FP1108B EATON | Alldatasheet

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Technical content

High frequency, high current power inductors Product description

  • High current carrying capacity
  • Low core loss
  • Tight tolerance DCR for sensing circuits
  • 11.6 x 8.0mm footprint surface mount package in 8.0mm height
  • Ferrite core material
  • Halogen free, lead free, RoHS compliant

Applications

  • Servers
  • Multi-phase and Vcore regulators
  • Voltage Regulator Modules (VRMs)
  • Server and desktop
  • Central processing unit (CPU)
  • Graphics processing unit (GPU)
  • Application specific integrated circuit (ASIC)
  • High power density
  • Data centers, networking and storage systems
  • Point-of-Load modules
  • DCR Sensing circuits Environmental data
  • Storage temperature range (Component): -40°C to +125°C
  • Operating temperature range: -40°C to +125°C (ambient + self-temperature rise)
  • Solder reflow temperature: J-STD-020D compliant Pb HALOGEN HFFREE

High frequency, high current power inductors www.eaton.com/elx Product specifications Part Number8 OCL1 (nH)±10% FLL2 (nH) minimum Irms (amps) Isat14 (amps) Isat25 (amps) Isat36 (amps) DCR (mΩ) ±5% @ 20°C K-factor7 B1 version FP1108B1-R180-R 180 130 40 63 55 50 0.29 349 1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.1Vrms, 0.0Adc, +25°C 2. Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, Isat1, +25°C 3. I rms: DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generat- ing components will affect the temperature rise. It is recommended that the temperature of the part not exceed 125°C under worst case operating conditions verified in the end application. 4. I sat1: Peak current for approximately 20% rolloff @ +25°C 5. I sat2: Peak current for approximately 20% rolloff @ +85°C 6. I sat2: Peak current for approximately 20% rolloff @ +125°C 7. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ∆I * 10-3. Bp-p:(Gauss), K: (K-factor from table), L: (Inductance in nH), ∆I (Peak-to-peak ripple current in Amps). 8. Part Number Definition: FP1108Bx-Rxxx-R FP1108B= Product code and size x= Version indicator Rxxx= Inductance value in μH, R= decimal point -R suffix = RoHS compliant Dimensions (mm) Part marking: FP1108Bx (Product code and size, x = version indicator), Rxxx = Inductance value in uH, R = decimal point wwllyy = date code, R = revision level All soldering surface to be coplanar within 0.10mm DCR measured between point “a” and point “b” Recommended Pad Layout Schematic

High frequency, high current power inductors www.eaton.com/elx Packaging information (mm) T emperature rise vs. total loss Supplied in tape and reel packaging 350 parts per 13 ” diameter reel User Direction of Feed Total Loss (W) FP1108B1 Temperature Rise (°C)

High frequency, high current power inductors www.eaton.com/elx Core loss vs. Bp-p Inductance characteristics 0.001 0.01 0.1 1001 0001 0000 Core Loss (W) Bp-p (Gauss) 300kHz 500kHz 800kHz 1MHz FP1108B1 20% 40% 60% 80% 100% 120% 01 02 03 04 05 06 07 08 09 0 100 % of OCL IDC (Amps) FP1108B1-R180-R -40C +25C +85°C +100C +125C

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Cleveland, OH 44122 United States www.eaton.com/elx © 2015 Eaton All Rights Reserved Printed in USA Publication No. 10476 BU-MC15050 November 2015 Eaton is a registered trademark. All other trademarks are property of their respective owners. Technical Data 10476 Effective November 2015 FP1 108B High frequency, high current power inductors Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Solder reflow profile Reference JDEC J-STD-020D Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak • Temperature min. (Tsmin) 100°C 150°C

  • Temperature max. (Tsmax) 150°C 200°C
  • Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds Average ramp up rate Tsmax to Tp 3°C/ Second Max. 3°C/ Second Max. Liquidous temperature (Tl) Time at liquidous (tL) 183°C 60-150 Seconds 217°C 60-150 Seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp) within 5 °C of the specified classification temperature (T c) 20 Seconds 30 Seconds** Average ramp-down rate (Tp to Tsmax) 6°C/ Second Max. 6°C/ Second Max. Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Temperature t tP ts TC -5°C Time 25°C to Peak Time 25°C Tsmin Tsmax TL TP Preheat A Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Table 1 - Standard SnPb Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 ≥350 ≥2.5mm 220°C 220°C Table 2 - Lead (Pb) Free Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 350 - 2000 Volume mm3 >2000 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C