FP4 EATON | Alldatasheet

Document overview

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Technical content

  • High current carrying capacity
  • Inductance range from 0.090uH to 0.200uH
  • Current range 30 to 72 Amps
  • 10.2 x 6.8mm footprint surface mount package in a 5.0mm height
  • Ferrite core material
  • Halogen free, lead free, RoHS compliant

Applications

  • Servers
  • Multi-phase and Vcore regulators
  • Voltage Regulator Modules (VRMs)
  • Server and desktop
  • Central processing unit (CPU)
  • Graphics processing unit (GPU)
  • Application specific integrated circuit (ASIC)
  • High power density
  • Battery power systems
  • Graphics cards Environmental data
  • Storage temperature range (component): -40°C to +155°C
  • Operating temperature range: -45°C to +155°C (Ambient plus self temperature rise)
  • Solder reflow temperature: J-STD-020D compliant FP4 High current power inductors Pb HALOGEN HFFREE

High current power inductors www.eaton.com/elx Product specifications Part number5 OCL1 (μH) ±15% lrms 2 (amps) lsat 3 (amps) DCR (Ω) typical @ 20°C DCR (Ω) maximum @ 20°C Volt-μsec4 (V-usec) FP4-100-R 0.100 40 64 0.00038 0.00065 1.33 FP4-120-R 0.120 40 54 0.00038 0.00065 1.33 FP4-150-R 0.150 40 42 0.00038 0.00065 1.33 FP4-200-R 0.200 40 30 0.00038 0.00065 1.33 1. Open Circuit Inductance (OCL) Test parameters: 1MHz, 0.100Vrms, 0.0Adc @20°C. 2. Irms: DC current for an approximate ΔT of 40°C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, airflow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 155°C. 3. Isat : Peak current for approximately 30% rolloff @ +20ºC. 4. Applied Volt-Time product (V-μs) across the inductor. This value represents the applied V-μs at 500kHz necessary to generate a core loss equal to 10% of the total losses for 40°C temperature rise. 5. Part Number Definition: FP4-xxx-R FP4 = Product code and size xxx= Inductance value in uH, R= decimal point -R suffix = RoHS compliant Dimensions–mm Packaging information (mm) Supplied in tape and reel packaging, 900 parts per 13” diameter reel. Part number5 OCL1 (μH) ±15% lrms 2 (amps) lsat 3 (amps) DCR (mΩ) @25°C Volt-μsec4 (V-usec) FP4-090SK-R 0.090 33 72 0.423-0.517 1.33 1. Open Circuit Inductance (OCL) Test parameters: 100kHz, 1.0Vrms, 0.0Adc @25°C. 2. Irms: DC current for an approximate ΔT of 40°C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, airflow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 155°C. 3. Isat : Peak current for approximately 20% rolloff @ +25ºC. 4. Applied Volt-Time product (V-μs) across the inductor. This value represents the applied V-μs at 500kHz necessary to generate a core loss equal to 10% of the total losses for 40°C temperature rise. 5. Part Number Definition: FP4-xxxSK-R FP4, SK = Product code and size xxx= Inductance value in uH, R= decimal point -R suffix = RoHS compliant 1.0 min. (2x) 10.20 Max

5.00 Max

1.30 ref. (2x) A 6.80 Max 10.50 2.50 (2x) 4.50 (2x) R0.30 Max. 1.75±0.10 11.50±0.1 24.00 ±0.3 R0.50 Typ. Ao 4.00 2.00 ±0.1 Bo 0.35 ±0.05 Ko User direction of feed A A SECTION A-A Ao=7.20mm Bo=10.60mm Ko=5.40mm FP4-XXX or FP4-XXXSK wwllyy R RECOMMENDED PAD LAYOUTSIDE VIEWTOP VIEW FRONT VIEW SCHEMATICPart Number Dimension “A” (mm) ref. FP4-100-R 3 .0 FP4-120-R 3 .0 FP4-150-R 3 .0 FP4-200-R 3 .0 FP4-090SK-R 2 .8 Part marking: FP4-xxx (FP4=Product code and size),(xxx=inductance value in uH, R=decimal point) FP4-xxxSK (FP4, SK=Product code and size),(xxx=inductance value in uH, R=decimal point) wwllyy = date code, R = revision level Tolerances are ±0.15 millimeters unless stated otherwise PCB tolerances are ±0.2 millimeters unless stated otherwise Do not route traces or vias underneath the inductor FP4-XXX or FP4-XXXSK wwllyy R

High current power inductors www.eaton.com/elx Inductance characteristics OCL vs Isat 100 05 10 15 20 25 30 35 40 45 50 55 60 65 70 75 Isat (ADC) %o f OCL FP4-090SK OCL vs. Isat 0.0 25.0 50.0 75.0 100.0 01 02 03 04 05 0 Isat (ADC) %o f OCL FP4-100 FP4-150 FP4-200 FP4-120

High current power inductors www.eaton.com/elx 1.5MH z 1MHz 500kHz Hz 100kH z 40 6008 00 100050040030020060 80 100503020 %o f Lossesf romI rms (maximum) %o f Applied Volt-μ-second Irms Derating with Core Loss Core loss

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Cleveland, OH 44122 United States www.eaton.com/elx © 2015 Eaton All Rights Reserved Printed in USA Publication No. 4119 December 2015 Eaton is a registered trademark. All other trademarks are property of their respective owners. Technical Data 4119 Effective December 2015 FP4 High current power inductors Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Temperature t tP ts TC -5°C Time 25°C to Peak Time 25°C Tsmin Tsmax TL TP Preheat A Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Solder reflow profile Reference JDEC J-STD-020D Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak • Temperature min. (Tsmin) 100°C 150°C

  • Temperature max. (Tsmax) 150°C 200°C
  • Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds Average ramp up rate Tsmax to Tp 3°C/ Second Max. 3°C/ Second Max. Liquidous temperature (Tl) Time at liquidous (tL) 183°C 60-150 Seconds 217°C 60-150 Seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp) within 5 °C of the specified classification temperature (T c) 20 Seconds 30 Seconds** Average ramp-down rate (Tp to Tsmax) 6°C/ Second Max. 6°C/ Second Max. Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Table 1 - Standard SnPb Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 ≥350 ≥2.5mm 220°C 220°C Table 2 - Lead (Pb) Free Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 350 - 2000 Volume mm3 >2000 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C