FPAM30LH60 ONSEMI | Alldatasheet

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©2012 Fairchild Semiconductor Corporation 1 www.fairchildsemi.com FPAM30LH60 Rev. 1.5 FPAM30LH60 PFC SPM® 2 Series for 2-Phase Interleaved PFC July 2016 FPAM30LH60 PFC SPM ® 2 Series for 2-Phase Interleaved PFC

Features

  • UL Certified No.E209204 (UL1557)
  • 600 V - 30 A 2-Phase Interleaved PFC with Integral Gate Driver and Protection
  • Very Low Thermal Resistance Using Al2O 3 DBC Sub- strate
  • Full-Wave Bridge Rectifier and High-Performance Output Diode
  • Optimized for 20kHz Switching Frequency
  • Built-in NTC Thermistor for Temperature Monitoring
  • Isolation Rating: 2500 Vrms/min

Applications

  • 2-Phase Interleaved PFC Converter General Description The FPAM30LH60 is a PFC SPM® 2 module providing a fully-featured, high-performance Interleaved PFC (Power Factor Correction) input power stage for consumer, med- ical, and industrial applications. These modules inte- grate optimized gate drive of the built-in IGBTs to minimize EMI and losses, while also providing multi- ple on-module protection features including under-volt- age lockout, over-current shutdown, thermal monitoring, and fault reporting. These modules also feature a full- wave rectifier and high-performance output diodes for additional space savings and mounting convenience. Fig. 1. Package Overview Package Marking and Ordering Information Device Device Marking Package Packing Type Quantity FPAM30LH60 FPAM30LH60 S32EA-032 Rail 8
  • For IGBTs: gate drive circuit, Over-Current Protection (OCP), control supply circuit Under-Voltage Lock-Out (UVLO) Protection
  • Fault signal: corresponding to OC and UV fault
  • Built-in thermistor: temperature monitoring
  • Input interface : active-HIGH interface, works with 3.3 / 5 V logic, Schmitt trigger input Pin Configuration

Figure 2. Top View

Figure 3. Internal Block Diagram

11 R TH Series Resistor for The Use of Thermistor

12 V TH Thermistor Bias Voltage

26 P Y Input of Diode

28 P X Input of Diode

29 X Output of X Phase IGBT

30 Y Output of Y Phase IGBT

31 N P Negative DC-Link of IGBT

32 P R Positive DC-Link of Rectifier Diode

©2012 Fairchild Semiconductor Corporation 4 www.fairchildsemi.com FPAM30LH60 Rev. 1.5 FPAM30LH60 PFC SPM® 2 Series for 2-Phase Interleaved PFC Absolute Maximum Ratings (TJ = 25°C, unless otherwise specified.) Converter Part 1st Notes: 1. The maximum junction temperature rating of the power chips integrated within the PFC SPM® product is 125°C. 2. Marking “ * “ is calculation value or design factor. Control Part Total System Thermal Resistance Symbol Parameter Conditions Rating Unit Vi Input Supply Voltage Applied between R - S 264 V rms VPN Output Voltage Applied between X - N P, Y - NP, P - PX, P - PY 450 V VPN(Surge) Output Supply Voltage (Surge) Applied between X - N P, Y - NP, P - PX, P - PY 500 V VCES Collector-emitter Voltage Breakdown Voltage between X - N P, Y - NP 600 V VRRM Repetitive Peak Reverse Voltage of FRD Breakdown Voltage between P - PX, P - PY 600 V VRRMR Repetitive Peak Reverse Voltage of Rec- tifier Breakdown Voltage between PR - R, PR - S, R - NR , S - NR 900 V *IF FRD Forward Current T C = 25°C, TJ < 125°C 30 A *IFSM Peak Surge Current of FRD Non-Repetitiv e, 60 Hz Single Half-Sine Wave 300 A *IFR Rectified Forward Current T C = 25°C, TJ < 125°C 30 A *IFSMR Peak Surge Current of Rectifier Non-Repetitive, 60 Hz Single Half-Sine Wave 300 A ± *IC Each IGBT Collector Current T C = 25°C, TJ < 125°C 30 A ± *ICP Each IGBT Collector Current(Peak) T C = 25°C, TJ < 125°C, Under 1 ms Pulse Width 60 A *PC Collector Dissipation T C = 25°C per IGBT 107 W TJ Operating Junction Temperature (1st Note 1) -40 ~ 125 °C Symbol Parameter Conditions Rating Unit VCC Control Supply Voltage Applied between V CC - COM 20 V VIN Input Signal Voltage Applied between IN X, INY - COM -0.3 ~ V CC + 0.3 V VFO Fault Output Supply Voltage Applied between VFO - COM -0.3 ~ V CC + 0.3 V IFO Fault Output Current Sink Current at V FO Pin 1 mA VSC Current Sensing Input Voltage Applied between CSC - COM -0.3 ~ V CC + 0.3 V Symbol Parameter Conditions Rating Unit TSTG Storage Temperature -40 ~ 125 °C VISO Isolation Voltage 60 Hz, Sinus oidal, AC 1 Minute, Connect Pins to Heat-Sink Plate

2500 V rms

Symbol Parameter Condition Min. Typ. Max. Unit R th(j-c)Q Junction to Case Thermal Resistance Each IGBT under Operating Condition - - 0.93 °C/W R th(j-c)D Each Diode under Operating Condition - - 1.42 °C/W R th(j-c)R Each Rectifier under Operating Condition - - 0.74 °C/W

  1. tON and tOFF include the propagation delay of the internal drive IC. tC(ON) and tC(OFF) are the switching time of IGBT itself under the given gate driving condition internally. For

the detailed information, please see Figure 4. Figure 4. Switching Time Definition

  1. TTH is the temperature of thermister itself. To know case temperature ( TC ), please make the experiment considering your application.

Figure 5. R-T Curve of The Built-in Thermistor

Figure 6. Flatness Measurement Position

Figure 9. Typical Application Circuit

  1. To avoid malfunction, the wiring of each input should be as short as possible(less than 2 ~ 3 cm).
  2. VFO output is open-drain type. This signal line should be pulled up to the positive-side of the MCU or control power supply with a resistor that makes IFO up to 1 mA.
  3. Input signal is active-HIGH type. There is a 5 kΩ resistor inside the IC to pull-down each input signal line to GND. RC coupling circuits is recommanded for the prevention of

input signal oscillation. RFC F constant should be selected in the range 50~150ns(recommended R F = 100 Ω , CF = 1 nF).

  1. To prevent error of the protection function, the wiring related with RSCF and CSCF should be as short as possible.
  2. In the over current protection circuit, please select the RSCF , CSCF time constant in the range 1.5 ~ 2 μs.
  3. Each capacitors should be mounted as close to the PFC SPM® product pins as possible.
  4. Relays are used at almost every systems of electrical equipments of home appliances. In these cases, there should be sufficient distance between the MCU / controller and the
  5. Internal NTC thermistor can be used for monitoring of the case temperature and protecting the device from the overheating operation. Select an appropriate resistor RT accord-
  6. It is recommended that anti-parallel diode(D X ,D Y) be connected with each IGBT.

©2012 Fairchild Semiconductor Corporation 10 www.fairchildsemi.com FPAM30LH60 Rev. 1.5 FPAM30LH60 PFC SPM® 2 Series for 2-Phase Interleaved PFC Detailed Package Outline Drawings Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or data on the drawing and contact a FairchildSemiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide therm and conditions, specifically the the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: https://www.fairchildsemi.com/package-drawings/MO/MOD32BA.pdf

©2012 Fairchild Semiconductor Corporation 11 www.fairchildsemi.com FPAM30LH60 Rev. 1.5 FPAM30LH60 PFC SPM® 2 Series for 2-Phase Interleaved PFC TRADEMARKS The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended to be an exhaustive list of all such trademarks. AccuPower¥ AttitudeEngine™ Awinda® AX-CAP®* BitSiC¥ Build it Now¥ CorePLUS¥ CorePOWER¥ CROSSVOLT¥ CTL¥ Current Transfer Logic¥ DEUXPEED® Dual Cool™ EcoSPARK EfficientMax¥ ESBC¥ Fairchild® Fairchild Semiconductor® FACT Quiet Series¥ FACT® FastvCore¥ FETBench¥ FPS¥ F-PFS¥ FRFET® Global Power Resource SM GreenBridge¥ Green FPS¥ Green FPS¥ e-Series¥ Gmax¥ GTO¥ IntelliMAX¥ ISOPLANAR¥ Making Small Speakers Sound Louder and Better™ MegaBuck¥ MICROCOUPLER¥ MicroFET¥ MicroPak¥ MicroPak2¥ MillerDrive¥ MotionMax¥ MotionGrid® MTi® MTx® MVN® mWSaver® OptoHiT¥ OPTOLOGIC® OPTOPLANAR® Power Supply WebDesigner¥ PowerTrench® PowerXS™ Programmable Active Droop¥ QFET QS¥ Quiet Series¥ RapidConfigure¥ Saving our world, 1mW/W/kW at a time™ SignalWise¥ SmartMax¥ SMART START¥ Solutions for Your Success¥ SPM STEALTH¥ SuperFET® SuperSOT¥-3 SuperSOT¥-6 SuperSOT¥-8 SupreMOS® SyncFET¥ Sync-Lock™ TinyBoost® TinyBuck® TinyCalc¥ TinyLogic® TINYOPTO¥ TinyPower¥ TinyPWM¥ TinyWire¥ TranSiC¥ TriFault Detect¥ TRUECURRENT®* PSerDes¥ UHC® Ultra FRFET¥ UniFET¥ VCX¥ VisualMax¥ VoltagePlus¥ XS™ Xsens™ ௝❺® * Trademarks of System General Corporation, used under license by Fairchild Semiconductor. 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