FP2207R

FP2207R EATON | Alldatasheet

Document overview

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Technical content

High frequency, high current power inductors Product features

• High current carrying capacity
• Low core loss
• Magnetically shielded
• 22.5 mm x 8.2 mm footprint surface mount- package in a 7 .25 mm height
• Moisture Sensitivity Level: 1
• Ferrite core material

Applications

• Multi-phase and Vcore regulators
• Voltage Regulator Modules (VRMs) and high- power density VRMs
• Server and desktop
• Central processing unit (CPU)
• Graphics processing unit (GPU)
• Application specific integrated circuit (ASIC)
• Data networking and storage systems
• Graphics cards and battery power systems
• Point-of-Load modules (POL) Environmental data
• Storage temperature range (Component): -55 °C to +125 °C
• Operating temperature range: -55 °C to +125 °C (ambient plus self-temperature rise)
• Solder reflow temperature: J-STD-020 (latest revision) compliant
• Halogen free, lead free, RoHS compliant Pb HALOGEN HFFREE

High frequency, high current power inductors www.eaton.com/electronics Product Specifications Part Number8 OCL1 (nH) ±10% FLL2 (nH) minimum Irms (A) Isat14 (A) Isat25 (A) Isat36 (A) DCR (mΩ) ±15% @ +20 °C K-factor7 R1 Version FP2207R1-R230-R 230 196 50 70 77 72 0.47 182.5 1. Open Circuit Inductance (OCL) Test Parameters: 1.0 MHz, 0.1 Vrms, 0.0 Adc, +25 °C 2. Full Load Inductance (FLL) Test Parameters: 1.0 MHz, 0.1 Vrms, I sat1, +25 °C 3. Irms : DC current for an approximate temperature rise of 40 °C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed +125 °C under worst case operating conditions verified in the end application. 4. I sat1: Peak current for approximately 5% rolloff @ +25 °C 5. Isat2: Peak current for approximately 20% rolloff @ +100 °C 6. Isat3: Peak current for approximately 20% rolloff @ +125 °C 7. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI * 10 -3 Bp-p: (Gauss), K: (K-factor from table), L: (Inductance in nH), ΔI (Peak to peak ripple current in Amps). 8. Part Number Definition: FP2207Rx-Rxxx-R FP2207R= Product code and size x= Version indicator Rxxx= Inductance value in μH, R= decimal point -R suffix = RoHS compliant Note: Hipot: 250 Vdc minimum for 2 seconds, 0.1 mA conductor to uncoated core (test points c to d)Dimensions (mm) Part marking: FP2207Rx (x = Version indicator), Rxxx = Inductance value in uH, R= decimal point), xxxx=Lot code Tolerances are ±0.15 unless stated otherwise Pad layout tolerances are ±0.1 unless stated otherwise Soldering surfaces to be coplanar within 0.1 millimeters DCR measured from point “a” to point “b” Hipot measured from point “c” to point “d” Secure Inductor to PCB using Circuit Bond LV (or equivalent) adhesive for mechanical stability to meet Vibration, Mechanical shock and shear force requirements. Do not route traces or vias underneath the inductor typ typ c d

High frequency, high current power inductors www.eaton.com/electronics Packaging information (mm) Supplied in tape and reel packaging , 500 parts per 13” diameter reel T emperature rise vs. total loss Temperature Rise (°C) Total Loss (W) FP2207R1

High frequency, high current power inductors www.eaton.com/electronics Core loss vs. Bp-p Inductance characteristics 0.001 0.01 0.1 000010001001 Core Loss (W) Bp-p (Gauss) FP2207R1

1.5 MHz

1 MHz

2 MHz

Inductance (nH) Idc (A) FP2207R1-R230-R -40 °C +25 °C +100 °C +125 °C

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Cleveland, OH 44122 United States www.eaton.com/electronics © 2018 Eaton All Rights Reserved Printed in USA Publication No. 10673 EE-PCN18018 June 2018 Eaton is a registered trademark. All other trademarks are property of their respective owners. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Technical Data 10673 Effective June 2018 FP2207R High frequency, high current power inductors Temperature t tP ts TC -5°C Time 25°C to Peak Time 25°C Tsmin Tsmax TL TP Preheat A Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Solder reflow profile Reference JDEC J-STD-020 Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak • Temperature min. (Tsmin) 100 °C 150 °C

• Temperature max. (Tsmax) 150 °C 200 °C
• Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds Average ramp up rate Tsmax to Tp 3 °C/ Second Max. 3 °C/ Second Max. Liquidous temperature (Tl) Time at liquidous (tL) 183 °C 60-150 Seconds 217 °C 60-150 Seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp) within 5 °C of the specified classification temperature (T c) 20 Seconds 30 Seconds** Average ramp-down rate (Tp to Tsmax) 6 °C/ Second Max. 6 °C/ Second Max. Time 25 °C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Table 1 - Standard SnPb Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 ≥350 <2.5mm) 235 °C 220 °C ≥2.5mm 220 °C 220 °C Table 2 - Lead (Pb) Free Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 350 - 2000 Volume mm3 >2000 <1.6mm 260 °C 260 °C 260 °C 1.6 – 2.5mm 260 °C 250 °C 245 °C >2.5mm 250 °C 245 °C 245 °C