FP1206 EATON | Alldatasheet

Document overview

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Technical content

  • 8.0 x12.0 x 6.0mm surface mount package
  • Ferrite core material
  • High current carrying capacity, low core losses
  • Designed for high speed, high current switch mode applications
  • Controlled DCR tolerance for sensing circuits
  • Inductance range from 120nH to 400nH
  • Current range from 24 to 88 amps
  • Frequency range up to 1MHz

Applications

  • Storage temperature range (component): -40 °C to +125 °C
  • Operating temperature range: -40 °C to +125 °C (ambient plus self-temperature rise)
  • Solder reflow temperature: J-STD-020 (latest revision) compliant FP1206 High frequency, h igh current power inductors Pb HALOGEN HFFREE
  • Multi-phase regulators
  • Voltage Regulator Module (VRM)
  • Desktop and server VRMs and EVRDs
  • Data networking and storage systems
  • Graphics cards and battery power systems
  • Point of load modules
  • DCR current sensing Environmental data SMD Device

High frequency, high current power inductors www.eaton.com/electronics Packaging information - mm Dimensions- mm 1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.1V rms, 0.0Adc 2 Full Load Inductance (FLL) Test Parameters: 100kHz, .01V rms,I sat1 3I rms: DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the tempera ture rise. It is recommended that the temperature of the part not exceed 125°C under worst case operating conditions verified in the end application. 4I sat1: Peak current for approximately 20% rolloff at +25°C. 5I sat2: Peak current for approximately 20% rolloff at +125°C. 6 K-factor: Used to determine B p-p for core loss (see graph). Bp-p = K * L * ΔI * 10 -3.B p-p:(Gauss), K: (K-factor from table), L: (Inductance in nH), ΔI (Peak-to-peak ripple current in amps).

7 Part Number Definition: FP1206Rx-Rxx-R

 FP1206 = Product code and size  Rx= DCR indicator  Rxx= Inductance value in uH, R = decimal point  -R suffix = RoHS compliant Product Specifications Part OCL1 FLL2 Irms

3 Isat14 Isat25 DCR (mΩ)

Number7 ± 10% (nH) Min. (nH) (Amps) (Amps) @25°C (Amps) @125°C @20°C K-factor 6 FP1206R1-R12-R 120 86 88 65 358 FP1206R1-R15-R 150 108 70 51 358 FP1206R1-R25-R 250 180 50 43 32 0.43 ± 6.5% 358 FP1206R1-R30-R 300 216 34 26 358 FP1206R1-R40-R 400 288 24 19 358 Top ViewSide View Bottom View Schematic 7.5 Recommended Pad Layout 4.5 2.52.8 ± 0.2 2.0 ± 0.2 7.7 typ. a 6.0 max 11.7 ± 0.3 7.7 ± 0.3 1206Rx Rxx wwllyy R Rxx = Inductance value in μH. (R = Decimal point). wwllyy = Date code R = Revision level b The nominal DCR is measured between points “a” and “b” Part Marking: 1206Rx (Rx is the DCR indicator) User direction of feed Section A-A A A 6.4 1.5 dia 1.5 dia 4.0 2.0 16.0 1.75 11.5 24.0 ± 0.312.4 8.4 1206Rx Rxx wwllyy R Supplied in tape-and-reel packaging, 620 parts per reel, 13” diameter reel.

3www.eaton.com/electronics Technical Data 4366 Effective June 2017 Core loss vs Bp-p Inductance characteristics FP1206 High frequency, high current power inductor Temperature rise vs total loss 1 0 0 0.5 1 1 .5 2 2.5 T otal Los s (W ) T em p eratu re R ise (°C ) 1 500 300 200 100 M Hz kH z kH z kHz kHz 0.1 0.01 0.001 0.0001 100 1000 10000 B p - p G auss) Core Loss (W ) % of OCL vs . % of I sat1 100% 80% -40°C 60% 40% 25° +125°C20% 0% 20% 40% 60% 80% 100% 120% 140% % o f I sat1 % o f O C L + C

1000 Eaton Boulevard

Cleveland, OH 44122 United States www.eaton.com/electronics © 2017 Eaton All Rights Reserved Printed in USA Publication No. 4366 BU-SB09349 June 2017 Eaton is a registered trademark. All other trademarks are property of their respective owners. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Technical Data 4366 Effective June 2017 FP1206 High frequency, high current power inductor Solder Reflow Profile Temperature t tP ts TC -5°C Time 25°C to Peak Time 25°C Tsmin Tsmax TL TP Preheat A Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s TTaabbllee 11 -- SSttaannddaarrdd SSnnPPbb SSoollddeerr ((TTcc)) VolumeVolume Package mm 3 mm3 Thickness <350 _>350 <2.5mm 235°C 220°C TTaabbllee 22 -- LLeeaadd ((PPbb)) FFrreeee SSoollddeerr ((TTcc)) Volume Volume Volume Package mm 3 mm3 mm3 Thickness <350 350 - 2000 >2000 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C Reference JDEC J-STD-020 Standard SnPb Solder Lead (Pb) Free SolderProfile Feature Preheat and Soak eT mperature min. (Tsmin) 100°C 150°C  Temperature max. (Tsmax) 150°C 200°C  Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds 3°C/ Second Max. 3°C/ Second Max. 183°C 217°C 60-150 Seconds 60-150 Seconds Table 1 able 2T

20 Seconds 30 Seconds

6°C/ Second Max. 6°C/ Second Max. Average ramp up rate Tsmax to Tp Liquidous temperature (TL) Time at liquidous (tL) Peak package body temperature (TP)* Time (tp)** within 5 °C of the specified classification temperature (T c) Average ramp-down rate (Tp to Tsmax) Time 25°C to Peak Temperature Minutes Max.6 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.