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Technical content

Supersedes Sepetember 2011 Product features

  • 13.7 x 12.9 x 8.0mm surface mount package
  • High current handling capability, compact footprint
  • Ferrite core material
  • Inductance range from 0.110µH to 0.440µH
  • Current range from 32 to 120 amps
  • Frequency range up to 2MHz
  • Halogen free, lead free, RoHS compliant

Applications

  • Voltage regulator modules (VRMs) for servers and microprocessors
  • Multi-phase buck inductors
  • High frequency, high current switching power supplies
  • Storage temperature range (component): -40 °C to +125 °C
  • Operating temperature range: -40 °C to +125 °C (ambient plus self-temperature rise)
  • Solder reflow temperature: J-STD-020 (latest revision) compliant FP1308 High frequency, high current power inductors Pb HALOGEN HFFREE SMD Device Environmental data W DEFP1308R3-R NERECOMMENDED FOR SIGNS 1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 1.0V rms, 0.0Adc 2I rms: DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of other heat generating components will affect the temperature rise. It is recommended the part temperature not exceed 125°C under worst case operating conditions verified in the end application. 3I sat: Peak current for approximately 20% rolloff at +25°C. 4 K-factor: Used to determine B p-p for core loss (see graph). Bp-p = K * L * ΔI. Bp-p (mT): (Gauss), K: (K-factor from table), L: (inductance in μH), ΔI (peak-to-peak ripple current in amps).

5 Part Number Definition: FP1308-xxx-R

 FP1308 = Product code and size  xxx= Inductance value in μH, R = decimal point. If no “R” is present, then third character = # of zeros.  “-R” suffix = RoHS compliant Product Specifications Part Rated OCL1 Irms

2 Isat

3 DCR (mΩ) @ DCR (mΩ) @ K-factor4

Number5 Inductance (μH) ± 10% (μH) (Amps) (Amps) 25°C Typical 25°C Max

High frequency, high current power inductors www.eaton.com/electronics W DESFP1308R3-R NERECOMMENDED FOR IGNS FP1308-XXX wwllyy R 12.95 max. 13.70 max. 8.0 max. 5.4 2.54 (2pl cs) 8.0 7.62 3.18 7.2 Top View Bottom View Recommended Pad LayoutFront View Left View Schematic DDiimmeennssiioonnss -- mmmm 2.0 1.5 d iia. min A 1.75 Section A-A 11.5 24.0 ±0.3 13.9 FP1308 -XXX wwllyy R 13.2 A User direction of feed 8.2 100 Total Loss (W) Temperature Rise (°C) 32.521.510.50 Part Marking: FP1308 xxx = Inductance value in μH. (R = Decimal point). If no “R” is present, then last character is # 0f zeros wwllyy = Date code R = Revision level Supplied in tape-and-reel packaging, 400 parts per reel, 13” diameter reel. Packaging Information - mm Temperature Rise vs. Total Loss

High frequency, high current power inductors www.eaton.com/electronics Technical Data DS4313 Effective June 2017 Core Loss vs B 0.0001 0.001 0.01 0.1 1000100101 B (mT) 1MHz 500kHz 300kHz 100kHz 50kHz C ore L oss (W) p-p p- p OCL vs Isat 20% 40% 60% 80% 100% 120% 0% 20% 40% 60% 80% 100% 120% 140% 160% %o fIsat %o f OCL +25 °C -40 °C +125 °C Inductance Characteristics Core Loss FP1308R3-R NEW DESRECOMMENDED FOR IGNS

1000 Eaton Boulevard

Cleveland, OH 44122 United States www.eaton.com/electronics © 2017 Eaton All Rights Reserved Printed in USA Publication No. DS4313 BU-SB111090 June 2017 Eaton is a registered trademark. All other trademarks are property of their respective owners. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Compan . Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant inju y to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Solder Reflow Profile Temperature t tP ts TC -5°C Time 25°C to Peak Time 25°C Tsmin Tsmax TL TP Preheat A Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s TTaabbllee 11 -- SSttaannddaarrdd SSnnPPbb SSoollddeerr ((TTcc)) VolumeVolume Package mm 3 mm3 Thickness <350 _>350 <2.5mm 235°C 220°C TTaabbllee 22 -- LLeeaadd ((PPbb)) FFrreeee SSoollddeerr ((TTcc)) Volume Volume Volume Package mm 3 mm3 mm3 Thickness <350 350 - 2000 >2000 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C Reference JDEC J-STD-020 Standard SnPb Solder Lead (Pb) Free SolderProfile Feature Preheat and Soak eT mperature min. (Tsmin) 100°C 150°C  Temperature max. (Tsmax) 150°C 200°C  Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds 3°C/ Second Max. 3°C/ Second Max. 183°C 217°C 60-150 Seconds 60-150 Seconds Table 1 able 2T

20 Seconds 30 Seconds

6°C/ Second Max. 6°C/ Second Max. Average ramp up rate Tsmax to Tp Liquidous temperature (TL) Time at liquidous (tL) Peak package body temperature (TP)* Time (tp)** within 5 °C of the specified classification temperature (T c) Average ramp-down rate (Tp to Tsmax) Time 25°C to Peak Temperature Minutes Max.6 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Technical Data DS4313 Effective June 2017 FP1308 High frequency, high current power inductors FP1308R3-R NEW DESRECOMMENDED FOR IGNS