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Technical content

Features

 Wide Operating Voltage from 3.0V~25V  Open Collector Output  Sink Current up to 20mA  Low Input Offset Voltage: 1mV  Package: SOT23-5L Typical Application Circuit FP130 FP130 PWM Controller FP703 IN+ IN- GND OUT IN+VCC

This datasheet contains new product informat ion. Feeling Technology reserves the ri ghts to modify the product specification wi thout notice. No liability is assumed as a result of the use of this product. No rights under any patent accompany the sales of the product. Function Block Diagram IN+ IN- VCC OUT GND Pin Descriptions SOT23-5L ca962 Name No. I / O Description IN+ 1 I OPA Non-Inverting Input IN- 2 I OPA Inverting Input OUT 3 O OPA Open Collector Output GND 4 P IC Ground VCC 5 P IC Power Supply

This datasheet contains new product informat ion. Feeling Technology reserves the ri ghts to modify the product specification wi thout notice. No liability is assumed as a result of the use of this product. No rights under any patent accompany the sales of the product. Marking Information SOT23-5L Lot Number: Wafer lot number’s last two digits For Example: 132362TB  62 Year: Production year’s last digit Internal ID: Internal Identification Code Part Number Code: Part number identification code for this product. It should be always “c”.

This datasheet contains new product informat ion. Feeling Technology reserves the ri ghts to modify the product specification wi thout notice. No liability is assumed as a result of the use of this product. No rights under any patent accompany the sales of the product.

Ordering Information

Part Number Operating Temperature Package MOQ Description FP703KR-LF -20°C ~ +85°C SOT23-5L 2500EA Tape & Reel Absolute Maximum Ratings Parameter Symbol Conditions Min. Typ. Max. Unit Input Voltage -0.3 v cc-1.8v V Differential Input Voltage V ID ±20 V Output Voltage 25 V Output Sink Current 30 mA Maximum Junction Temperature SOT23-5L +150 °C Thermal Resistance Junction to Ambient θJA +400 °C / W Power Dissipation P D 250 mW Storage Temperature Range -65 +150 °C Lead Temperature (soldering, 10 sec) +260 °C IR Re-flow Soldering Curve

This datasheet contains new product informat ion. Feeling Technology reserves the ri ghts to modify the product specification wi thout notice. No liability is assumed as a result of the use of this product. No rights under any patent accompany the sales of the product. Recommended Operating Conditions Parameter Symbol Conditions Min. Typ. Max. Unit Supply Voltage V cc 3 25 V Operating Temperature -20 +85 °C (VCC=12V, TA= 25°C, unless otherwise noted) Parameter Symbol Conditions Min. Typ. Max. Unit Operating Amplifier TAMB=25℃ 1 3 Input Offset Voltage V IO TMIN≦TAMB≦TMAX 5 mV Input Offset Voltage Drift DV io 7 μV / ℃ TAMB=25℃ -80 -250 Input Bias Current I ib TMIN≦TAMB≦TMAX -500 nA Large Signal Voltage Gain A vd 50 V / mV Output Sink Current I SINK V IN-=0.8V, VOUT=1.2V 30 mA Low Level Output Voltage V OL V IN-=0.8V, ISINK=20mA 0.9 1 V Output Leakage Current I LEAK V OUT=25V, VID-=0.8V 0.1 1 μA Total Supply Current IC Supply Current I CC V CC=25V 0.4 mA

This datasheet contains new product informat ion. Feeling Technology reserves the ri ghts to modify the product specification wi thout notice. No liability is assumed as a result of the use of this product. No rights under any patent accompany the sales of the product. Typical Operating Characteristics (VCC=12V, TA=25°C, unless otherwise noted)

This datasheet contains new product informat ion. Feeling Technology reserves the ri ghts to modify the product specification wi thout notice. No liability is assumed as a result of the use of this product. No rights under any patent accompany the sales of the product. Typical Operating Characteristics (TA=25℃, VCC=12V, ROUT=2K) IN- to VOUT Delay Time F i g u r e 4 F i g u r e 5 IN- V IN+=1.25V VOUT VOUT VIN+=1.25V IN-

This datasheet contains new product informat ion. Feeling Technology reserves the ri ghts to modify the product specification wi thout notice. No liability is assumed as a result of the use of this product. No rights under any patent accompany the sales of the product. Package Outline SOT23-5L UNIT: mm Note: 1. Package dimensions are in compliance with JEDEC outline: MO-178 AA. 2. Dimension “D” does not include moldi ng flash, protrusions or gate burrs. 3. Dimension “E1” does not include inter-lead flash or protrusions. Symbols Min. (mm) Max.(mm) A 1.050 1.350 A1 0.050 0.150 A2 1.000 1.200 b 0.250 0.500 c 0.080 0.200 D 2.700 3.000 E 2.600 3.000 E1 1.500 1.700 e 0.950 BSC e1 1.900 BSC L 0.300 0.550 L1 0.600 REF L2 0.250 BSC θ° 0 ° 10 ° θ1° 3° 7° θ2° 6° 10 °