FP1505 EATON | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 4
Technical content
- 7.0 x 15.0 x 5.0mm surface mount package
- Ferrite core material
- High current handling capability, low core loss
- Designed for high speed, high current switch mode applications
- Tight DCR tolerance for sensing circuits
- Inductance range from 100 nH to 400 nH
- Current range from 24 A to 105 A
- Frequency range up to 1 MHz
Applications
- Storage temperature range (component): -40 °C to +125 °C
- Operating temperature range: -40 °C to +125 °C (ambient plus self-temperature rise)
- Solder reflow temperature: J-STD-020 (latest revision) compliant FP1505 High frequency, h igh current power inductors Pb HALOGEN HFFREE
- Multi-phase regulators
- Voltage Regulator Module (VRM)
- Desktop and server VRMs and EVRDs
- Data networking and storage systems
- Notebook regulators
- Graphics cards and battery power systems
- Point of load modules
- DCR current sensing Environmental data SMD Device
High frequency, high current power inductors www.eaton.com/electronics Packaging information - mm Dimensions- mm 1 Open Circuit Inductance (OCL) Test Parameters: 100 kHz, 1.0 Vrms, 0.0 Adc 2 Full Load Inductance (FLL) Test Parameters: 100 kHz, 1.0 Vrms,I sat1 3I rms: DC current for an approximate temperature rise of 40 °C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed +125 °C under worst case operating conditions verified in the end application. 4I sat1: Peak current for approximately 20% rolloff at +25 °C. 5I sat2: Peak current for approximately 20% rolloff at +125 °C.
6 K-factor: Used to determine Bp-p
for core loss (see graph). Bp-p = K * L * ΔI * 10 -3.B p-p:(Gauss), K: (K-factor from table), L: (Inductance in nH), ΔI (Peak-to-peak ripple current in amps).
7 Part Number Definition: FP1505Rx-Rxx-R
FP1505 = Product code and size Rx= DCR indicator Rxx= Inductance value in uH, R = decimal point -R suffix = RoHS compliant Part OCL1 FLL2 Irms
3 Isat14 Isat25 DCR (mΩ)
Number7 ± 10% (nH) Min. (nH) (A) (A) @+25 °C (Amps) @+125 °C @+20 °C K-factor6 FP1505R1-R10-R 100 72 105 90 356.3 FP1505R1-R12-R 120 86 87 75 356.3 FP1505R1-R15-R 150 108 53 72 60 0.47 ± 7% 356.3 FP1505R1-R25-R 250 180 42 32 356.3 FP1505R1-R30-R 300 217 35 26 356.3 FP1505R1-R40-R 400 288 24 19.5 356.3 Product specifications Top View Si de View Fr ont View a 2.0 ref 14.7 5. 00 M ax ± 0.3 1505R x R xx 1.9 ref. wwllyy R 2.8 ref. (2x) 6.7 b ± 0.3 The nominal DCR is measured between points “a” and “b” Schematic 4.50 (2x) 2.50 (2x) Recommended Pad Layout Part Marking: 1505Rx Rx = DCR indicator Rxx = Inductance value in μH. (R = Decimal point). wwllyy = Date code R = Revision level Do not route traces or vias underneath the inductor 1.5 dia 4.0 A 1.75 2.0 1.5 dia 11.5 24.0 15.4 1505Rx ± 0.3Rxx wwllyy R 7.4 16.0 A User direction of feed Section A-A 5.4 Supplied in tape-and-reel packaging, 744 parts per reel, 13” diameter reel.
3www.eaton.com/electronics Technical Data 4365 Effective July 2017 Core loss vs Bp-p Inductance characteristics FP1505 High frequency, high current power inductor Temperature rise vs total loss 0 0.4 0.8 1.2 1.6 2 T otal Loss (W) Tem perature R ise (°C ) 1 500 300 200 100 M Hz kHz kHz kHz kHz 0.1 0.01 0.001 0. 0001 100 1000 10000 B p - p (Gauss) Core Loss (W ) % of O C L vs . % of I sat 1 100% 80% +25°C -40°C 60% +125°C 40% 20% 0% 20% 40% 60% 80% 100% 120% 140% % of I sa t 1 % of O CL
1000 Eaton Boulevard
Cleveland, OH 44122 United States www.eaton.com/electronics © 2017 Eaton All Rights Reserved Printed in USA Publication No. 4365 BU-SB09350 July 2017 Eaton is a registered trademark. All other trademarks are property of their respective owners. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Technical Data 4365 Effective July 2017 FP1505 High frequency, high current power inductor Solder Reflow Profile Temperature t tP ts TC -5°C Time 25°C to Peak Time 25°C Tsmin Tsmax TL TP Preheat A Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s TTaabbllee 11 -- SSttaannddaarrdd SSnnPPbb SSoollddeerr ((TTcc)) VolumeVolume Package mm 3 mm3 Thickness <350 _>350 <2.5mm 235°C 220°C TTaabbllee 22 -- LLeeaadd ((PPbb)) FFrreeee SSoollddeerr ((TTcc)) Volume Volume Volume Package mm 3 mm3 mm3 Thickness <350 350 - 2000 >2000 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C Reference JDEC J-STD-020 Standard SnPb Solder Lead (Pb) Free SolderProfile Feature Preheat and Soak eT mperature min. (Tsmin) 100°C 150°C Temperature max. (Tsmax) 150°C 200°C Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds 3°C/ Second Max. 3°C/ Second Max. 183°C 217°C 60-150 Seconds 60-150 Seconds Table 1 able 2T
20 Seconds 30 Seconds
6°C/ Second Max. 6°C/ Second Max. Average ramp up rate Tsmax to Tp Liquidous temperature (TL) Time at liquidous (tL) Peak package body temperature (TP)* Time (tp)** within 5 °C of the specified classification temperature (T c) Average ramp-down rate (Tp to Tsmax) Time 25°C to Peak Temperature Minutes Max.6 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.