FP1107

FP1107 EATON | Alldatasheet

Document overview

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• PDF pages: 4

Technical content

• 7.2 x 11.0 x 7.5mm surface mount package
• Ferrite core material
• High current carrying capacity, low core losses
• Controlled DCR tolerance for sensing circuits
• Inductance range from 70nH to 510nH
• Current range from 18 amps to 140 amps
• Frequency range up to 2MHz

Applications

• Storage temperature range (component): -40 °C to +125 °C
• Operating temperature range: -40 °C to +125 °C (ambient plus self-temperature rise)
• Solder reflow temperature: J-STD-020 (latest revision) compliant FP1107 High frequency, high current power inductors Pb HALOGEN HFFREE
• Multi-phase regulators
• Voltage Regulator Module (VRM)
• Desktop and server VRMs and EVRDs
• Data networking and storage systems
• Graphics cards and battery power systems
• Point-of-load modules
• DCR sensing Environmental data SMD Device

High frequency, high current power inductors www.eaton.com/electronics Packaging information - mm Dimensions- mm 1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10Vrms, 0.0Adc

2 Full Load Inductance (FLL)

Test Parameters: 100kHz, 0.1Vrms,I sat1 3I rms: DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of other heat generating components will affect the temperature rise. It is recommended the part temperature not exceed 125°C under worst case operating conditions verified in the end application. 4 Isat1: Peak current for approximately 20% rolloff at +25°C. 5I sat2: 5 Peak current for approximately 20% rolloff at +125°C. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * Δ I * 10-3,B p-p : (Gauss), K: (K-factor from table), L: (inductance in nH), ΔI (peak-to-peak ripple current in amps).

7 Part Number Definition:

 Rx is the DCR indicator  FP1107 = Product code and size  Rxx= Inductance val ue in μH, R = decimal point  “-R” suffix = RoHS compliant Product Specifications Part Number7 OCL1 ± 10% (nH) FLL 2 Min. (nH) I rms 3 (Amps)Isat14 @ 25°C (Amps) I sat25 @ 125°C (Amps) DCR (mΩ) @ 20°C K-factor 6 R1 Version FP1107R1-R07-R 70 50 140 123 361.1 FP1107R1-R12-R 120 86 90 72 361.1 FP1107R1-R15-R 150 108 70 56 361.1 FP1107R1-R23-R 230 166 55 45 36 0.29 ± 8% 361.1 FP1107R1-R30-R 300 217 35 28 361.1 FP1107R1-R40-R 400 288 25 20 361.1 FP1107R1-R51-R 510 364 18 14.5 361.1 R2 Version FP1107R2-R07-R 70 50 140 123 363.3 FP1107R2-R12-R 120 86 90 72 363.3 FP1107R2-R15-R 150 108 70 56 363.3 FP1107R2-R23-R 230 166 42 45 36 0.47 ± 6.4% 363.3 FP1107R2-R30-R 300 217 35 28 363.3 FP1107R2-R40-R 400 288 25 20 363.3 FP1107R2-R51-R 510 364 18 14.5 363.3 Top View Side View Bottom View Recommended Pad Layout Schematic 2Rxx wwllyy R 1107Rx 7.2 max 11.0 max 1.90 +/-0.15 C 5.8 typ 3.1 5.0 2.1b FP1107R 1-R = 7.50 max FP1107R 2-R = 7.20 max Part Marking: 1107Rx (Rx = DCR Indicator) Rxx = Inductance value in μH. (R = Decimal point) wwllyy = Date code R = Revision level a The nominal DCR is measured from point “a” to point”b.” Section A-A Section B-B 1.75 11.5 4.0 12.0 1.5 dia. 2.0 +/-0.311.1 7.4 1.5 dia.7.6 wwllyy R Rxx 1107Rx User direction of feed Supplied in tape-and-reel packaging, 640 parts per reel, 13” diameter reel.

3www.eaton.com/electronics Technical Data 4342 Effective June 2017 Core loss vs Bp-p Inductance characteristics FP1107 High frequency, high current power inductor Temperature rise vs total loss FP 1107R 1 FP 1107R 2 T o ta l Loss (W ) T e m p e ra tu re R ise (°C ) 1MHz 1 0 500kHz 300kHz 200kHz 100kHz 0 .1 0 .0 1 0 .001 100 1 0 0 0 1 0 0 0 0 Bp - p (G a u ss) Co re L o ss (W ) % o f O C L vs % o f I sa t1 100% -40°C 80% + 25°C 60% 40% + 125°C 20% 0% 20% 40% 60% 80% 100% 120% 140% % o f Isa t1 % o f O C L

1000 Eaton Boulevard

Cleveland, OH 44122 United States www.eaton.com/electronics © 2017 Eaton All Rights Reserved Printed in USA Publication No. 4342 June 2017 Eaton is a registered trademark. All other trademarks are property of their respective owners. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Technical Data 4342 Effective June 2017 FP1107 High frequency, high current power inductor Solder Reflow Profile Temperature t tP ts TC -5°C Time 25°C to Peak Time 25°C Tsmin Tsmax TL TP Preheat A Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s TTaabbllee 11 -- SSttaannddaarrdd SSnnPPbb SSoollddeerr ((TTcc)) VolumeVolume Package mm 3 mm3 Thickness <350 _>350 <2.5mm 235°C 220°C TTaabbllee 22 -- LLeeaadd ((PPbb)) FFrreeee SSoollddeerr ((TTcc)) Volume Volume Volume Package mm 3 mm3 mm3 Thickness <350 350 - 2000 >2000 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C Reference JDEC J-STD-020 Standard SnPb Solder Lead (Pb) Free SolderProfile Feature Preheat and Soak eT mperature min. (Tsmin) 100°C 150°C  Temperature max. (Tsmax) 150°C 200°C  Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds 3°C/ Second Max. 3°C/ Second Max. 183°C 217°C 60-150 Seconds 60-150 Seconds Table 1 able 2T

20 Seconds 30 Seconds

6°C/ Second Max. 6°C/ Second Max. Average ramp up rate Tsmax to Tp Liquidous temperature (TL) Time at liquidous (tL) Peak package body temperature (TP)* Time (tp)** within 5 °C of the specified classification temperature (T c) Average ramp-down rate (Tp to Tsmax) Time 25°C to Peak Temperature Minutes Max.6 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.