FP1308R2-R32-R

FP1308R EATON | Alldatasheet

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 4

Technical content

• 13.4 x 12.7 x 8.0mm surface mount package
• Ferrite core material
• High current carrying capacity, Low core losses
• Controlled DCR tolerance for sensing circuits
• Inductance range from 110nH to 440nH
• Current range from 37 to 120 Amps
• Frequency range up to 2MHz

Applications

• Storage temperature range (component): -40 °C to +125 °C
• Operating temperature range: -40 °C to +125 °C (ambient plus self-temperature rise)
• Solder reflow temperature: J-STD-020 (latest revision) compliant FP1308R High frequency, high current power inductors Pb HALOGEN HFFREE
• Multi-phase regulators
• Voltage Regulator Module (VRM)
• Desktop and server VRMs and EVRDs
• Data networking and storage systems
• Graphics cards and battery power systems
• Point-of-load modules
• DCR sensing Environmental data SMD Device

High frequency, high current power inductors www.eaton.com/electronics Packaging information - mm Dimensions- mm 1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 1.0Vrms, 0.0Adc 2 Full Load Inductance (FLL) Test Parameters: 100kHz, 1.0Vrms,I sat1. 3I rms: DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of other heat generating components will affect the temperature rise. It is r ecommended the part temperature not exceed 125°C under worst case operating conditions verified in the end application. 4I sat: Peak current for approximately 20% rolloff at +25°C. 5I sat2: Peak current for approximately 20% rolloff at +125°C. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI * 10-3.B p-p (Gauss), K: (K-factor from table), L: (inductance in nH), ΔI (peak-to-peak ripple current in amps).

7 Part Number Definition: FP1308Rx-Rxx-R

 FP1308 = Product code and size  Rx = DCR indicator  Rxx = Inductance value in μH, R = decimal point.  “-R” suffix = RoHS compliant Product Specifications Part OCL1 FLL2 Irms

3 Isat14 Isat25 DCR (mΩ)

Number7 ± 10% (nH) (nH) (Amps) @ 25°C (Amps) @ 125°C (Amps) @ 20°C K-factor 6 R1 Version FP1308R1-R11-R 110 79 120 105 233 FP1308R1-R21-R 210 152 80 68 233 FP1308R1-R26-R 260 187 57 64 52 0.32 ± 9.4% 233 FP1308R1-R32-R 320 230 52 40 233 FP1308R1-R44-R 440 317 37 28 233 R2 Version FP1308R2-R11-R 110 79 120 105 233 FP1308R2-R21-R 210 152 80 68 233 FP1308R2-R26-R 260 187 45 64 52 0.53 ± 10% 233 FP1308R2-R32-R 320 230 52 40 233 FP1308R2-R44-R 440 317 37 28 233 R3 Version FP1308R3-R11-R 110 79 120 105 233 FP1308R3-R21-R 210 152 80 68 233 FP1308R3-R26-R 260 187 68 64 52 0.18 ± 20% 233 FP1308R3-R32-R 320 230 52 40 233 FP1308R3-R44-R 440 317 37 28 233 All soldering surfaces to be coplanar within 0.1016mm. Part Marking: FP1308R (Rx = DRC indicator) Rxx = Inductance value in μH. (R = Decimal point). wwllyy = Date code R = Revision level a The nominal DCR is measured from point “a” to point “b” Top View Si de View Bottom View Recom m ended Pad Layout Schem atic 5.08 8.012.7 m ax ±0.15 m ax 7.62 b1 1 2.54 3.18 1 ±0.3 13.4 7.5 7.2 2 1308Rx m ax typ. Rxx wwllyy R 4.0 8.2 Supplied in tape-and-reel packaging, 400 parts per reel, 13” diameter reel. 1.5 dia 2.0 1.5 dia min A Section A-A 1.75 11.5 24.0 13.9 1308Rx ±0.3 Rxx wwll yy R 13.2 A

20.0 User direction of feed

3www.eaton.com/electronics Technical Data 4355 Effective June 2017 Core loss vs Bp-p Inductance characteristics FP1308R High frequency, high current power inductor Temperature rise vs total loss F P1308R2 F P1308R1 F P1308R3 T otal Loss (W) Tem perature R i se (°C ) 1M H z 500kH z 300kH z 200kH z 100kH z 0.1 0.01 100 1000 10000 B p -p (G auss) Core Loss(W ) % of OCL vs % of I sat 1 100% 80% -40°C 60% 40% +25°C 20% +125°C 0% 20% 40% 60% 80% 100% 120% 140% % of I sat 1 % of OCL

1000 Eaton Boulevard

Cleveland, OH 44122 United States www.eaton.com/electronics © 2017 Eaton All Rights Reserved Printed in USA Publication No. 4355 BU-SB12178 June 2017 Eaton is a registered trademark. All other trademarks are property of their respective owners. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Technical Data 4355 Effective June 2017 FP1308R High frequency, high current power inductor Solder Reflow Profile Temperature t tP ts TC -5°C Time 25°C to Peak Time 25°C Tsmin Tsmax TL TP Preheat A Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s TTaabbllee 11 -- SSttaannddaarrdd SSnnPPbb SSoollddeerr ((TTcc)) VolumeVolume Package mm 3 mm3 Thickness <350 _>350 <2.5mm 235°C 220°C TTaabbllee 22 -- LLeeaadd ((PPbb)) FFrreeee SSoollddeerr ((TTcc)) Volume Volume Volume Package mm 3 mm3 mm3 Thickness <350 350 - 2000 >2000 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C Reference JDEC J-STD-020 Standard SnPb Solder Lead (Pb) Free SolderProfile Feature Preheat and Soak eT mperature min. (Tsmin) 100°C 150°C  Temperature max. (Tsmax) 150°C 200°C  Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds 3°C/ Second Max. 3°C/ Second Max. 183°C 217°C 60-150 Seconds 60-150 Seconds Table 1 able 2T

20 Seconds 30 Seconds

6°C/ Second Max. 6°C/ Second Max. Average ramp up rate Tsmax to Tp Liquidous temperature (TL) Time at liquidous (tL) Peak package body temperature (TP)* Time (tp)** within 5 °C of the specified classification temperature (T c) Average ramp-down rate (Tp to Tsmax) Time 25°C to Peak Temperature Minutes Max.6 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.