1.2 5.5 V Quiescent Current I Q IOUT = 0mA, VIN = Von 1 µA Off Supply Current I Q(off) Von = GND, OUT = open 1 µA Off Switch Current I SD(off) Von = GND, VOUT= 0 1 µA On-Resistance R ON VIN = 5.5V, TA = 25°C 20 30 mΩ VIN = 3.3V, TA = 25°C 25 35 VIN = 1.5V, TA = 25°C 50 75 VIN = 1.2V, TA = 25°C 95 150 ON Input Logic High Voltage V IH VIN = 2.7V to 5.5V 2 V VIN = 1.2V 0.8 ON Input Logic Low Voltage V IL VIN = 2.7V to 5.5V 0.8 V VIN = 1.2V 0.35 ON Input Leakage V ON = VIN or GND 1 µA Dynamic Turn on delay tON VIN = 3.3V, RL=500Ω, CL=0.1uF, TA = 25°C 13 µs Turn off delay tOFF VIN = 3.3V, RL=500Ω, CL=0.1uF, TA = 25°C 45 µs VOUT Rise Time tR VIN = 3.3V, RL=500Ω, CL=0.1uF, TA = 25°C 13 µs VOUT Fall Time tF VIN = 3.3V, RL=500Ω, CL=0.1uF, TA = 25°C 113 µs
Figure 13. TON Response Figure 14. TOFF Response
7 www.fairchildsemi.com FPF1003 Rev. G FPF1003 IntelliMAX™ Advanced Load Management Products Description of Operation The FPF1003 is a low R DS(ON) P-Channel load switch with controlled turn-on. The core of each device is a 30m Ω P-Channel MOSFET and a controller capable of functioning over a wide input operating range of 1.2-5.5V. Switch control is by a logic input (ON) capable of interfacing directly with low voltage control signal.
Application Information
To limit the voltage drop on the input supply caused by transient in-rush currents when the switch turns-on into a discharged load capacitor or short-circuit, a capacitor needs to be placed between V IN and GND. A 1 µF ceramic capacitor, C IN, placed close to the pins is usually sufficient. Higher values of C IN can be used to further reduce the voltage drop. Output Capacitor A 0.1µF capacitor, COUT, should be placed between V OUT and GND. This capacitor will pr event parasitic board inductance from forcing VOUT below GND when the switch turns-off. Due to the integral body diode in the PMOS switch, a C IN greater than COUT is highly recommended. A C OUT greater than C IN can cause VOUT to exceed VIN when the system supply is removed. This could result in current flow through the body diode from V OUT to VIN. Board Layout For best performance, all traces should be as short as possible. To be most effective, the input and output capacitors should be placed close to the device to mi nimize the effects that parasitic trace inductances may have on normal and short-circuit operation. Using wide traces for V IN, VOUT and GND will help minimize the parasitic electric al effects along with minimizing the case to ambient thermal impedance. OFF ON ON VIN GND FPF1003 VOUT TO LOAD Battery 1.2V-5.5V C1 = 1µF C2 = 0.1µF R1 = 499Ω
8 www.fairchildsemi.com FPF1003 Rev. G FPF1003 IntelliMAX™ Advanced Load Management Products Dimensional Outline and Pad Layout A B C 0. 50 1. 00 0. 50 Ø0 . 2 5 OUT GND ON IN 1. 50 ± 0. 10 1. 0 ± 0. 10 I NDEX SLOT 0. 28 0. 22 0. 65 M AX SOLDER BALL NOTES: A ) ALL DI M ENSI O NS ARE I N M I LLI M ETERS. TOP VI EW RECOMMENDED LAND PATTERN SI DE VI EW A B C 1. 00 0. 50 0. 50 Ø0 . 3 0 IN D E X SLOT BOTTOM VI EW A B C 0. 50 1. 00 0. 50 Ø0 . 2 5 OUT GND ON IN A B C 0. 50 1. 00 0. 50 Ø0 . 2 5 OUT GND ON IN 1. 50 ± 0. 10 1. 0 ± 0. 10 I NDEX SLOT 1. 50 ± 0. 10 1. 0 ± 0. 10 I NDEX SLOT 0. 28 0. 22 0. 65 M AX SOLDER BALL 0. 28 0. 22 0. 28 0. 22 0. 65 M AX SOLDER BALL NOTES: A ) ALL DI M ENSI O NS ARE I N M I LLI M ETERS. TOP VI EW RECOMMENDED LAND PATTERN SI DE VI EW A B C 1. 00 0. 50 0. 50 Ø0 . 3 0 IN D E X SLOT BOTTOM VI EW A B C 1. 00 0. 50 0. 50 Ø0 . 3 0 IN D E X SLOT A B C 1. 00 0. 50 0. 50 Ø0 . 3 0 IN D E X SLOT BOTTOM VI EW
9 www.fairchildsemi.com FPF1003 Rev. G FPF1003 IntelliMAX™ Advanced Load Management Products TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FA IRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT D ESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFIC ATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CO NDITIONS, SPECIFICALLY THE WARR ANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHOR IZED FOR USE AS CRITICAL COMPONEN TS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or system s are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perfo rm can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. PRODUCT STATUS DEFINITIONS Definition of Terms ACEx™ ActiveArray™ Bottomless™ Build it Now™ CoolFET™ CROSSVOLT™ DOME™ EcoSPARK™ E 2CMOS™ EnSigna™ FACT™ FACT Quiet Series™ FAST® FASTr™ FPS™ FRFET™ GlobalOptoisolator™ GTO™ HiSeC™ I 2C™ i-Lo™ ImpliedDisconnect™ IntelliMAX™ ISOPLANAR™ LittleFET™ MICROCOUPLER™ MicroFET™ MicroPak™ MICROWIRE™ MSX™ MSXPro™ OCX™ OCXPro™ OPTOLOGIC OPTOPLANAR™ PACMAN™ POP™ Power247™ PowerEdge™ PowerSaver™ PowerTrench® QFET® QS™ QT Optoelectronics™ Quiet Series™ RapidConfigure™ RapidConnect™ µSerDes™ ScalarPump™ SILENT SWITCHER SMART START™ SPM™ Stealth™ SuperFET™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SyncFET™ TCM™ TinyBoost™ TinyBuck™ TinyPWM™ TinyPower™ TinyLogic TINYOPTO™ TruTranslation™ UHC™ UniFET™ UltraFET VCX™ Wire™ Across the board. Around the world.™ The Power Franchise Programmable Active Droop™ Datasheet Identification Product Status Definition Advance Information Formative or In Design This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Preliminary First Production This data sheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. No Identification Needed Full Production This data sheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Obsolete Not In Production This datashee t contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. I20