FP1012V EATON | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 9

Technical content

High frequency, high current power inductors

Applications

  • Multi-phase and Vcore regulators
  • Voltage regulator modules (VRMs) and high power density VRMs
  • Server and desktop
  • Central processing unit (CPU)
  • Graphics processing unit (GPU)
  • Application specific integrated circuit (ASIC)
  • Data networking and storage systems
  • Graphics cards and battery power systems
  • Point-of-Load modules Environmental compliance and general specifications
  • Storage temperature range (component): -40 °C to +125 °C
  • Operating temperature range: -40 °C to +125 °C (ambient plus self-temperature rise)
  • Solder reflow temperature: J-STD-020 (latest revision) compliant Pb HALOGEN HFFREE Product features
  • Vertical design utilizes less board space
  • High current carrying capacity
  • Operating frequency up to 3 MHz
  • Inductance range from 70 nH to 470 nH
  • Current range 22 A to 190 A
  • 10.0 mm x 6.0 mm footprint surface mount package in 12 mm height
  • Moisture sensitivity level (MSL): 1
  • Ferrite core material
  • Weight: 3.1 grams typical

High frequency, high current power inductors www.eaton.com/electronics Product specifications Part number8 OCL1 (nH) ±10% FLL2 (nH) minimum Irms (A) Isat1 (A) Isat2 (A) Isat3 (A) DCR (mΩ) @ +20 °C ±10% K-factor7 V2 version FP1012V2-R070-R 70 50 84 130+ 130+ 130+ 0.125 305 FP1012V2-R080-R 80 57 84 130+ 130+ 125 0.125 305 FP1012V2-R090-R 90 64 84 130+ 117 110 0.125 305 FP1012V2-R100-R 100 72 84 125 105 100 0.125 305 FP1012V2-R120-R 120 86 84 105 88 81 0.125 305 FP1012V2-R150-R 150 108 84 83 70 66 0.125 305 FP1012V2-R330-R 330 231 84 36 28 26 0.125 305 FP1012V2-R470-R 470 (±15%) 329 84 22 19 18 0.125 305 V3 version FP1012V3-R070-R 70 50 84 190 172 160 0.125 305 FP1012V3-R080-R 80 57 84 170 146 132 0.125 305 FP1012V3-R090-R 90 64 84 150 128 121 0.125 305 FP1012V3-R100-R 100 72 84 138 115 110 0.125 305 FP1012V3-R120-R 120 86 84 116 96 89 0.125 305 FP1012V3-R150-R 150 108 84 91 77 72 0.125 305 FP1012V3-R240-R 240 168 84 56 48 45 0.125 305 FP1012V3-R330-R 330 231 84 40 32 30 0.125 305 1. Open circuit inductance (OCL) test parameters: 100 kHz, 0.1 Vrms, 0.0 Adc, +25 °C 2. Full load inductance (FLL) test parameters: 100 kHz, 0.1 Vrms, I sat1, +25 °C 3. Irms: DC current for an approximate temperature rise of 40 °C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed +125 °C under worst case operating conditions verified in the end application. 4. Isat1 : Peak current for approximately 20% rolloff @ +25 °C 5. Isat2 : Peak current for approximately 20% rolloff @ +100 °C 6. Isat3 : Peak current for approximately 20% rolloff @ +125 °C 7. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ∆I * 10 -3. Bp-p:(Gauss), K: (K-factor from table), L: (Inductance in nH), ∆I (Peak to peak ripple current in Amps). 8. Part number definition: FP1012Vx-Rxxx-R FP1012 = Product code and size Vx= Version indicator Rxxx=Inductance value in μH, R=decimal point -R suffix = RoHS compliant

High frequency, high current power inductors www.eaton.com/electronics Dimensions-mm FP1012V2 FP1012V3 Part marking: FP1012=Product code and size, Vx=Version indicator, Rxxx= inductance value in uH, R=decimal point, xxxx= lot code Tolerances are ±0.15 millimeters unless stated otherwise All soldering surfaces to be coplanar within 0.1 millimeters Pad layout tolerances are ±0.1 millimeters unless stated otherwise DCR is measured from point “a” to point “b” Traces or vias underneath the inductor is not recommended Dimension FP1012V2/V3 A 10 maximum B 6.0 maximum C 12 maximum D 2.3 nominal E 1.6 reference F 6.5 reference Recommended pad layout FP1012V2/V3 Schematic FP1012V2/V3

High frequency, high current power inductors www.eaton.com/electronics Packaging information- mm Supplied in tape and reel packaging, 250 parts per 13” diameter reel (EIA-481 compliant) T emperature rise vs. total loss Temperature rise (°C) Total loss (W) FP1012V2/V3 W ±0.3 24.00 F±0.1 11.50 E1±0.10 1.75 P0±0.10 4.00 P1±0.10 20.00 P2±0.1 2.00 1.50D0+0.10/-0 A0 6.2±010 B0 10.2±0.10 K0 12.2±0.10 T ±0.05 0.5 1.50D1+0.10/-0 W ±0.3 24.00 F±0.1 11.50 E1±0.10 1.75 P0±0.10 4.00 P1±0.10 20.00 P2±0.1 2.00 1.50D0+0.10/-0 A0 6.2±010 B0 10.2±0.10 K0 12.2±0.10 T ±0.05 0.5 1.50D1+0.10/-0 FP1012V2 FP1012V3

High frequency, high current power inductors www.eaton.com/electronics Core loss vs Bp-p 0.001 0.01 0.1 1001 0001 0000 Core loss (W) Bp-p (Gauss)

1.0 MHz

2 MHz

1.5 MHz

3 MHz

Inductance characteristics 02 04 06 08 01 00 1201 40 160 Inductance (nH) Idc (A) FP1012V2-R080-R -40 °C +25 °C +100 °C +125 °C 02 04 06 08 01 00 1201 40 160 Inductance (nH) Idc (A) FP1012V2-R070-R -40 °C +25 °C +100 °C +125 °C

High frequency, high current power inductors www.eaton.com/electronics 100 120 140 160 02 04 06 08 01 00 120 1401 60 Inductance (nH) Idc (A) FP1012V2-R150-R -40 °C +25 °C +100 °C +125 °C 100 150 200 250 300 350 400 01 02 03 04 05 06 07 08 0 Inductance (nH) Idc (A) FP1012V2-R330-R -40 °C +25 °C +100 °C +125 °C 100 120 02 04 06 08 01 00 1201 40 160 Inductance (nH) Idc (A) FP1012V2-R100-R -40 °C +25 °C +100 °C +125 °C 100 120 140 02 04 06 08 01 00 1201 40 160 Inductance (nH) Idc (A) FP1012V2-R120-R -40 °C +25 °C +100 °C +125 °C 100 120 02 04 06 08 01 00 1201 40 160 Inductance (nH) Idc (A) FP1012V2-R090-R -40 °C +25 °C +100 °C +125 °C 100 200 300 400 500 600 05 10 15 20 25 30 35 40 45 Inductance (nH) Idc (A) FP1012V2-R470-R -40 °C +25 °C +100 °C +125 °C Inductance characteristics

High frequency, high current power inductors www.eaton.com/electronics Inductance characteristics 05 0 100 1502 00 250 Inductance (nH) -40 °C FP1012V3-R070-R +25 °C +100 °C +125 °C 05 0 100 1502 00 250 Inductance (nH) Idc (A) -40 °C Idc (A) FP1012V3-R080-R +25 °C +100 °C +125 °C 100 120 05 01 00 1502 00 Inductance (nH) Idc (A) -40 °C FP1012V3-R090-R +25 °C +100 °C +125 °C

High frequency, high current power inductors www.eaton.com/electronics Inductance characteristics 100 150 200 250 300 02 04 06 08 01 00 Inductance (nH) -40 °C FP1012V3-R240-R +25 °C +100 °C +125 °C 100 150 200 250 300 350 400 01 02 03 04 05 06 07 08 0 Inductance (nH) Idc (A) -40 °C Idc (A) FP1012V3-R330-R +25 °C +100 °C +125 °C

1000 Eaton Boulevard

Cleveland, OH 44122 United States Eaton.com/electronics © 2020 Eaton All Rights Reserved Printed in USA Publication No. 10953 BU-MC20214 December 2020 Technical Data 10953 Effective December 2020 FP1012V High frequency, high current power inductors Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Solder reflow profile Table 1 - Standard SnPb solder (Tc) Package thickness Volume mm3 <350 Volume mm3 ≥350 <2.5 mm) 235 °C 220 °C ≥2.5 mm 220 °C 220 °C Table 2 - Lead (Pb) free solder (Tc) Package thickness Volume mm3 <350 Volume mm3 350 - 2000 Volume mm3 >2000 <1.6 mm 260 °C 260 °C 260 °C 1.6 – 2.5 mm 260 °C 250 °C 245 °C >2.5 mm 250 °C 245 °C 245 °C Temperature t tP ts TC -5 °C Time 25 °C to peak Time 25 °C Tsmin Tsmax TL TP Preheat A Max. ramp up rate = 3 °C/s Max. ramp down rate = 6 °C/s Eaton is a registered trademark. All other trademarks are property of their respective owners. Follow us on social media to get the latest product and support information. Reference J-STD-020 Profile feature Standard SnPb solder Lead (Pb) free solder Preheat and soak • Temperature min. (Tsmin) 100 °C 150 °C

  • Temperature max. (Tsmax) 150 °C 200 °C
  • Time (Tsmin to Tsmax) (ts) 60-120 seconds 60-120 seconds Ramp up rate TL to Tp 3 °C/ second max. 3 °C/ second max. Liquidous temperature (Tl) Time (tL) maintained above TL 183 °C 60-150 seconds 217 °C 60-150 seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp)* within 5 °C of the specified classification temperature (T c) 20 seconds* 30 seconds* Ramp-down rate (Tp to TL) 6 °C/ second max. 6 °C/ second max. Time 25 °C to peak temperature 6 minutes max. 8 minutes max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.