FP1109 EATON | Alldatasheet

Document overview

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  • PDF pages: 4

Technical content

  • 11.2 x 11.2 x 9.0mm maximum surface mount package
  • Ferrite core material
  • High current carrying capacity, low core losses
  • Controlled DCR tolerance for sensing circuits
  • Inductance range from 205nH to 950nH
  • Current range from 11.5 to 69 amps
  • Frequency range up to 2MHz

Applications

  • Storage temperature range (component): -40 °C to +125 °C
  • Operating temperature range: -40 °C to +125 °C (ambient plus self-temperature rise)
  • Solder reflow temperature: J-STD-020 (latest revision) compliant FP1109 High frequency, high current power inductors Pb HALOGEN HFFREE
  • Multi-phase regulators
  • Voltage Regulator Module (VRM)
  • Desktop and server VRMs and EVRDs
  • Data networking and storage systems
  • Graphics cards and battery power systems
  • Point-of-load modules
  • DCR sensing Environmental data SMD Device

High frequency, high current power inductors www.eaton.com/electronics Packaging information - mm Dimensions- mm 1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10V rms, 0.0Adc 2 Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1V rms,I sat1 3I rms: DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of other heat generating components will affect the temperature rise. It is recommended the part temperature not exceed 125°C under worst case operating conditions verified in the end application. 4I sat1: Peak current for approximately 30% rolloff at +25°C. 5I sat2: Peak current for approximately 30% rolloff at +125°C. 6 K-factor: Used to determine B p-p for core loss (see graph). Bp-p = K * L * ΔI * 10-3,B p-p : (Gauss), K: (K-factor from table), L: (inductance in nH), ΔI (peak-to-peak ripple current in amps).

7 Part Number Definition: FP1109-xxx-R

 FP1109 = Product code and size  xxx= Inductance value in μH, R = decimal point. If no “R” is present, then third character = # of zeros  “-R” suffix = RoHS compliant Product Specifications Part Number7 OCL1 ± 20% (nH) FLL 2 Min. (nH) I rms 3 (Amps) Isat14 @ 25°C (Amps) I sat25 @ 125°C (Amps) DCR (mΩ) @ 20°C K-factor 6 FP1109-R20-R 205 122 69 52 233 FP1109-R23-R 247 147 55 41 233 FP1109-R27-R 270 160 51 38 233 FP1109-R33-R 311 185 35 44 33 0.42 ±10% 233 FP1109-R47-R 463 275 27 20 233 FP1109-R58-R 548 325 22.5 17 233 FP1109-1R0-R 950 565 11.5 8.5 233 Top View Side View Recommended Pad Layout Schematic 2.5 nom. (2x) wwllyy R 2FP1109-xxx 3.0 (2X) 3.0 (2X) 11.411.2 max 11.2 max 9.0 max 4.10 ref (2X)2.03 ref Front View Part Marking: FP1109 xxx = Inductance value in μH. (R = Decimal point). If no “R” is present, then last character is # of zeros wwllyy = Date code R = Revision level Section A-A 9.3 1.5 dia. +0.1/-0.0 1.5 dia. min 4.00 2.00 20.00 1.75 11.50 24.0 ±0.3 User direction of feed 11.4 11.4 16.4 17.5 2.0 FP1109-xxx wwllyy R Supplied in tape-and-reel packaging, 350 parts per reel, 13” diameter reel.

3www.eaton.com/electronics Technical Data 4350 Effective June 2017 Core loss vs Bp-p Inductance characteristics FP1109 High frequency, high current power inductor Temperature rise vs total loss T otal Loss (W ) Tem perature Rise (°C) 1MHz100 500kHz 10 300kHz 200kHz 100kHz 0.1 0.01 0.001 0.0001 0.00001 100 1000 10000 Bp-p (Gauss) Core Loss (W) % o f OC L v s. % o f Is at 1 120% 100% 80% - 40° C 60% 40% +125° C +25° C 20% 0% 20% 40% 60% 80% 100% 120% % o f Is at 1 % of OCL

1000 Eaton Boulevard

Cleveland, OH 44122 United States www.eaton.com/electronics © 2017 Eaton All Rights Reserved Printed in USA Publication No. 4350 BU-SB11642 June 2017 Eaton is a registered trademark. All other trademarks are property of their respective owners. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Technical Data 4350 Effective June 2017 FP1109 High frequency, high current power inductor Solder Reflow Profile Temperature t tP ts TC -5°C Time 25°C to Peak Time 25°C Tsmin Tsmax TL TP Preheat A Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s TTaabbllee 11 -- SSttaannddaarrdd SSnnPPbb SSoollddeerr ((TTcc)) VolumeVolume Package mm 3 mm3 Thickness <350 _>350 <2.5mm 235°C 220°C TTaabbllee 22 -- LLeeaadd ((PPbb)) FFrreeee SSoollddeerr ((TTcc)) Volume Volume Volume Package mm 3 mm3 mm3 Thickness <350 350 - 2000 >2000 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C Reference JDEC J-STD-020 Standard SnPb Solder Lead (Pb) Free SolderProfile Feature Preheat and Soak eT mperature min. (Tsmin) 100°C 150°C  Temperature max. (Tsmax) 150°C 200°C  Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds 3°C/ Second Max. 3°C/ Second Max. 183°C 217°C 60-150 Seconds 60-150 Seconds Table 1 able 2T

20 Seconds 30 Seconds

6°C/ Second Max. 6°C/ Second Max. Average ramp up rate Tsmax to Tp Liquidous temperature (TL) Time at liquidous (tL) Peak package body temperature (TP)* Time (tp)** within 5 °C of the specified classification temperature (T c) Average ramp-down rate (Tp to Tsmax) Time 25°C to Peak Temperature Minutes Max.6 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.