FP1010R EATON | Alldatasheet

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Technical content

High frequency, high current power inductors

Description

  • High current carrying capacity
  • Low core loss
  • Magnetically shielded
  • Tight tolerance DCR for sensing circuits
  • 10 mm x 7.0 mm footprint surface mount package in a 10 mm height
  • Ferrite core material
  • Halogen free, lead free, RoHS compliant

Applications

  • Multi-phase and Vcore regulators
  • Voltage Regulator Modules (VRMs)
  • Server and desktop
  • Central processing unit (CPU)
  • Graphics processing unit (GPU)
  • Application specific integrated circuit (ASIC)
  • High power density
  • Data networking and storage systems
  • Graphics cards and battery power systems
  • Portable electronics
  • Point-of-Load modules
  • DCR Sensing circuits Environmental Data
  • Storage temperature range (Component): -40 °C to +125 °C
  • Operating temperature range: -40 °C to +125 °C (ambient plus self-temperature rise)
  • Solder reflow temperature: J-STD-020D compliant Pb HALOGEN HFFREE

High frequency, high current power inductors www.eaton.com/elx Product Specifications Part Number8 OCL1 (nH) ±15% FLL2 (nH) minimum Irms (A) Isat14 (A) Isat25 (A) Isat36 (A) DCR (mΩ) ±5% @ 20°C K-factor7 FP1010R1-R120-R 120 84 50 94 80 75 0.185 371 FP1010R1-R150-R 150 105 50 80 68 64 0.185 371 FP1010R1-R330-R 330 230 50 30 25 23 0.185 371 1. Open Circuit Inductance (OCL) Test Parameters: 100 kHz, 0.1 Vrms, 0.0 Adc, +25 °C 2. Full Load Inductance (FLL) Test Parameters: 100 kHz, 0.1 Vrms, Isat1, +25 °C 3. Irms: DC current for an approximate temperature rise of 40 °C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 125 °C under worst case operating conditions verified in the end application. 4. Isat1: Peak current for approximately 20% rolloff @ +25 °C 5. Isat2: Peak current for approximately 20% rolloff @ +100 °C 6. Isat3: Peak current for approximately 20% rolloff @ +125 °C 7. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI * 10-3. Bp-p:(Gauss), K: (K-factor from table), L: (Inductance in nH), Symbol I (Peak to peak ripple current in Amps). 8. Part Number Definition: FP1010Rx-Rxxx-R FP1010R= Product code and size x= Version indicator -Rxxx= Inductance value in μH, R= decimal point -R suffix = RoHS compliant Dimensions (mm) Part marking: 1010Rx (x = Version Indicator), Rxxx = Inductance value in uH (R= decimal point) wwllyy = date code, R = revision level Tolerances are ±0.15 millimeters unless stated otherwise All soldering surfaces to be coplanar within 0.1 millimeters PCB tolerances are ±0.1 millimeters unless stated otherwise DCR measured from point “a” to point “b” Do not route traces or vias underneath the inductor

High frequency, high current power inductors www.eaton.com/elx Packaging information (mm) Supplied in tape and reel packaging , 300 parts per 13” diameter reel T emperature rise vs. total loss Temperature Rise ( ) Total Loss (W)

High frequency, high current power inductors www.eaton.com/elx Core loss vs. Bp-p Inductance characteristics 0.001 0.01 0.1 000010001001 Core Loss (W) Bp-p (Gauss) 300 kHz

1 MHz

20% 40% 60% 80% 100% 120% 01 02 03 04 05 06 07 08 09 01 00 1101 20 130 % of OCL IDC (A) FP1010R1-R120-R -40 °C +25 °C +100 °C +125 °C

High frequency, high current power inductors www.eaton.com/elx Inductance characteristics 20% 40% 60% 80% 100% 120% 01 02 03 04 05 06 07 08 09 0 100 % of OCL IDC (A) FP1010R1-R150-R -40 °C +25 °C +100 °C +125 °C 20% 40% 60% 80% 100% 120% 05 10 15 20 25 30 35 40 45 % of OCL IDC (A) FP1010R1-R330-R -40 °C +25 °C +100 °C +125 °C

1000 Eaton Boulevard

Cleveland, OH 44122 United States www.eaton.com/elx © 2016 Eaton All Rights Reserved Printed in USA Publication No. 10531 BU&-MC16039 April 2016 Eaton is a registered trademark. All other trademarks are property of their respective owners. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Technical Data 10531 Effective April 2016 FP1010R High frequency, high current power inductors Temperature t tP ts TC -5°C Time 25°C to Peak Time 25°C Tsmin Tsmax TL TP Preheat A Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Solder reflow profile Reference JDEC J-STD-020D Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak • Temperature min. (Tsmin) 100°C 150°C

  • Temperature max. (Tsmax) 150°C 200°C
  • Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds Average ramp up rate Tsmax to Tp 3°C/ Second Max. 3°C/ Second Max. Liquidous temperature (Tl) Time at liquidous (tL) 183°C 60-150 Seconds 217°C 60-150 Seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp) within 5 °C of the specified classification temperature (T c) 20 Seconds 30 Seconds** Average ramp-down rate (Tp to Tsmax) 6°C/ Second Max. 6°C/ Second Max. Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Table 1 - Standard SnPb Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 ≥350 ≥2.5mm 220°C 220°C Table 2 - Lead (Pb) Free Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 350 - 2000 Volume mm3 >2000 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C