FP1108L3 EATON | Alldatasheet

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Technical content

High frequency, high current power inductors

Description

  • High current carrying capacity
  • Ultra low DCR
  • Low core loss
  • Operating frequency − L3 version 500kHz-800kHz − L4 version 1MHz-3MHz
  • Inductance range from 105nH to 180nH
  • Current range from 33 to 57 amps
  • 11.0 x 8.0mm footprint surface mount package in an 8.0mm heightt
  • Ferrite core material
  • Halogen free, lead free, RoHS compliant

Applications

  • Servers
  • Multi-phase and Vcore regulators
  • Voltage Regulator Modules (VRMs)
  • Desktop VRMs and EVRDs
  • Data networking and storage systems
  • Graphics cards and battery power systems
  • Point-of-Load modules Environmental Data
  • Storage temperature range (Component): -40°C to +125°C
  • Operating temperature range: -40°C to +125°C (ambient + self-temperature rise)
  • Solder reflow temperature: J-STD-020D compliant Pb HALOGEN HFFREE

High frequency, high current power inductors www.eaton.com/elx Product Specifications Part Number8 OCL1 (nH) ±10% FLL2 (nH) minimum Irms (amps) Isat14 (amps) Isat25 (amps) Isat36 (amps) DCR (mΩ) ±10% @ 20°C K-factor7 L3 Version FP1108L3-R105-R 105 76 91 57 48 45 0.05 552 L4 Version FP1108L4-R120-R 120 86 91 50 42 40 0.05 552 FP1108L4-R150-R 150 108 91 40 34 32 0.05 552 FP1108L4-R180-R 180 129 91 33 28 26 0.05 552 1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.1Vrms, 0.0Adc, @ +25°C 2. Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, @ I sat1, @ +25ºC 3. Irms: DC current for an approximate temperature rise of 40°C without core loss. This is for reference only and does not represent absolute maximum ratings. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 125°C under worst case operating conditions verified in the end application. 4. Isat1: Peak current for approximately 20% rolloff @ +25°C 5. Isat2: Peak current for approximately 20% rolloff @ +100°C 6. Isat3: Peak current for approximately 20% rolloff @ +125°C 7. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI * 10-3 Bp-p: (Gauss), K: (K-factor from table), L: (Inductance in nH), ΔI (Peak to peak ripple current in Amps). 8. Part Number Definition: FP1108Lx-Rxxx-R FP1108L = Product code and size x= Version indicator Rxxx= inductance value in μH, R= decimal point , -R suffix = RoHS compliant Dimensions (mm) Part marking: 1108Lx (x = Version indicator), Rxxx = Inductance value in uH (R= decimal point) wwllyy = date code, R = revision level All soldering surfaces to be coplanar within 0.1 millimeters PCB tolerances are ±0.1 millimeters unless otherwise specified DCR measured from point “a” to point “b” Do not route traces or vias underneath the inductor Recommended Pad Layout Schematic 1108Lx Rxxx wwllyy R a b 8.6 3.5 4.0 3.0 nom 1.7 nom 3.6 nom 8.0 max 8.0 max 11.0 max

High frequency, high current power inductors www.eaton.com/elx Packaging information (mm) Supplied in tape and reel packaging, 500 parts per 13” diameter reel T emperature rise vs. total loss User Direction of feed 1.75 24.0 ±0.3 11.5 1.5 dia 1.5 dia 11.4 8.4 16.0 4.0 2.0 8.1 Temperature Rise (°C) Total Loss (W) FP1108L3 Total Loss (W) Temperature Rise (°C) FP1108L4

High frequency, high current power inductors www.eaton.com/elx Core loss vs. Bp-p Core Loss (W) FP1108L3 Bp-p (Gauss) 0.001 0.01 0.1 100 1000 10000 300kHz 500kHz 800kHz 1.0MHz 0.001 0.01 0.1 100 1000 10000 1.0MHz 1.5MHz 2.0MHz 3.0MHz 700kHz Core Loss (W) Bp-p (Gauss) FP1108L4

High frequency, high current power inductors www.eaton.com/elx Inductance characteristics% of OCL FP1108L3-R105-R IDC (Amps) 20% 40% 60% 80% 100% 120% 01 02 03 04 05 06 07 08 0 20% 40% 60% 80% 100% 120% 01 02 03 04 05 06 07 0 20% 40% 60% 80% 100% 120% 05 10 15 20 25 30 35 40 45 50 -40°C +25°C +100°C +125°C 20% 40% 60% 80% 100% 120% 05 10 15 20 25 30 35 40 45 FP1108L4-R120-R FP1108L4-R150-R FP1108L4-R180-R % of OCL % of OCL % of OCL IDC (Amps) IDC (Amps) IDC (Amps) -40°C +25°C +100°C +125°C -40°C +25°C +100°C +125°C -40°C +25°C +100°C +125°C

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Cleveland, OH 44122 United States www.eaton.com/elx © 2015 Eaton All Rights Reserved Printed in USA Publication No. 10449 BU-MC15031 October 2015 Eaton is a registered trademark. All other trademarks are property of their respective owners. FP1 108L3 and FP1 108L4 High frequency, high current power inductors Technical Data 10449 Effective October 2015 Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Temperature t tP ts TC -5°C Time 25°C to Peak Time 25°C Tsmin Tsmax TL TP Preheat A Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Solder reflow profile Reference JDEC J-STD-020D Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak • Temperature min. (Tsmin) 100°C 150°C

  • Temperature max. (Tsmax) 150°C 200°C
  • Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds Average ramp up rate Tsmax to Tp 3°C/ Second Max. 3°C/ Second Max. Liquidous temperature (Tl) Time at liquidous (tL) 183°C 60-150 Seconds 217°C 60-150 Seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp) within 5 °C of the specified classification temperature (T c) 20 Seconds 30 Seconds** Average ramp-down rate (Tp to Tsmax) 6°C/ Second Max. 6°C/ Second Max. Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Table 1 - Standard SnPb Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 ≥350 ≥2.5mm 220°C 220°C Table 2 - Lead (Pb) Free Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 350 - 2000 Volume mm3 >2000 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C