FP3 EATON | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 4

Technical content

  • Low profile high current inductors
  • Inductance range 0.1μh to 15μh
  • Design utilizes high temperature iron powder alloy material with a non-organic binder to eliminate thermal aging
  • 7.25 x 6.7mm footprint surface mount package in a 3.0mm height
  • Magnetically shielded, low EMI
  • Current rating up to 34.7Adc (Higher peak cur - rents may be attained with a greater rolloff, see rolloff curve)
  • Frequency range up to 2MHz

Applications

  • Voltage Regulator Modules (VRMs)
  • Multi-phase regulators
  • Desktop and server VRMs and EVRDs
  • Notebook and laptop regulators
  • Battery power systems
  • Graphics cards
  • Point-of-load modules Environmental data
  • Storage temperature range (component): -40°C to +155°C
  • Operating temperature range: -40°C to +155°C (ambient plus self temperature rise)
  • Solder reflow temperature: J-STD-020D FP3 High current, low profile inductors Pb

High current, low profile inductors www.eaton.com/elx Product specifications Part number6 OCL (uH) ± 15% lrms 2 amps lsat 3 amps 10% lsat 4 amps 15% DCR mOhms @ 20°C typ DCR mOhms @ 20°C max K-factor5 1. OCL (Open Circuit Inductance) Test parameters: 100kHz, 0.1Vrms, 0.0Adc 2. I rms DC current for an approximate ΔT of 40°C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 155°C under worst case operating conditions verified in the end application. 3. I sat Amps Peak for approximately 10% rolloff @ 20°C 4. I sat Amps Peak for approximately 15% rolloff @ 20°C 5. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p =K*L*ΔI. Bpp: (Gauss), K: (K factor from table), L: (Inductance in μH), ΔI (Peak to peak ripple current in Amps). 6. Part number definition: FP3 = product code and size xxx = inductance value in μH R = decimal point (if no “R” is present, then last character equals the number of zeros) “-R” suffix = RoHS complaint Dimensions–mm RECOMMENDED PAD LAYOUT SCHEMATIC XXX YWWL FP3 Part marking: FP3 (Product code and size), xxx=(inductance value in μH), R=decimal point (if no “R” is present, then last character equals the number of zeroes, YWW=Date code, L=Location code Packaging information (mm) Supplied in tape and reel packaging, 1700 parts per 13” diameter reel 4.0 2.0 12.0 16.0 +/-0.3 7.5 1.75 A A 1.5 Dia 1.5 Dia Direction of FeedSECTION A-A 7.5 6.9 3.2 FP3 XXX YWWL 2.80 ±0.25 (2x) 2.80 ±0.25 (2x)

3.00 Max

6.70 Max 7.25 Max 7.50 4.50 (2x) 2.50 (2x) 1.0 min. (2x)

High current, low profile inductors www.eaton.com/elx Inductance characteristics OCL vs. Isat 100 02 04 06 08 01 00 1201 40 1601 80 200 % of Isat % of OCL Frequency (kHz) 0.00 0.10 0.20 0.30 0.40 0.50 0.60 0.70 0.80 0.90 1.00 2505 00 7501 0001 2501 5001 7502 0002 250 B p-p (Gauss) Core Loss (W) 200 300 400 500 600 700 800 900 1000 100 110 120 130 140 Total Loss (W) Temperature Rise (°C) Core loss T emperature rise vs. total loss

1000 Eaton Boulevard

Cleveland, OH 44122 United States www.eaton.com/elx © 2015 Eaton All Rights Reserved Printed in USA Publication No. 4118 BU-SB13475 October 2015 Eaton is a registered trademark. All other trademarks are property of their respective owners. FP3 High current, low profile inductors Technical Data 4118 Effective October 2015 Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Temperature t tP ts TC -5°C Time 25°C to Peak Time 25°C Tsmin Tsmax TL TP Preheat A Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Solder reflow profile Reference JDEC J-STD-020D Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak • Temperature min. (Tsmin) 100°C 150°C

  • Temperature max. (Tsmax) 150°C 200°C
  • Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds Average ramp up rate Tsmax to Tp 3°C/ Second Max. 3°C/ Second Max. Liquidous temperature (Tl) Time at liquidous (tL) 183°C 60-150 Seconds 217°C 60-150 Seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp) within 5 °C of the specified classification temperature (T c) 20 Seconds 30 Seconds** Average ramp-down rate (Tp to Tsmax) 6°C/ Second Max. 6°C/ Second Max. Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Table 1 - Standard SnPb Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 ≥350 ≥2.5mm 220°C 220°C Table 2 - Lead (Pb) Free Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 350 - 2000 Volume mm3 >2000 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C